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Ultrasonic Spectroscopy for Simulated Plastic IC Packages

ASME 1997 Turbo Asia Conference, 1997
Failure analysis of integrated circuit (IC) packages is a critical element for in house quality control and for problems encountered in service. Plastic IC packages are routinely inspected for delaminations, voids, cracks, and corrosion using the C-mode acoustic microscopy (C-AM). Plastic IC packages are hygroscopic and can absorb moisture subjected to
openaire   +1 more source

Optimal estimation of snow and ice surface parameters from imaging spectroscopy measurements

Remote Sensing of Environment, 2021
Urs Niklas Bohn   +2 more
exaly  

Cubic ice Ic without stacking defects obtained from ice XVII

Nature Materials, 2020
Leonardo del Rosso   +2 more
exaly  

Microbial ecology of the cryosphere: sea ice and glacial habitats

Nature Reviews Microbiology, 2015
Antje Boetius   +2 more
exaly  

Vibrational Spectroscopy and Dynamics of Water

Chemical Reviews, 2016
Fivos Perakis   +2 more
exaly  

The Surface of Ice Is Like Supercooled Liquid Water

Angewandte Chemie - International Edition, 2017
Wilbert J Smit
exaly  

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