Results 101 to 110 of about 2,576,432 (406)
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Advanced Materials Technologies, EarlyView.Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Heat Sink Equivalent Thermal Test Method and Its Application in Low-Orbit Satellites
Applied SciencesIn order to shorten the length of satellite thermal testing and reduce the cost of satellite development, a new method of satellite thermal testing using a heat sink to simulate space heating flow has been proposed. First, based on the characteristics of
Tian Bai +3 more
doaj +1 more source
Optimization of heat sinks with plate fins in air-jet cooling
Nihon Kikai Gakkai ronbunshu, 2014 Heat density of high-load electronics such as high-performance servers and the inverters used in vehicles has been increasing as the result of higher processing speeds and computational scale, and higher output, etc.
Takayuki ATARASHI +2 more
doaj +1 more source
Analysis of Heat Sink Modelling Performance
Elektronika ir Elektrotechnika, 2013 With increasing complexity of electronic components and their systems, their cooling solutions become an important issue, and heat sinks are the most widely applied solution in industry. Theoretical, experimental and numerical methods can be used to determine a heat sinks thermal performance.
Tarvydas, P. +3 more
openaire +1 more source
Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications
Advanced Materials Technologies, EarlyView.This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley +1 more source
Engineering ProceedingsHeat sinks have been widely used in cooling systems due to their high heat transfer efficiency. In this study, the thermal performance and fluid flow characteristics of conventional and triply periodic minimal surfaces (TPMS)-based heat sinks were ...
Muhammad Usman Shahid +2 more
doaj +1 more source
Thermal Conductivity Analysis and Investigation of an Aluminum-Graphene Composite Heat Sink [PDF]
Hangkong bingqiTo address the thermal dissipation challenges caused by high heat flux density in power modules under the high-performance and miniaturization trend of missile-borne electronic devices, this study proposes an innovative solution by optimizing the thermal
Li Hang, Shi Lanfang, Cai Ming
doaj +1 more source
Heat pipe cooling system with sensible heat sink [PDF]
A heat pipe cooling system which employs a sensible heat sink is discussed. With this type of system, incident aerodynamic heat is transported via a heat pipe from the stagnation region to the heat sink and absorbed by raising the temperature of the heat
Silverstein, Calvin C.
core +1 more source
Flow boiling heat transfer of refrigerant R-134a in copper microchannel heat sink [PDF]
, 2014 This paper was presented at the 4th Micro and Nano Flows Conference (MNF2014), which was held at University College, London, UK. The conference was organised by Brunel University and supported by the Italian Union of Thermofluiddynamics, IPEM, the ...
4th Micro and Nano Flows Conference (MNF2014) +2 more
core