Results 91 to 100 of about 419,752 (350)
Development of the FE In-House Procedure for Creep Damage Simulation at Grain Boundary Level
A two-dimensional (2D) finite element framework for creep damage simulation at the grain boundary level was developed and reported. The rationale for the paper was that creep damage, particularly creep rupture, for most high temperature alloys is due to ...
Qiang Xu, Jiada Tu, Zhongyu Lu
doaj +1 more source
Ordering kinetics of stripe patterns
We study domain coarsening of two dimensional stripe patterns by numerically solving the Swift-Hohenberg model of Rayleigh-Benard convection. Near the bifurcation threshold, the evolution of disordered configurations is dominated by grain boundary motion
A. Bray +22 more
core +1 more source
Investigation of slip transfer across HCP grain boundaries with application to cold dwell facet fatigue [PDF]
This paper addresses the role of grain boundary slip transfer and thermally-activated discrete dislocation plasticity in the redistribution of grain boundary stresses during cold dwell fatigue in titanium alloys.
Balint, D, Dunne, F, Zheng, Z
core +2 more sources
A new experimental setup, incorporating digital image correlation and infrared thermography in combination with inductive‐conductive heating for precise temperature control, is used to analyze the mechanical behavior and microstructural changes of sheet metal under complex thermomechanical test conditions that represent quench and partitioning ...
Christian Illgen +4 more
wiley +1 more source
Development of Aluminum Scandium Alloys for Hydrogen Storage Valves
Different aluminum alloy series and various aluminum‐scandium alloys with differing Sc and Zr levels are evaluated for use in hydrogen storage valve production. The alloys undergo hardness testing, optical microscopy, and tensile strength analysis, with hardening behavior studied under varying conditions.
Francisco García‐Moreno +4 more
wiley +1 more source
The diffusion process of hydrogen and helium in plasma-facing material depends on the grain boundary structures. Whether a grain boundary accelerates or limits the diffusion speed of these impurity atoms is not well understood.
Atsushi M. Ito +3 more
doaj +1 more source
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan +5 more
wiley +1 more source
Kinetics of Grain Boundary Networks Controlled by Triple Junction and Grain Boundary Mobility
The kinetics of a triple junction of grain boundaries with distinct specific energies and mobilities and a finite mobility of the triple junction is investigated.
Ernst Gamsjäger +2 more
doaj +1 more source
High‐Temperature Oxidation of the CrFeNi Medium‐Entropy Alloy
The oxidation behavior of equiatomic CrFeNi MEA is a key issue that determines this material's suitability for high‐temperature application. The understanding of long‐term behavior is even more crucial than short‐term corrosion effects. The alloy is exposed to synthetic air at 1000, 1050, and 1100 °C for 24, 100, and 1000 h and systematically compared ...
Anna Maria Manzoni +5 more
wiley +1 more source
Effects of helium and vacancy in Ni symmetric tilt grain boundaries by first-principles
The vacancy and helium effects on eight low-Σ symmetric tilt grain boundaries (STGBs) of Ni were investigated by first-principles calculations. The simulations demonstrate that vacancies in Ni matrix could diffuse easily to the grain boundary and helium ...
Yiren Wang +4 more
doaj +1 more source

