Results 51 to 60 of about 13,352 (253)

Machining performance of hard-brittle materials by multi-layer micro-nano crystalline diamond coated tools

open access: yesResults in Physics, 2019
Single layer diamond coatings, deposited on cobalt cemented tungsten carbide (WC-Co), with CH4 concentrations of 1%, 3% and 5% were prepared, by hot filament chemical vapor deposition (HFCVD). Moreover, according to the characteristics of different kinds
Guangyu Yan   +7 more
doaj   +1 more source

Multi-Wire Sawing of Translucent Alumina Ceramics

open access: yesJournal of Manufacturing and Materials Processing, 2020
Multi-wire sawing has emerged as the leading technology in wafer production for a variety of semiconductor materials. This study investigates the process stability and efficiency of conventional semiconductor multi-wire slurry saws in routinely machining
Lea Schmidtner   +7 more
doaj   +1 more source

Distinct Microstructural Characteristic Lengths Defining Notch Fatigue Crack Initiation and Propagation, and Defect Tolerance in Advanced Steels

open access: yesAdvanced Engineering Materials, EarlyView.
Schematic representation of modes of microcrack nucleation, growth and temporary arrestment at different boundaries, with the criteria for crack propagation in three scenarios: (1) large notch, (2) defect/small sharp notch, and (3) long crack. This work revisits and integrates results on the fatigue behavior of advanced bainitic steels (in particular ...
Lucia Morales‐Rivas
wiley   +1 more source

The State of the Art in Electrochemical Micro Machining Technologies [PDF]

open access: yes한국정밀공학회지, 2018
Electrochemical micromachining (ECM) processes use anodic dissolution of metals to remove workpiece materials. ECM processes including electrochemical milling and drilling, wire electrochemical machining and electrochemical etching offer a better ...
Pyeong An Lee, Eunseok Nam, Bo Hyun Kim
doaj   +1 more source

Superlubricity and Corrosion Inhibition Properties of Solvate Ionic Liquids in Hybrid Carbon Fiber Reinforced Plastic–Steel Interfaces

open access: yesAdvanced Engineering Materials, EarlyView.
Solvate ionic liquids lubrication reduced the coefficient of friction by ∼60% compared to dry sliding, reaching steady‐state values as low as 0.04–0.05. Corrosion weight‐loss measurements in 1 M HCl further demonstrated significant inhibition behavior, with only 100 ppm of [Li(G3)][TFSI] (∼68.5 μL/L) reducing corrosion‐product weight loss by 63 ...
Sameh Dabees   +6 more
wiley   +1 more source

Micro-Grinding Parameter Control of Hard and Brittle Materials Based on Kinematic Analysis of Material Removal

open access: yesMathematics
This article explores the intricacies of micro-grinding parameter control for hard and brittle materials, with a specific focus on Zirconia ceramics (ZrO2) and Optical Glass (BK7). Given the increasing demand and application of these materials in various
Hisham Manea   +4 more
doaj   +1 more source

Stretching the Printability Metric in Direct‐Ink Writing with Highly Extensible Yield‐Stress Fluids

open access: yesAdvanced Functional Materials, EarlyView.
This study introduces “drawability” as a new metric for assessing printability in direct‐ink writing, focusing on gap‐spanning performance and speed robustness. By designing yield‐stress fluids with high extensibility, we demonstrate that extensional strain‐to‐break significantly enhances printability.
Chaimongkol Saengow   +9 more
wiley   +1 more source

Laser‐Induced Graphene from Waste Almond Shells

open access: yesAdvanced Functional Materials, EarlyView.
Almond shells, an abundant agricultural by‐product, are repurposed to create a fully bioderived almond shell/chitosan composite (ASC) degradable in soil. ASC is converted into laser‐induced graphene (LIG) by laser scribing and proposed as a substrate for transient electronics.
Yulia Steksova   +9 more
wiley   +1 more source

Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding

open access: yesInternational Journal of Extreme Manufacturing
Workpiece rotational grinding is widely used in the ultra-precision machining of hard and brittle semiconductor materials, including single-crystal silicon, silicon carbide, and gallium arsenide.
Shang Gao   +4 more
doaj   +1 more source

Magnesium‐Based Transient Bioelectronics, Bio‐Optics and Bio‐Scaffolds

open access: yesAdvanced Functional Materials, EarlyView.
This paper reviews the state of the art and recent advances in magnesium‐based thin‐film, foils, and scaffolds for applications in transient bio‐optics, bioelectronics and tissue engineering. The design principles, fabrication methods, material properties, and integration strategies are discussed in detail.
Massimo Mariello, Yves Leterrier
wiley   +1 more source

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