Results 141 to 150 of about 1,941,719 (257)

Discrepancies Between Micro Versus Macroscale Viscoelastic Properties in a Microplastic‐Tissue Composite Model

Advanced Engineering Materials, EarlyView.
This study explores the discrepancies between bulk mechanics and spatial mapping in a tissue‐mimetic hydrogel model. Microplastic particles create localized stiff mechanical microenvironments that are detectable by cellular‐scale nanoindentation but leave bulk properties unchanged as measured by rheology.
Ahron T. Verschleisser, Baptiste Le Roi, Omri Leshem, Joshua M. Grolman   +3 more
wiley   +1 more source

Calcium Hydroxide Combined with Bioactive Glasses: Physicochemical, Antimicrobial and Bond Strength Evaluation. [PDF]

Braz Dent J
Pontes LB, Rissato GD, Rosim PLB, Santos-Junior AO, Souza MT, Zanotto ED, Tanomaru-Filho M, Guerreiro-Tanomaru JM.   +7 more
europepmc   +1 more source

Entropy‐Driven Design of Low‐Melting‐Point Alloys via Compositionally Complex Strategy

Advanced Engineering Materials, EarlyView.
Conventional low‐melting‐point alloys (LMPAs) are limited by a narrow compositional space and inherent property trade‐offs. This review presents an entropy‐driven design strategy that overcomes these limitations, ushering in a new class of low‐melting‐point compositionally complex alloys (LMCCAs).
Yinghui Shang, Jianxiang Zhao, Zhaoqi Chen, Hao Gong, Yinsen Yan, Junlei Tao, Yong Yang   +6 more
wiley   +1 more source

Ultrasonic metamaterial at MHz frequencies using microstructured glass. [PDF]

Sci Adv
Demeulenaere O, Ustimenko N, Athanassiadis AG, Gulati L, Rockstuhl C, Fischer P.   +5 more
europepmc   +1 more source

Fabrication Routes for Ionic Conducting Fiber Strain Sensors

Advanced Engineering Materials, EarlyView.
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw, Zhanhong Yang, Anne Ladegaard Skov, Magdalena Skowyra   +3 more
wiley   +1 more source

Rapidly Solidified High‐Strength Invar 36 Prepared by Planar‐Flow Melt Spinning

Advanced Engineering Materials, EarlyView.
The Invar 36 alloy was rapidly solidified using the planar‐flow melt‐spinning technique. Ribbon samples with thicknesses ranging from 20 to 160 mm were produced. As the grain size of the ribbon decreased to sub‐micron levels, the hardness increased by more than 2 times.
Bekir Akgül, Mehmet Kul
wiley   +1 more source

Feasibility and Limitations of the Advanced Replica Process for Bioactive Glasses

Advanced Engineering Materials, EarlyView.
Periodic 3D‐printed Kelvin‐cell templates enable a controlled advanced replica process for fabricating highly porous glass lattices. Across P45K9, 45S5, and 13–93, material‐dependent differences in coating, burnout, and shrinkage lead to distinct strut morphologies, while comparable final porosities of 83%–88% are retained.
Swantje Funk, Elisabeth Keck, Alberto López‐Grande, Delia S. Brauer, Tobias Fey   +4 more
wiley   +1 more source

Glass breaks : from nickel sulfide inclusions

, 2006
Interest in nickel sulfide inclusions in glass dates to the 1960s. In recent years theoretical studies onthe phase changes in nickel sulfide from a combination of thermal analyses, x-ray powder diffraction and Raman spectroscopy using reagent-grade ...
Ray, AS, Jacob, L
core  

Electronic Structures of CaSiO3 Glass under Megabar Pressures: Ca L2,3-Edge and O K-Edge X-ray Raman Scattering. [PDF]

J Phys Chem Lett
Yi YS, Kim YH, Li S, Parq JH, Lee J, Xiao Y, Chow P, Shen G, Lee SK.   +8 more
europepmc   +1 more source

Enhancement of the Through‐Thickness Electrical Conductivity of Carbon‐Fiber‐Reinforced Plastics Using Large Graphite Particles

Advanced Engineering Materials, EarlyView.
To enhance through‐thickness conductivity without sacrificing impregnation, large spherical graphite particles are intentionally employed in a low‐viscosity resin. Unlike finer conductive fillers, these particles remain outside the fiber bundles and accumulate in resin‐rich interlaminar regions during molding.
Keito Hosoe, Yu Zhou, Shintaro Kamiyama, Takao Okada, Tomohiro Yokozeki, Ryoma Tokonami, Tatsuhiro Takahashi   +6 more
wiley   +1 more source