Results 171 to 180 of about 252,454 (282)

Block Copolymers: Emerging Building Blocks for Additive Manufacturing

Advanced Functional Materials, EarlyView.
This review addresses how block copolymer (BCP) physics and rheology have led to the widespread use of BCPs in advanced additive manufacturing techniques, with particular emphasis on the untapped potential of these nanostructured materials toward achieving multi‐scale architected materials with unique, programmable material properties.
Alice S. Fergerson, Hemish B. Thakkar, Jiaen Wu, Emily C. Davidson   +3 more
wiley   +1 more source

Genetics and Grain Filling Effects on Starch Properties in Wheat. [PDF]

Foods
Zhao Y, Wang Y, Meng L, Li W, Wang H, Yan Q, Niu N, Ma L.   +7 more
europepmc   +1 more source

Membrane Wrapping for High Capacity and Rapidly Switchable Adhesives

Advanced Functional Materials, EarlyView.
A membrane‐wrapping mechanism enables high‐capacity, rapidly switchable adhesion by coupling suction, friction, and adhesion. Broadband performance is achieved in dry and underwater conditions, allowing fast, reversible manipulation of objects of diverse sizes and shapes, from delicate eggs and berries to flat, complex, or heavy objects. These outcomes
Yeunhee Kim, Camryn A. Mills, Michael D. Bartlett   +2 more
wiley   +1 more source

Universal Electronic‐Structure Relationship Governing Intrinsic Magnetic Properties in Permanent Magnets

Advanced Functional Materials, EarlyView.
Permanent magnets derive their extraordinary strength from deep, universal electronic‐structure principles that control magnetization, anisotropy, and intrinsic performance. This work uncovers those governing rules, examines modern modeling and AI‐driven discovery methods, identifies critical bottlenecks, and reveals electronic fingerprints shared ...
Prashant Singh
wiley   +1 more source

Editorial: From genes to grains: advancements in understanding seed development and grain filling. [PDF]

Front Plant Sci
Cao SK, Ye N, Teng Z, Shaw BP, Liu R, Zhang J.   +5 more
europepmc   +1 more source

Trap‐Assisted Transport and Neuromorphic Plasticity in Lead‐Free 2D Perovskites PEA2SnI4

Advanced Functional Materials, EarlyView.
An artificial retina built from lead‐free layered perovskite (PEA)2SnI4 converts light input into a persistent photocurrent and sums successive flashes over time. Micro/nanocrystals integrated on electrodes act as synapse‐like pixels that perform temporal integration directly in hardware. This in‐sensor preprocessing merges detection and computation on
Ofelia Durante, Valeria Demontis, Jonas Riisnaes Karl, Lam Hoi Tung, Sebastiano De Stefano, Daniela Marongiu, Adolfo Mazzotti, Aditya Bhardwaj, Francesco Mattana, Elisa Pili, Selene Matta, Federico Paolucci, Michele Saba, Andrea Mura, Giovanni Bongiovanni, Monica F Craciun, Saverio Russo, Antonio Di Bartolomeo   +17 more
wiley   +1 more source

From Mechanics to Electronics: Influence of ALD Interlayers on the Multiaxial Electro‐Mechanical Behavior of Metal–Oxide Bilayers

Advanced Functional Materials, EarlyView.
Ultrathin AlOxHy interlayers between aluminum films and polymer substrates significantly improve electro‐mechanical properties of flexible thin film systems. By precisely controlling interlayer thickness using atomic layer deposition, this study identifies an optimal interlayer thickness of 5–10 nm that enhances ductility and delays cracking.
Johanna Byloff, Vivek Devulapalli, Daniele Casari, Thomas E. J. Edwards, Claus O. W. Trost, Megan J. Cordill, Shuhel Altaf Husain, Pierre‐Olivier Renault, Damien Faurie, Barbara Putz   +9 more
wiley   +1 more source

Rice sucrose transporter 1, <i>OsSUT1</i>, confers to alleviation of the high temperature stress in rice grain filling. [PDF]

Plant Biotechnol (Tokyo)
Kusano H, She KC, Matsubara K, Wang LL, Tsujiuchi K, Matsumoto R, Shiraishi M, Okubo Y, Yasui H, Sasaki T, Shimada H.   +10 more
europepmc   +1 more source

Conductive Bonding and System Architectures for High‐Performance Flexible Electronics

Advanced Functional Materials, EarlyView.
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley   +1 more source

Integrated transcriptomics and metabolomics analyses reveal key pathway responses during the grain-filling stage in maize under waterlogging stress. [PDF]

Front Plant Sci
Zhou B, Wei S, Qin J, Zheng J, Wang B, Zhong X, Huang A, He J, Shi C.   +8 more
europepmc   +1 more source