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Characterization of Heat Sink Flow Bypass in Plate Fin Heat Sinks
Heat Transfer, Volume 5, 2002Experimental testing has been performed on two plate fin heat sinks in order to examine flow bypass phenomenon. The present study examines pressure drop and thermal resistance as well as flow velocities within the heat sinks. Tests are performed for bypass channel/fin height ratios of 0.25, 0.5, 0.75 and 1 with approach velocities from 2 to 8 m/s.
W. Leonard +3 more
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A method to rank heat sinks in practice: the heat sink performance tester
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005., 2005One way of cooling electronic devices is through enlarging the surface that is in contact with a fluid (usually air) by attaching a heat sink. Since literally thousands of heat sinks are available many designers are confronted with the question: which one? Very often the designer's choice is based on cost and manufacturer's data.
C.J.M. Lasance, H.J. Eggink
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1965
This paper explains the bases for the design of a heat-sink module, a module desirable because of its great flexibility in component arrangement and adaptability to new usages. The methods by which the module would meet major design problems, such as heat management, standardization and internal flexibility, and component interconnection, are outlined,
R. E. Klein, J. Gammon
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This paper explains the bases for the design of a heat-sink module, a module desirable because of its great flexibility in component arrangement and adaptability to new usages. The methods by which the module would meet major design problems, such as heat management, standardization and internal flexibility, and component interconnection, are outlined,
R. E. Klein, J. Gammon
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Thin vapor chamber heat sink and embedded heat pipe heat sink performance evaluations
2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2009Vapor chamber and heat pipe technologies are not new concepts, but their fabrication and manufacturing processes have been improving. Both vapor chambers and heat pipes have been getting thinner allowing the integrated heat sink design with increased fin surfaces. For example, for vapor chambers, the minimum achievable thickness has been reduced from 5
Garrett Glover +3 more
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Thermal comparison of plate, extrusion heat sink, and skive heat sink
Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189), 2002Due to the high power dissipation values of power amplifiers, large temperature gradients exist, resulting in localized hot spots around the devices. These hot spots cause high device junction temperatures. Generally speaking, the higher junction temperature increases, the lower reliability will be. Thus, improving the heat spreading is very important.
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Optimization of convectively cooled heat sinks
Microelectronics Reliability, 2017Abstract Many factors of heat sink, such as its size and mass, component locations, number of fins, and fan power affect heat transfer. Owing to the opposite effects of these factors on heat sink maximum temperature, we have now a multi-objective optimization problem.
Kaj Lampio, Reijo Karvinen
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Micro-Heat-Sinks for Space Applications
ASME 2nd International Conference on Microchannels and Minichannels, 2004During the space missions, the problems related to the thermal conditioning of devices, to the personnel comfort and to the thermo-mechanical stresses are known and important. Furthermore for a space mission certain priorities are stressed, such as the small dimension and the lightness of thermal equipments.
MARENGO, Marco +3 more
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Fabrication and characterization of microscale heat sinks
2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2016In the field of thermal management, engineers are well aware of the challenges posed by the increasing level of dissipation. Among the many possible solutions to counter the threat of overheating, one is dealing with the usage of microscale heat exchangers, where the forced air or liquid cooling solution is integrated into the electronic package itself.
Gábor Takács +4 more
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Numerical Heat Transfer, Part A: Applications, 2019
The convective heat transfer is significant in the cooling channel, but the heat transfer enhancement in a cooling passage will be more useful or increases if a dimple is employed on their surfaces...
Ashif Perwez, Rakesh Kumar
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The convective heat transfer is significant in the cooling channel, but the heat transfer enhancement in a cooling passage will be more useful or increases if a dimple is employed on their surfaces...
Ashif Perwez, Rakesh Kumar
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Applied Mechanics and Materials, 2013
This study investigated the heat transfer characteristics of LED heat sink and the development process technology of graphite heat sink with micro-sized metal powders. Employing the reverse engineering technology, the three-dimension LED heat sink entity was rebuilt and the heat transfer characteristics of LED heat sink were analyzed by CFD numerical ...
Shie Chen Yang +6 more
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This study investigated the heat transfer characteristics of LED heat sink and the development process technology of graphite heat sink with micro-sized metal powders. Employing the reverse engineering technology, the three-dimension LED heat sink entity was rebuilt and the heat transfer characteristics of LED heat sink were analyzed by CFD numerical ...
Shie Chen Yang +6 more
openaire +1 more source