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Ultrasonic Spectroscopy for Simulated Plastic IC Packages
ASME 1997 Turbo Asia Conference, 1997Failure analysis of integrated circuit (IC) packages is a critical element for in house quality control and for problems encountered in service. Plastic IC packages are routinely inspected for delaminations, voids, cracks, and corrosion using the C-mode acoustic microscopy (C-AM). Plastic IC packages are hygroscopic and can absorb moisture subjected to
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Optimal estimation of snow and ice surface parameters from imaging spectroscopy measurements
Remote Sensing of Environment, 2021Urs Niklas Bohn +2 more
exaly
Cubic ice Ic without stacking defects obtained from ice XVII
Nature Materials, 2020Leonardo del Rosso +2 more
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Microbial ecology of the cryosphere: sea ice and glacial habitats
Nature Reviews Microbiology, 2015Antje Boetius +2 more
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The Surface of Ice Is Like Supercooled Liquid Water
Angewandte Chemie - International Edition, 2017Wilbert J Smit
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