Results 91 to 100 of about 804,341 (325)
A hierarchical structure for automatic meshing and adaptive FEM analysis [PDF]
Ajay Kela+2 more
openalex +1 more source
High Aspect Ratio, Superconducting Vacuum Gap Capacitor NEMS with Plate Distances Down to 32 nm
Fabrication of aluminium vacuum gap capacitor based NEMS is investigated with a free to move top electrode. To avoid collapse of the top electrode vertical stress gradient is controlled through sputter parameters. The result is wafer‐level high‐yield fabrication of vacuum gap capacitors with radii between 7 µm and 30 µm and integrated piezoactuators. A
Ioan Ignat, Daniel Platz, Ulrich Schmid
wiley +1 more source
Silicon‐Integrated Next‐Generation Plasmonic Devices for Energy‐Efficient Semiconductor Applications
Silicon (Si)‐integrated plasmonics offer a pathway to next‐generation, energy‐efficient semiconductor applications. This review highlights advances using complementary metal–oxide–semiconductor (CMOS)‐compatible materials like transparent conductive oxides and novel architectures, particularly coupled hybrid plasmonic waveguides (CHPWs).
Nasir Alfaraj, Amr S. Helmy
wiley +1 more source
New theoretical model for vertical contact and separation mode triboelectric nanogenerator is proposed. Detailed derivation process and results are discussed. Numerical solutions and parametric studies are presented. Calculated results are validated by experimental outcomes.
Seokjin Kim+2 more
wiley +1 more source
Enhancing Damage Tolerance of Structures Using 3D/4D Printing Technologies
This review highlights recent advances in damage tolerance for structural design, emphasizing safety, durability, and reliability in fields like aerospace and civil engineering. It covers innovations in materials, 3D/4D printing, predictive design methods, and nature‐inspired strategies.
Morteza Sayah Irani+3 more
wiley +1 more source
Finite element flux‐corrected transport (FEM–FCT) for the euler and Navier–Stokes equations [PDF]
Rainald Löhner+3 more
openalex +1 more source
Compliant Die Attach Process for High‐Conformity Integration of Ultra‐Thin Chips on Curved Surfaces
A compliant die attach process is developed for bonding ultra‐thin silicon dies onto high‐curvature surfaces. Using FEM‐guided tool design and process optimization, the method achieves excellent surface conformity and minimal voids. This approach offers a reliable solution for next‐generation curved electronics, including LiDAR and wide field‐of‐view ...
Hakyung Jeong+9 more
wiley +1 more source
A highly sensitive crack‐based piezoresistive strain sensor is developed using a biaxially pre‐stretched multi‐walled carbon nanotubes/Ecoflex composite and integrated with auxetic metamaterials. Biaxial pre‐stretching improves the sensitivity by 56% compared to the uniaxially pre‐stretched strain sensor.
Jaewon Cho+3 more
wiley +1 more source
For most microscopy measurements the sample is placed on a substrate, which causes symmetry breaking, especially relevant for chiral plasmonic nanostructures. DNA origami mediated X‐shaped AuNR dimers showing high structural purity in solution, exhibit significant diversity in lineshapes and signal intensities for their circular differential scattering
Amrita Chakraborty+9 more
wiley +1 more source
5-fluorouracil, 4-epidoxorubicin, and mitomycin C (FEM) for advanced gastric carcinoma. A phase II trial [PDF]
W. Queißer+11 more
openalex +1 more source