Results 271 to 280 of about 3,889,198 (331)

Epoxy resins possessing flame retardant elements from silicon incorporated epoxy compounds cured with phosphorus or nitrogen containing curing agents

Polymer, 2002
Ying-Ling Liu
exaly   +2 more sources

Oxidation characteristics of commercial copper-based lead frame surface and the bonding with epoxy molding compounds

Microelectronics and reliability, 2019
This study investigates surface oxidized layers of Cu-Fe-Zn-P (C194) and Cu-Ni-Si-Mg (C7025) lead frames under different oxidation conditions and their influence on the adhesion of epoxy molding compounds with lead frames.
Shi Chao, Wei-Chen Huang, Jen-Hsiang Liu, Jenn-Ming Song, Po-Yen Shen, Chi-Lin Huang, Lung-Tang Hung, Chin-Huang Chang   +7 more
semanticscholar   +1 more source

A Coarse-Grained Model for Epoxy Molding Compound

The Journal of Physical Chemistry B, 2014
We present a coarse-grained model for molecular dynamics simulations of an epoxy system composed of epoxy phenol novolac as epoxy monomer and bisphenol-A as the cross-linking agent. The epoxy and hardener molecules are represented as short chains of connected beads, and cross-linking is accomplished by introducing bonds between reactive beads.
Shaorui, Yang, Zhiwei, Cui, Jianmin, Qu
openaire   +2 more sources

Self‐curing epoxy compounds

Journal of Applied Polymer Science, 1990
AbstractA new series including eight structurally different self‐curing epoxy compounds bearing azomethine linkages were synthesized, characterized and polymerized. 4‐(2,3‐Epoxypropoxy)‐benzaldehyde (EPB) or 2,3‐epoxypropyl glyoxylate monohydrate (EPG), prepared by reacting 4‐hydroxybenzaldehyde or glyoxylic acid monohydrate, respectively, with excess ...
openaire   +1 more source

Reinforcement of epoxy compounds with fillers

Polymer Mechanics, 1972
The mechanical and physicochemical properties of epoxy compounds containing different amounts of a series of fillers have been investigated. The strength characteristics of compounds with reinforcing fillers improve, starting from very low concentrations, pass through a maximum, and then fall at large concentrations.
I. A. Uskov, Yu. G. Tarasenko, V. V. Nizhnik   +2 more
openaire   +1 more source

Fixation of Various Porcine Arteries with an Epoxy Compound

Artificial Organs, 1997
Abstract: The clinical results of biological vascular grafts have been unsatisfactory. The poor results of these vascular grafts may be attributed to the fixatives, aldehydes, used in fixing tissues. In an attempt to overcome this problem, a new fixative, epoxy compound, has recently been used to fix biological vascular grafts.
H W, Sung, C S, Hsu, H C, Chen, H L, Hsu, Y, Chang, J H, Lu, P C, Yang   +6 more
openaire   +2 more sources

Epoxy Compounds for Immobilizing Radioactive Wastes

Atomic Energy, 2005
The radiation resistance of epoxy compounds, solidified by crystalline hardening agents - metaphenyl-enediamine and phthalic anhydride - is investigated. It is shown that under conditions of γ irradiation (E = 1.33 MeV) the temperature of vitrification of the compounds depends on the dose (doses up to 1500 Mrad were investigated) and temperature 20–160°
Ya. I. Shtrombakh, P. A. Platonov, N. S. Lobanov, O. K. Chugunov, V. P. Aleksandrov, O. A. Zinov’ev   +5 more
openaire   +1 more source

Chemical structure construction of DOPO-containing compounds for flame retardancy of epoxy resin: A review

Progress in Organic Coatings, 2023
Yunxian Yang, De‐yi Wang, Rong‐Kun Jian, Zhiqi Liu, Guang-Ying Huang   +4 more
semanticscholar   +1 more source

Epoxy molding compound for fingerprint sensor

2016 International Conference on Electronics Packaging (ICEP), 2016
The fingerprint sensor is promising as a personal identification method for the devices. For downsizing and the cost reduction of the fingerprint sensor, capacitance method is main stream for the portable devices such as Smartphone's. Conventionally, expensive sapphire glass has been used as insulating layer of fingerprint sensor, but sapphire glass is
Junichi Tabei, Hideaki Sasajima, Takeshi Mori   +2 more
openaire   +1 more source

Ablation resistance of certain epoxy compounds

Polymer Mechanics, 1972
The rate of ablation in oxidative and inert media at flow velocities up to 200 m/sec has been investigated for certain epoxy compounds containing powdered copper and zinc dust. The causes of ablative destruction and the factors tending to improve the ablation resistance are examined.
A. N. Machyulis, L. P. Zhilinskaite
openaire   +1 more source