Results 191 to 200 of about 15,116 (231)

Non-antibiotic nanoplatform based CuS/AuNCs@Lip NPs for inhibition pneumonia caused by MRSA and its mechanism exploration. [PDF]

Mater Today Bio
Fan Q, Zhang X, Zhang S, Cao M, Zhang L, Li L, Li W, Zhang G, Hong W, Chen X.   +9 more
europepmc   +1 more source

GlycoRNAs: Biological functions and novel antiviral targets. [PDF]

Virol Sin
Kang Y, Ji JJ, Cao P.
europepmc   +1 more source

A global overview of anatomical science education and its present and future role in biomedical curricula. [PDF]

Anat Sci Educ
Hortsch M, Girão-Carmona VCC, Leite ACRM, Nikas IP, Gatumu MK, Koney NK, Arko-Boham B, Yohannan DG, Oommen AM, Li Y, Yang J, Trollope AF, Meyer AJ, Van Nuland SE.   +13 more
europepmc   +1 more source

Sigmoid Colon Angiomyolipoma as a Culprit for Intermittent Constipation and Hematochezia. [PDF]

ACG Case Rep J
Tabet Aoul A, Achiamah A, Leavitt N, He C, Kandal P, Patel V.   +5 more
europepmc   +1 more source

Adipocyte-Derived <i>CCHamide-1</i>, <i>Eiger</i>, <i>Growth-Blocking Peptide 3</i>, and <i>Unpaired 2</i> Regulate <i>Drosophila melanogaster</i> Oogenesis. [PDF]

Biomolecules
Simmons C, Williams IH, Bradshaw TW, Armstrong AR.   +3 more
europepmc   +1 more source

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Flip chip organic substrate with metal column

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2003
Discusses the issue of stress induced from CTE mismatch between silicon and organic substrate in a flip-chip package. Although the use of underfill has greatly reduced the stress on the solder bump under die by holding the stretched substrate to silicon, the solder joints are still seeing high stress prior to the process.
J.J.D. Lan, J. Chang, P. Lu, K. Chen, null Yu-Po Wang, A.-J.M. Yang   +5 more
openaire   +1 more source

High density organic flip chip package substrate technology

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 2002
High performance logic ICs are rapidly migrating from peripheral bonded package configurations to area array, flip chip configurations. Total die I/O is exploding from
W.G. Petefish, D.B. Noddin, D.A. Hanson, R.E. Gorrell, M.F. Syvester   +4 more
openaire   +1 more source

Adhesion issues in flip-chip on organic modules

IEEE Transactions on Components and Packaging Technologies, 1999
Flip chip attach on organic carriers is a novel electronic packaging assembly method which provides advantages of high input/output (I/O) counts, electrical performance and thermal dissipation. In this structure, the flip chip device is attached to organic laminate with predeposited eutectic solder.
S.K. Tran, D.L. Questad, B.G. Sammakia
openaire   +1 more source

The Flip Side of Flexibility in Organizations

2014
This study points out the flip side of adopting a highly flexible approach in organization aiming at the human resource team where high degree of flexibility does not only impact the organization’s performance but also impinge on an employee’s personal life.
Shalini Verma, Sneh Anand
openaire   +1 more source

Thermally enhanced flip-chip BGA with organic substrate

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 2002
A thermally enhanced Flip-chip BGA package (FC-BGA) with organic substrate has been developed. The package is proud of the high thermal and electrical performance due to the flip-chip interconnections, and the optimized heat spreader attached directly on to the die.
H. Matsushima, S. Baba, Y. Tomita, M. Watanabe, E. Hayashi, Y. Takemoto   +5 more
openaire   +1 more source