Results 61 to 70 of about 332,589 (274)
Effect of Laser Deoxidation on Adhesive‐Bonded Aluminum in an Oxygen‐Free Atmosphere
Advanced Engineering Materials, EarlyView.This study investigates laser ablation of aluminum under oxygen‐free conditions. The goal is to produce oxide‐free substrates that enable improved adhesive bonding with epoxy. Optimized laser parameters (90% overlap, 300 µJ) combined with oxide‐free substrates result in the highest tensile strength of the adhesive bond.
Sandra Gerland +5 more
wiley +1 more source
Influence of an Oxygen‐Free Atmosphere on Diamond‐Single‐Grain Scratching of Ti–6Al–4V
Advanced Engineering Materials, EarlyView.Single‐grain scratching of Ti–6Al–4V is investigated under controlled, oxygen‐free, and ambient atmospheres using a novel experimental setup with in situ high‐speed imaging. The approach enables direct observation of chip formation and adhesion under suppressed oxidation.
Berend Denkena +2 more
wiley +1 more source
Improved photoetching fabrication method [PDF]
, 1972 Photoetching method producing well-defined lines with minimum undercutting was developed for etching coolant passages in nickel sheet. Phosphate coating is applied over conventional silver plate maskant and phosphoric acid solution is used to remove ...
Kistler, C. L.
core +1 more source
Advanced Engineering Materials, EarlyView.This study investigates laser‐based oxide removal of Cu inserts in oxygen‐free conditions and examines long‐term oxidation kinetics and surface chemistry under different atmospheres via X‐ray photoelectron spectroscopy. Al–Cu compound casting with differently oxidized surfaces is performed, and intermetallic phase formation, morphology, and thermal ...
Timon Steinhoff +9 more
wiley +1 more source
Low‐Angle Grain Boundaries and Re‐Segregation in Single‐Crystalline Ni‐Base Superalloys
Advanced Engineering Materials, EarlyView.This work demonstrates that Re‐segregation at low‐angle grain boundaries (LAGBs) in Ni‐base superalloys is influenced by misorientation angle. Advanced microscopy and atom probe tomography reveal that higher misorientation angles increases Re‐segregation.
Alireza B. Parsa +9 more
wiley +1 more source
Metal mask free dry-etching process for integrated optical devices applying highly photostabilized resist. [PDF]
, 2006 Photostabilization is a widely used post lithographic resist treatment process, which allows to harden the resist profile in order to maintain critical dimensions and to increase selectivity in subsequent process steps such as reactive ion etching.
Driessen, A. +3 more
core +1 more source
Re-entrant Layer-by-Layer Etching of GaAs(001)
, 1995 We report the first observation of re-entrant layer-by-layer etching based on {\it in situ\/} reflection high-energy electron-diffraction measurements. With AsBr$_3$ used to etch GaAs(001), sustained specular-beam intensity oscillations are seen at high ...
B. A. Joyce +25 more
core +1 more source
Restoration of stamp marks on steel components [PDF]
, 2008 Stamp marks are used as a unique identification for a range of items, but these can be erased for criminal activities. Erased marks can sometimes be recovered by etching or magnetic means.
Matthew, Jennifer, Wightman, Graham
core +3 more sources
Phase Field Failure Modeling: Brittle‐Ductile Dual‐Phase Microstructures under Compressive Loading
Advanced Engineering Materials, EarlyView.The approach by Amor and the approach by Miehe and Zhang for asymmetric damage behavior in the phase field method for fracture are compared regarding their fitness for microcrack‐based failure modeling. The comparison is performed for the case of a dual‐phase microstructure with a brittle and a ductile constituent.
Jakob Huber, Jan Torgersen, Ewald Werner
wiley +1 more source
Genesis and Propagation of Fractal Structures During Photoelectrochemical Etching of n-Silicon [PDF]
, 2020 The genesis, propagation, and dimensions of fractal-etch patterns that form anodically on front- or back-illuminated n-Si(100) photoelectrodes in contact with 11.9 M NH₄F(aq) has been investigated during either linear-sweep voltammetry or when the ...
Lewerenz, Hans-Joachim +4 more
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