Results 151 to 160 of about 1,477,069 (292)

In‐House Manufacturing of 3D ECM Culture Chips via Vacuum Thermoforming for Enhanced Imaging Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Desktop vacuum thermoforming enables rapid, low‐cost fabrication of 96‐channel polystyrene culture chips with very thin imaging interfaces. The resulting platform supports cell lines, primary cells, and patient‐derived organoids, and enables high‐resolution confocal microscopy and single‐cell visualization, providing an accessible approach for advanced
Aleksandra Fomina   +5 more
wiley   +1 more source

Phytochemical Profile and Analgesic Properties of Chicory Root Extract in the Hot-Plate Test in Mice. [PDF]

open access: yesInt J Mol Sci
Duda Ł   +8 more
europepmc   +1 more source

Liquid Crystal Elastomer Actuator Matrix for Large Area Applications

open access: yesAdvanced Materials Technologies, EarlyView.
A scalable approach is used to manufacture a digitally‐controllable, 2D 5 × 5 actuator matrix. The elements of the matrix are produced by direct ink writing of a liquid crystal elastomer ‘artificial muscle’ on large‐area flexible thin‐film heaters. In optimizing the low‐power actuators, multiple heater designs and substrate materials are investigated ...
Giulia Spallanzani   +5 more
wiley   +1 more source

Biodegradable and Edible Milli‐Fluidic Logic Circuits

open access: yesAdvanced Materials Technologies, EarlyView.
Fully biodegradable and edible fluidic circuits are developed using gelatin‐based valves that operate at low pressure. Logic gates, a one‐bit memory, and a ring oscillator are demonstrated, showing that biodegradable materials can perform computation and control.
Shuhang Zhang   +3 more
wiley   +1 more source

Multidimensional Heat‐Path Engineering in Thermal Interface Materials for High‐Performance Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
This review presents multidimensional heat‐path engineering for thermal interface materials, showing how internal heat transport, interfacial contact and bondline formation, and processing‐defined pathway architectures together determine bonded‐joint thermal performance.
Jinsoo Na   +7 more
wiley   +1 more source

Home - About - Disclaimer - Privacy