Results 81 to 90 of about 20,662 (247)

Au–Si plasmonic platforms: synthesis, structure and FDTD simulations

Beilstein Journal of Nanotechnology, 2018
Plasmonic platforms based on Au nanostructures have been successfully synthesized by directional solidification of a eutectic from Au and the substrate. In order to determine homogeneous shape and space distribution, the influence of annealing conditions
Anna Gapska, Marcin Łapiński, Paweł Syty, Wojciech Sadowski, Józef E. Sienkiewicz, Barbara Kościelska   +5 more
doaj   +1 more source

High‐κ Perovskite‐Like Ternary Niobium Oxide Dielectrics for 2D Electronics

Advanced Materials, EarlyView.
High‐κ dielectrics are vital for scaled electronics. Here, a family of 2D high‐κ perovskite‐like ternary niobium oxides is synthesized via a molten salt‐assisted method. Their integration into FETs and logic gates reveals superior switching characteristics, providing a fresh material platform and new insights for the advancement of high‐performance 2D ...
Biao Zhang, Jianmiao Guo, Jianmin Yan, Jialiang Wang, Chao Yun, Guang Zeng, Jie Li, Cong Wang, Zhengdao Xie, Yanglong Hou, Yang Chai   +10 more
wiley   +1 more source

Materials and System Design for Self‐Decision Bioelectronic Systems

Advanced Materials, EarlyView.
This review highlights how self‐decision bioelectronic systems integrate sensing, computation, and therapy into autonomous, closed‐loop platforms that continuously monitor and treat diseases, marking a major step toward intelligent, self‐regulating healthcare technologies.
Qiankun Zeng, Hong Liu, Yongheng Zhang, Youbin Zheng, Xuyin Ding, Mengni Zhu, Guoyue Shi, Yan Wang, Hossam Haick, Min Zhang   +9 more
wiley   +1 more source

Liquids as Reinforcements for Anisotropic and Tough Soft Matter Composites

Advanced Materials, EarlyView.
Liquid metal droplets are shaped and oriented within soft elastomers to create all‐soft matter composites with programmable mechanical anisotropy. These liquid inclusions act as fiber‐like reinforcements, enabling directional stiffness, enhanced toughness, and controlled crack steering under extreme deformation, offering new routes to resilient soft ...
Gwyneth M. Schloer, Ohnyoung Hur, Ravi Tutika, Aaron Haake, Eric J. Markvicka, Michael D. Bartlett   +5 more
wiley   +1 more source

Soft Electromagnetic Actuator and Oscillator

Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
This work presents a groundbreaking soft electromagnetic system capable of bistable actuation and self‐regulated oscillation. Using liquid metal and silicone as a compliant conductor, the actuator enables force generation, sensing, and feedback with minimal power.
Noah D. Kohls, Yi Chen Mazumdar
wiley   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya, Adamos Christou, Sihang Ma, Ravinder Dahiya   +3 more
wiley   +1 more source

From the Discovery of the Giant Magnetocaloric Effect to the Development of High‐Power‐Density Systems

Advanced Materials Technologies, EarlyView.
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz, Yaroslav Mudryk, Jun Cui, Lucas Griffith, Duane D. Johnson, Julie Slaughter   +5 more
wiley   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

Advanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal, Davey Boss, René H. Poelma, Elias Vlieg, John J. Schermer   +4 more
wiley   +1 more source

Roadmap to Precision 3D Printing of Cellulose: Rheology‐Guided Formulation, Fidelity Assessment, and Application Horizons

Advanced Materials Technologies, EarlyView.
This critical review presents a comprehensive roadmap for the precision 3D printing of cellulose. Quantitative correlations link ink formulation and rheological properties to print fidelity and final material performance. This framework guides the development of advanced functional materials, from biomedical scaffolds to electromagnetic shielding ...
Majed Amini, Hadi Hosseini, Seyyed Alireza Hashemi, Mohammad Arjmand   +3 more
wiley   +1 more source

A Eutectic Mixture of Calcium Chloride Hexahydrate and Bischofite with Promising Performance for Thermochemical Energy Storage

Energies
Thermochemical energy storage using salt hydrates is a promising method for the efficient use of energy. In this study, three host matrices, expanded vermiculite, expanded clay, and expanded natural graphite were impregnated with a eutectic mixture of ...
Bryan Li, Louise Buisson, Ruby-Jean Clark, Svetlana Ushak, Mohammed Farid   +4 more
doaj   +1 more source