Results 131 to 140 of about 1,020,736 (297)

Karl Popper and the Mechanisms of Hydrogen Embrittlement

Advanced Engineering Materials, EarlyView.
Representation of the beginning of loss of ductility rather than embrittlement. Small concentrations of hydrogen in a diffusible form within iron are well‐established to harm the mechanical integrity of steels. There are theories that attempt to explain the pernicious role of hydrogen.
H. K. D. H. Bhadeshia
wiley   +1 more source

High‐Temperature Nanoindentation of Metals: Assessing Thermal Drift, Frame Compliance, and Chemical Composition Effects on the Reported Mechanical Properties

Advanced Engineering Materials, EarlyView.
Do not let thermal drift and instrument artifacts deceive high‐temperature nanoindentation results. We compare classical Oliver–Pharr and automatic image recognition analyses across steels and a Ni alloy to quantify these effects. Accounting for artifacts reveals systematic softening with temperature, while Cr and Ni additions boost resistance ...
Velislava Yonkova, Steffen Brinckmann, Ruth Schwaiger   +2 more
wiley   +1 more source

Anonymous Quantum Safe Construction of Three Party Authentication and Key Agreement Protocol for Mobile Devices

IEEE Access
Once the shared secret key is established, three parties can use it for secure communication using symmetric-key encryption AES (128, 192, 256) algorithms or other cryptographic primitives.
Dharminder Chaudhary, Pradeep Kumar Dadsena, A. Padmavathi, Mohammad Mehedi Hassan, Bader Fahad Alkhamees, Uddeshaya Kumar   +5 more
doaj   +1 more source

Workflow for Design of Experiments‐Based Modeling of Species Transport and Growth Kinetics in GaN Hydride Vapor Phase Epitaxy

Advanced Engineering Materials, EarlyView.
A novel workflow for investigating hydride vapor phase epitaxy for GaN bulk crystal growth is proposed. It combines Design of experiments (DoE) with physical simulations of mass transport and crystal growth kinetics, serving as an intermediate step between DoE and experiments.
J. Tomkovič, G. Lukin, H. Torkashvand, A. Kerschbaum, M. Müller, S. Besendörfer, J. Heitmann, J. Friedrich   +7 more
wiley   +1 more source

From Shear to Sound: Mechanics–Acoustics Mapping of TPMS Lattices

Advanced Engineering Materials, EarlyView.
Triply periodic minimal surface (TPMS) lattices are mapped across mechanical and acoustic performance, revealing that descriptors validated in compression fail under shear. First‐time comparison with trusses included. A transition from porous to resonance‐driven absorption emerges at 25% density.
Lucía Doyle, María Ángeles Navacerrada, Johan Christensen, Carlos González   +3 more
wiley   +1 more source

Forward-Secure Multisignature, Threshold Signature and Blind Signature Schemes

, 2014
—Forward-secure signatures are proposed to tackle the key exposure problem, in which the security of all signatures prior to key leakage is still kept even if the secret key leaks.
Jia Yu, Guowen Li, Rong Hao, Yangkui Chen, Xuliang Li, Xiangguo Cheng, Fanyu Kong   +6 more
core  

Designing Polymer Nanocomposites for X‐Ray Shielding: Mechanisms, Architectures, and Scalable Processing

Advanced Engineering Materials, EarlyView.
This review highlights advances in lightweight, lead‐free polymer nanocomposites for diagnostic X‐ray shielding. By linking filler chemistry, dispersion, architecture, and photon interaction mechanisms, it establishes structure–performance relationships guiding material design.
Aklilu G. Messele, Hossein Ipakchi, Tizazu H. Mekonnen   +2 more
wiley   +1 more source

Quantum-Resistant Forward-Secure Digital Signature Scheme Based on q-ary Lattices

Journal of Telecommunications and Information Technology
In this paper, we design and consider a new digital signature scheme with an evolving secret key, using random q-ary lattices as its domain. It is proved that, in addition to offering classic eu-cma security, the scheme is existentially forward ...
Mariusz Jurkiewicz
doaj   +1 more source

On Constructing Dynamic and Forward Secure Authenticated Group Key Agreement Scheme from Multikey Encapsulation Mechanism. [PDF]

ScientificWorldJournal, 2015
Fathirad I, Devlin J.
europepmc   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source