Results 211 to 220 of about 34,357 (300)

A Universal Approach to Enhancing Silicon Hot‐Carrier Photodetectors for CMOS‐Compatible SWIR Imaging

open access: yesAdvanced Science, EarlyView.
Silicon hot‐carrier photodetectors offer a CMOS‐compatible pathway for SWIR detection but suffer from intrinsically low quantum efficiency. Here, we introduce a quasi‐generalized antireflection coating (QARC) that universally enhances optical absorption and quantum efficiency, enabling the first CMOS‐compatible SWIR imaging with silicon hot‐carrier ...
Eui‐Hyoun Ryu   +11 more
wiley   +1 more source

Sticky Yet Slippery: Molecular Ordering Reconciles Bubble‐Surface Affinity With Ultralow Friction at the Nanoscale

open access: yesAdvanced Science, EarlyView.
By engineering the molecular order and thickness of PDMS layers, we reconcile the stickiness and slipperiness during bubble transport. AFM measurements and MD simulations further reveal how these nanoscale architectures tune hydrophobic interaction FHB and friction force f.
Shishuang Zhang   +7 more
wiley   +1 more source

Physics‐Constrained Constitutive Learning of Rate‐Limiting Timescales for Efficient Hydrogen‐Based Direct Reduction for Green Steel Making

open access: yesAdvanced Science, EarlyView.
A conversion‐resolved constitutive framework is developed for the hydrogen‐based direct reduction of iron oxide pellets. Effective reaction and transport timescales are inferred directly from measured trajectories and mapped against operating conditions, pellet architecture, and composition. The analysis reveals how late‐stage transport control emerges
Anurag Bajpai   +3 more
wiley   +1 more source

Close Space Sublimation Growth of Sb<sub>2</sub>(S,Se)<sub>3</sub> Thin-Film Solar Cells. [PDF]

open access: yesACS Appl Mater Interfaces
Sindi DA   +5 more
europepmc   +1 more source

Progress in Strain Engineering of 2D‐Integrated Heterostructures for Ultrasensitive Sensors

open access: yesAdvanced Science, EarlyView.
 . ABSTRACT Two‐dimensional (2D) integrated heterostructures have emerged as a cornerstone in the advancement of next‐generation sensor technologies. These heterostructures, which combine materials with different dimensionalities, have led to significant breakthroughs in sensing performance and device integration.
That Buu Ton   +4 more
wiley   +1 more source

Improved Direct Ink Writing of Liquid Metal Foams via Liquid Additives

open access: yesAdvanced Electronic Materials, EarlyView.
The ability to pattern liquid metal is useful for making soft electrical and thermal devices. Dispensing liquid metal from a nozzle naturally results in the formation of spheroidal droplets, making direct‐write printing challenging. Liquid metal foams containing pockets of air can extrude as filaments, albeit inconsistently.
Febby Krisnadi   +3 more
wiley   +1 more source

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