Results 81 to 90 of about 44,329 (267)
A study on grain boundary barrier layer solid aluminum capacitors
Open CeramicsThis study employs solid-state and chemical plating methods to fabricate aluminum grain boundary capacitors using Al@CuO composite materials. The materials were prepared under varying compaction pressures (200 psi, 500 psi, and 700 psi) and thermal ...
Wen Hsi Lee, C.R. Kuo, Hong En Chen
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Advanced Engineering Materials, EarlyView.Binder‐free laser powder bed fusion of 8YSZ with a femtosecond laser is used to map process windows linking scan strategy, heat accumulation, and grain growth. Time‐resolved thermography and simulations reveal thermal regimes that enable continuous, vitrified, and fine‐grained 8YSZ surface layers without absorptive additives and demonstrate ...
Markus Kühn +5 more
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Advanced Engineering Materials, EarlyView.CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz +4 more
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Advanced Engineering Materials, EarlyView.This study examines Invar composites reinforced with titanium carbide (TiC) and titanium nitride (TiN) using laser powder bed fusion (LPBF). It presents the influence of reinforcements on microstructure, tensile properties, and thermal expansion. Results show that TiC effectively strengthens Invar while maintaining low thermal expansion, whereas TiN ...
Ayodeji Nathaniel Oyedeji +3 more
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Rapidly Solidified High‐Strength Invar 36 Prepared by Planar‐Flow Melt Spinning
Advanced Engineering Materials, EarlyView.The Invar 36 alloy was rapidly solidified using the planar‐flow melt‐spinning technique. Ribbon samples with thicknesses ranging from 20 to 160 mm were produced. As the grain size of the ribbon decreased to sub‐micron levels, the hardness increased by more than 2 times.
Bekir Akgül, Mehmet Kul
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Advanced Engineering Materials, EarlyView.Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová +6 more
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Advanced Engineering Materials, EarlyView.HEA interlayers offer a versatile route for joining high‐performance structural materials. Their compositional and structural design regulates interfacial reactions, suppresses brittle IMCs, and improves metallurgical bonding. Sandwich interlayers further integrate defect healing with precipitation strengthening, enabling improved strength–ductility ...
Lin Yuan +4 more
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Computed entropy spectra for grain boundary segregation in polycrystals
npj Computational MaterialsGrain boundary solute segregation influences most bulk material properties, and understanding solute thermodynamics at grain boundaries is critical for engineering them.
Nutth Tuchinda, Christopher A. Schuh
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Local mobility variations along recrystallization boundaries
Materials & DesignUnderstanding recrystallization boundary migration mechanisms is crucial for materials design. However, the lack of comprehensive mobility data for high-angle grain boundaries in typical polycrystalline samples has impeded gaining insights into the ...
Jin Zhang, Yubin Zhang
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AIP Advances, 2018 In this study, we simulated the effects of the anisotropy field (Hk) dispersion of the grains (the main phases and the deterioration layers) for a NdFeB magnetic powder on Hc and squareness ratio in consideration of the magnetic properties of the grain ...
Fumiko Akagi, Yoshitake Ishii
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