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Femtosecond laser micromachining in combination with ICP etching for 4H–SiC pressure sensor membranes

, 2020
4H–SiC is one of the most promising materials for pressure sensing in harsh environments. A Yb:KGW femtosecond laser was employed to fabricate 4H–SiC sensor membranes with size of Φ1200 × 80 μm.
Lukang Wang   +6 more
semanticscholar   +1 more source

Fabrication of sealed sapphire microfluidic devices using femtosecond laser micromachining.

Applied Optics, 2020
Due to its hardness, strength, and transparency, sapphire is an attractive material for the construction of microfluidic devices intended for high-pressure applications, but its physiochemical properties resist traditional microfabrication and bonding ...
Ahmed Elgohary   +7 more
semanticscholar   +1 more source

Femtosecond laser micromachining of grooves in indium phosphide

Applied Physics A, 2004
Femtosecond laser micromachining of indium phosphide is investigated using 150 fs light pulses at a center wavelength of 800 nm. The ablation rate for micromachining of grooves is investigated as a function of pulse energy, feed rate, number of passes over the same groove, and the light polarization relative to the cutting direction.
A. Borowiec, H.K. Haugen
openaire   +1 more source

Dual‐Wavelength Focusing through Fresnel Zone Plate Fabricated in Lithium Niobate Crystal by Femtosecond Laser Micromachining

Physica Status Solidi (a), 2020
Herein, a simple method is proposed that realizes the dual‐wavelength focusing of second‐harmonic (SH) and fundamental frequency (FF) through amplitude‐type nonlinear Fresnel zone plate (FZP).
B. Zhu   +6 more
semanticscholar   +1 more source

Femtosecond laser micromachining and microfabrication in transparent materials

SPIE Proceedings, 2007
We have realized three-dimensional micromachining and microfabrication in transparent materials with femtosecond laser pulses, including water-assisted drilling by ablation, hologram encoding by microexplosion, waveguide writing by refractive index increase, and nanoline and nanotip polymerization via two-photon absorption.
Yan Li   +4 more
openaire   +1 more source

Femtosecond Laser Micromachining for Volume Optics Fabrication

Conference on Lasers and Electro-Optics/International Quantum Electronics Conference, 2009
A femtosecond laser is used to create a new type of volumetric diffractive optical element. The structured elements are designed to perform diffractive functions including pattern generation, and angular multiplexing.
Tim D. Gerke, Rafael Piestun
openaire   +1 more source

A gasket-type standard leak element using femtosecond laser micromachining

, 2020
A gasket-type standard leak element with a microfluidic channel was developed and measured. The microfluidic channel with a diameter of several micrometers and a length of one hundred micrometers was fabricated by using femtosecond laser micromachining ...
C. Chan   +6 more
semanticscholar   +1 more source

Femtosecond laser micromachining of technical materials

Proceedings of SPIE, 2000
ABSTRACT Micromachining experiments were performed with Ti:sapphire laser pulses (130 fs - 150 fs, 800 nm, -40 Hz) in air. Employing the direct focusing technique, highly absorbing titanium nitride (TiN) and weakly absorbing polyiniide (P1) andpolymethylmethacrylate (PMMA) served as target materials.
openaire   +1 more source

Femtosecond laser gratings micromachining on PDMS plates

2009 Conference on Lasers & Electro Optics & The Pacific Rim Conference on Lasers and Electro-Optics, 2009
We report on the femtosecond laser miscromachining of diffraction gratings on PDMS (polydimethylsiloxane) plate. By scanning the planar PDMS plate, using the optical X-Y-Z stages, the embedded diffraction gratings in PDMS plate was fabricated successfully.
Linwei Zhu   +3 more
openaire   +1 more source

Micromachining of thin glass plates with a femtosecond laser

SPIE Proceedings, 2009
We present a novel method for cutting thin borosilicate glass slides, as well as other results pertaining to laser welding related to an existing technique. Based on the concept of stealth dicing for semiconductor wafers, we have demonstrated that by giving our samples an initial stress and by creating optically induced defects inside the glass, it ...
D. Hélie, R. Vallée
openaire   +1 more source

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