Results 221 to 230 of about 32,763 (264)
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1965
This paper explains the bases for the design of a heat-sink module, a module desirable because of its great flexibility in component arrangement and adaptability to new usages. The methods by which the module would meet major design problems, such as heat management, standardization and internal flexibility, and component interconnection, are outlined,
R. E. Klein, J. Gammon
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This paper explains the bases for the design of a heat-sink module, a module desirable because of its great flexibility in component arrangement and adaptability to new usages. The methods by which the module would meet major design problems, such as heat management, standardization and internal flexibility, and component interconnection, are outlined,
R. E. Klein, J. Gammon
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Wescon/96, 1996
Increases in heat and heat concentration from microelectronics devices, combined with the reduction in overall form factors, make it essential to optimize heat sink designs with the least possible trade-offs in materials and manufacturing costs. In predicting the thermal performance of a heat sink, one of the unknown, hard-to-estimate parameters is the
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Increases in heat and heat concentration from microelectronics devices, combined with the reduction in overall form factors, make it essential to optimize heat sink designs with the least possible trade-offs in materials and manufacturing costs. In predicting the thermal performance of a heat sink, one of the unknown, hard-to-estimate parameters is the
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Natural Convection Heat Sink With Heated Shroud
CAE/CAD and Thermal Management Issues in Electronic Systems, 1997Abstract Numerical solutions for laminar natural convection in a vertical shrouded fin array are presented. Analysis of a physically realizable configuration is compared to published results for an adiabatic shroud. The effect of a uniform heat flux on the heat sink shroud representing an incident solar heat load is also examined for a ...
Andrew T. Morrison, S. M. You
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2014
Finned heat sinks are used in computers to promote heat transfer from the Integrated Circuit (IC) chips to cooling air. This chapter provides the background information and the tutorial materials about heat sinks. First, the mechanism of heat generation by electronic circuits is explained.
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Finned heat sinks are used in computers to promote heat transfer from the Integrated Circuit (IC) chips to cooling air. This chapter provides the background information and the tutorial materials about heat sinks. First, the mechanism of heat generation by electronic circuits is explained.
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Optimization of heat sink fin geometries for heat sinks in natural convection
[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems, 2003An approach for determining the optimum fin configurations for a given heat sink in natural convection is developed. Incorporation of minimization routines into the analysis eliminates the manual, iterative design analysis and identifies the optimum design. Optimization of fin geometry for heat sinks in natural convection with rectangular cross section
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Heat sink design: heat sink design for a company.
Throughout the project, I utilized SolidWorks Software to design, assemble, and simulate a heat sink for a heat sink company with a computer science background that needs it to be used on a silicon computer chip. The primary objective was to design a heat sink that could lower the temperature of the silicon chip to less than 43.5ºC.openaire +1 more source
Proceeding of Proceedings of CONV-22: Int. Symp. on Convective Heat and Mass Transfer June 5 – 10, 2022, Turkey, 2022
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