Results 101 to 110 of about 405,384 (300)

Soft nanostructuring of YBCO Josephson Junctions by phase separation

, 2010
We have developed a new method to fabricate biepitaxial YBa2Cu3O(7-x) (YBCO) Josephson junctions at the nanoscale, allowing junctions widths down to 100 nm and simultaneously avoiding the typical damage in grain boundary interfaces due to conventional ...
Bauch, Thilo, Gustafsson, David, Iandolo, Beniamino, Lombardi, Floriana, Olsson, Eva, Pettersson, Henrik   +5 more
core   +1 more source

Special Grain Boundaries in Ultrafine-Grained Tungsten

Nanoscale Research Letters, 2016
Field ion microscopy and computer simulation were used for the study of an atomic structure high-angle grain boundary in hard-drawn ultrafine-grained tungsten wire. These boundaries with special misorientations are beyond the scope of the coincident site lattice model.
Dudka, O. V., Ksenofontov, V. A., Sadanov, E. V., Starchenko, I. V., Mazilova, T. I., Mikhailovskij, I. M.   +5 more
openaire   +2 more sources

Powder Optimization Strategies for Binder Jetting Printing of BaTiO3 and Ba0,6Sr0,4TiO3 Ceramics

Advanced Engineering Materials, EarlyView.
Powder optimization is investigated to enable binder jetting of BaTiO3 and Ba0.6Sr0.4TiO3 ferroelectric ceramics. The antagonistic relationship between flowability and binder compatibility is addressed through binder impregnation of granulated powders and fumed silica addition to fine powders.
Fanny Pruvost, Lionel Presmanes, Soléna Colin, Marie Vidal, Sophie Guillemet‐Fritsch   +4 more
wiley   +1 more source

What limits supercurrents in high temperature superconductors? A microscopic model of cuprate grain boundaries

, 2009
The interface properties of high-temperature cuprate superconductors have been of interest for many years, and play an essential role in Josephson junctions, superconducting cables, and microwave electronics.
A Gurevich, B. M. Andersen, BM Andersen, BM Andersen, C-R Hu, D Dimos, FC Zhang, G Hammerl, H Hilgenkamp, ID Brown, J. Mannhart, JC Slater, JK Freericks, M Sigrist, M Sigrist, O Chmaissem, P Chaudhari, P Liu, P. J. Hirschfeld, R. Gutser, RC Baetzold, S Lee, S. Graser, SJ Pennycook, SR Phillpot, SV Stolbov, T Löfwander, T Yokoyama, T. Kopp, WA Harrison, X Zhang, Y Tanaka, Y Tanaka, Y Tanaka, YuS Barash   +34 more
core   +1 more source

Influence of an Oxygen‐Free Atmosphere on Diamond‐Single‐Grain Scratching of Ti–6Al–4V

Advanced Engineering Materials, EarlyView.
Single‐grain scratching of Ti–6Al–4V is investigated under controlled, oxygen‐free, and ambient atmospheres using a novel experimental setup with in situ high‐speed imaging. The approach enables direct observation of chip formation and adhesion under suppressed oxidation.
Berend Denkena, Benjamin Bergmann, Michael Zenger   +2 more
wiley   +1 more source

Al–Cu Composite Casting of Laser‐Deoxidized Copper: Bonding, Interfacial Chemistry, and Thermal Conductivity

Advanced Engineering Materials, EarlyView.
This study investigates laser‐based oxide removal of Cu inserts in oxygen‐free conditions and examines long‐term oxidation kinetics and surface chemistry under different atmospheres via X‐ray photoelectron spectroscopy. Al–Cu compound casting with differently oxidized surfaces is performed, and intermetallic phase formation, morphology, and thermal ...
Timon Steinhoff, Finn‐Lennard Janthur, Sascha Zimmermann, Sarah Seffer, Jörg Hermsdorf, René Gustus, Ludger Overmeyer, Wolfgang Maus‐Friedrichs, Hans Jürgen Maier, Christian Klose   +9 more
wiley   +1 more source

Numerical Simulation of Grain Boundary Grooving By Level Set Method

, 2000
A numerical investigation of grain-boundary grooving by means of a Level Set method is carried out. An idealized polygranular interconnect which consists of grains separated by parallel grain boundaries aligned normal to the average orientation of the ...
A. Averbuch, Adalsteinsson, Averbuch, Blech, Blech, Bower, Chopp, Chorin, Genin, Glickman, Hackney, Hu, Khenner, Klinger, Klinger, Li, M. Israeli, M. Khenner, M. Nathan, Malladi, Mullins, Mullins, Nathan, Noh, Ohring, Osher, Osher, Peng, Rosenberg, Sethian, Sethian, Sethian, Shu, Sussman, Yost, Zhao   +35 more
core   +1 more source

Assessing Altered Coating Adhesion on Plasma‐Deoxidized Surfaces Under Oxygen‐Free Conditions

Advanced Engineering Materials, EarlyView.
This study demonstrates the effectiveness of atmospheric pressure plasma pretreatment in modifying silicon and stainless steel surfaces to improve adhesion. Argon‐hydrogen plasma increases surface roughness and improves adhesion strength, whereas pure argon results in smoother surfaces and structural changes.
Selina Raumel, Lara Kuhr, Khemais Barienti, Sebastian Herbst, Florian Nürnberger, Hans Jürgen Maier, Marc C. Wurz   +6 more
wiley   +1 more source

A study on grain boundary barrier layer solid aluminum capacitors

Open Ceramics
This study employs solid-state and chemical plating methods to fabricate aluminum grain boundary capacitors using Al@CuO composite materials. The materials were prepared under varying compaction pressures (200 psi, 500 psi, and 700 psi) and thermal ...
Wen Hsi Lee, C.R. Kuo, Hong En Chen
doaj   +1 more source

Reconciling grain growth and shear-coupled grain boundary migration

Nature Communications, 2017
Conventional grain growth models assume the velocity of a grain boundary is proportional to its curvature but cannot account for the many deviations observed experimentally.
Spencer L. Thomas, Kongtao Chen, Jian Han, Prashant K. Purohit, David J. Srolovitz   +4 more
doaj   +1 more source