Results 271 to 280 of about 307,278 (311)

Heat Sinks in Computers

2014
Finned heat sinks are used in computers to promote heat transfer from the Integrated Circuit (IC) chips to cooling air. This chapter provides the background information and the tutorial materials about heat sinks. First, the mechanism of heat generation by electronic circuits is explained.
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Heat Transfer in Spiral Channel Heat Sinks

ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, Volume 1, 2011
Heat transfer in a spiral heat sink is examined experimentally and analytically. The spiral channel was fabricated on a base plate of copper. The cross section of the channel is square with 1 mm sides. A copper cap plate was bolted tight to seal the channel.
M. Ghobadi, Y. S. Muzychka
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Partially heated heat sinks in a zero-bypass

International Communications in Heat and Mass Transfer, 2012
Abstract The need to improve the thermal performance of heat sinks remains a design priority for thermal engineers. Most of the considerations so far have involved various shapes and sizes of the fin designs. This numerical study evaluates the influence of the heating position on the thermal performance of a plate-fin heat sink in a zero-bypass ...
N.G. Emekwuru, F.R. Hall, P.J. Spence
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Heat transfer characteristics of a centrifugal heat sink

International Journal of Heat and Mass Transfer, 2013
Abstract A novel heat sink, called a centrifugal heat sink, into which the blades of a fan are integrated between the fins, is proposed. The fan blades, based on design principles of centrifugal turbomachinery, are arranged to be placed between the fins of the circular heat sink. The rotary motion of the blades causes nearby coolant to be sucked into
Kim, JW Kim, Ju-Wan, Kim, SJ Kim, Sung-Jin   +1 more
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Measurements of heat transfer in microchannel heat sinks

International Communications in Heat and Mass Transfer, 2000
Abstract The paper presents new experimental measurements for pressure drop and heat transfer coefficient in microchannel heat sinks. Tests were performed with devices fabricated using standard Silicon 100 wafers. Two different channel patterns were studied.
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The Digital Heat Sink

CKS FRAMEWORK PAPER - Registry ID: CKS-0-2026. Dependencies: CKS foundation only. This is a constituent derivation of the Cymatic K-Space Mechanics (CKS) framework extending into 0. The paper is subject to the Global Falsification Protocol [CKS-TEST-1-2026]: if the 1/32 Hz substrate quantization is absent in relevant precision measurements, this ...
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Introducing a novel heat sink comprising PCM and air - Adapted to electronic device thermal management

International Journal of Heat and Mass Transfer, 2021
Rasool Kalbasi
exaly  

Study of the performance of an integrated liquid cooling heat sink for high-power IGBTs

Applied Thermal Engineering, 2021
Minqiang Pan
exaly  

Evaluation of heat sink performance using PCM and vapor chamber/heat pipe

Renewable Energy, 2021
M J Hosseini, A A Ranjbar, M Rahimi
exaly  

Experimental investigation of a topology-optimized phase change heat sink optimized for natural convection

Applied Energy, 2022
Jin Yao Ho, K C Leong, Teck Neng Wong
exaly