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Epoxy Compounds for Immobilizing Radioactive Wastes
Atomic Energy, 2005The radiation resistance of epoxy compounds, solidified by crystalline hardening agents - metaphenyl-enediamine and phthalic anhydride - is investigated. It is shown that under conditions of γ irradiation (E = 1.33 MeV) the temperature of vitrification of the compounds depends on the dose (doses up to 1500 Mrad were investigated) and temperature 20–160°
Ya. I. Shtrombakh +5 more
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Ablation resistance of certain epoxy compounds
Polymer Mechanics, 1972The rate of ablation in oxidative and inert media at flow velocities up to 200 m/sec has been investigated for certain epoxy compounds containing powdered copper and zinc dust. The causes of ablative destruction and the factors tending to improve the ablation resistance are examined.
A. N. Machyulis, L. P. Zhilinskaite
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Thermophysical analysis of plasticized epoxy compounds
Journal of Engineering Physics, 1973A study has been made concerning the effect of dibutylphthalate and thiocol plasticizers in various concentrations on the structure as well as the thermophysical and the mechanical properties of grade ED-5 epoxy resin. It is shown that the entire complex of analyzed thermophysical properties changes appreciably, depending on the kind and on the ...
Yu. N. Krasnobokii, V. P. Dushchenko
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Some experiences with epoxy resin grouting compounds
American Industrial Hygiene Association Journal, 1980Epoxy resin systems are used in tiling and grouting in the construction industry. Because of the nature of the application, skin contact is the primary hazard. The most prevalent reaction was reddening of the forearms, followed by whole body reddening and loss of appetite, these latter two being associated with smoking while applying the resin.
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Adhesive Compound, Epoxy Room Temperature Curing
2017<div class="section abstract"> <div class="htmlview paragraph">This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.</div></div>
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Silane oligomer in epoxy molding compound
2018 China Semiconductor Technology International Conference (CSTIC), 2018With the rapid development of semiconductor packages, the reliability requirement of the epoxy molding compound as the packaging material becomes more and more rigorous. Introducing adhesion prompter is one of the key methods to increase the reliability of epoxy molding compound, and silane coupling agent with different functional group was one of the ...
Hongjie Liu +6 more
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Acta dermato-venereologica. Supplementum, 1992
Of a total of 3731 patients investigated between 1974 and 1990, 1844 (49.4%) had an occupational skin disease. Of them 142 (7.7%) had an occupational skin disease caused by epoxy compounds--135 patients (95%) had allergic contact dermatitis, five had irritant contact dermatitis, and two had contact urticaria. Apart from dermatoses, two patients had IgE-
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Of a total of 3731 patients investigated between 1974 and 1990, 1844 (49.4%) had an occupational skin disease. Of them 142 (7.7%) had an occupational skin disease caused by epoxy compounds--135 patients (95%) had allergic contact dermatitis, five had irritant contact dermatitis, and two had contact urticaria. Apart from dermatoses, two patients had IgE-
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Aliphatic-Cycloaliphatic Epoxy Compounds and Polymers
2007Aliphatic-cycloaliphatic epoxy compounds (ACECs) contain different epoxy groups in the molecule: glycidyl, i.e. 2,3-epoxypropyl groups, and cycloaliphatic, i.e. 1,2-epoxycyclopen-tane or 1,2-epoxycyclohexane rings. The epoxidation of double bonds in cycloolefins was carried out using aqueous peracetic acid (PAA).
Anatoli E. Batog +2 more
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Toughness and its mechanisms in epoxy resins
Progress in Materials Science, 2022Yu Jiang, Daohong Zhang
exaly