Results 111 to 120 of about 529,742 (380)

Microstructural Evolution and Mechanical Properties of a Medium‐Manganese Steel Manufactured by Laser‐Based Powder Bed Fusion of Metals

open access: yesAdvanced Engineering Materials, EarlyView.
Fe–12Mn–0.2C medium‐manganese steel is processed by laser‐based powder bed fusion of metals using blended as well as pre‐alloyed powder. Various scanning speeds are used to determine the influence of energy deposition rate on microstructure and mechanical properties.
Leoni Hübner   +4 more
wiley   +1 more source

The solution for removing tin metalloresist from the surface of PCBs copper conductors

open access: yesЖурнал Белорусского государственного университета: Химия, 2019
This paper compares velocities of tin and copper etching in solution of different compositions. We identified optimal concentration of based components – nitric acid (4.5 mol / L) and Fe(III) ions (0.18 mol / L).
Larysa I. Stepanova   +2 more
doaj  

DNA Strand Patterns on Aluminium Thin Films

open access: yesSensors, 2011
A new patterning method using Deoxyribose Nucleic Acid (DNA) strands capable of producing nanogaps of less than 100 nm is proposed and investigated in this work.
Fatemeh Shahhosseini   +5 more
doaj   +1 more source

Nanostructuring lithium niobate substrates by focused ion beam milling

open access: yes, 2005
We report on two novel ways for patterning Lithium Niobate (LN) at submicronic scale by means of focused ion beam (FIB) bombardment. The first method consists of direct FIB milling on LiNbO3 and the second one is a combination of FIB milling on a ...
A. Sabac   +11 more
core   +3 more sources

Anisotropic diamond etching through thermochemical reaction between Ni and diamond in high-temperature water vapour

open access: yesScientific Reports, 2018
Diamond possesses excellent physical and electronic properties, and thus various applications that use diamond are under development. Additionally, the control of diamond geometry by etching technique is essential for such applications.
M. Nagai   +8 more
semanticscholar   +1 more source

Additive Processing of Ti‐17 by Wire Arc Directed Energy Deposition: An Investigation of the Microstructure and Mechanical Properties

open access: yesAdvanced Engineering Materials, EarlyView.
This study focuses on processing the titanium alloy Ti‐17 using wire arc directed energy deposition (waDED), with an emphasis on the microstructure and mechanical properties. The waDED typical heat‐affected zone banding is characterized and related to the local mechanical properties.
Alexander Wenda   +7 more
wiley   +1 more source

Graphene removal by water-assisted focused electron-beam-induced etching – unveiling the dose and dwell time impact on the etch profile and topographical changes in SiO2 substrates

open access: yesBeilstein Journal of Nanotechnology
Graphene is one of the most extensively studied 2D materials, exhibiting extraordinary mechanical and electronic properties. Although many years have passed since its discovery, manipulating single graphene layers is still challenging using standard ...
Aleksandra Szkudlarek   +7 more
doaj   +1 more source

Fabrication of Pyramid Structure Substrate Utilized for Epitaxial Growth Free-Standing GaN

open access: yesCrystals, 2019
Metal−organic chemical vapor deposition (MOCVD)-grown GaN on sapphire substrate was etched by hot phosphoric acids. Pyramid structures were obtained in the N-polar face of the MOCVD−GaN.
Ruixian Yu   +7 more
doaj   +1 more source

Selective Laser-Induced Etching of 3D Precision Quartz Glass Components for Microfluidic Applications—Up-Scaling of Complexity and Speed

open access: yesMicromachines, 2017
By modification of glasses with ultrafast laser radiation and subsequent wet-chemical etching (here named SLE = selective laser-induced etching), precise 3D structures have been produced, especially in quartz glass (fused silica), for more than a decade.
J. Gottmann   +3 more
semanticscholar   +1 more source

The Structural Refinement of Commercial‐Purity Copper Processed by Equal Channel Angular Pressing with Low Strain Amplitude

open access: yesAdvanced Engineering Materials, EarlyView.
Equal channel angular pressing of commercial pure copper under low strain amplitude (≈0.48) induces concurrent continuous and localized discontinuous dynamic recrystallization, forming a duplex structure influenced by strain heterogeneity and recovery. Moderate hardening after 4–12 passes results from progressive high‐angle grain boundary formation via
Paula Cibely Alves Flausino   +6 more
wiley   +1 more source

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