Exploring the impedance-matching effect in terahertz reflection imaging of skin tissue. [PDF]
Oh SJ +8 more
europepmc +1 more source
High-Performance Planar Thin Film Thermochromic Window via Dynamic Optical Impedance Matching. [PDF]
Sol C +7 more
europepmc +1 more source
Nickel‐based alloys are widely used in high‐temperature applications due to their excellent mechanical strength and oxidation resistance. However, properties such as high‐temperature strength and pronounced work‐hardening make them difficult to machine.
Soheil Rooein +2 more
wiley +1 more source
Void-Engineered Metamaterial Delay Line with Built-In Impedance Matching for Ultrasonic Applications. [PDF]
Palanisamy RP +3 more
europepmc +1 more source
This article presents the design, modeling, and characterization of air‐pressure–actuated programmable vibroacoustic metamaterials (PVAMM). The study focuses on leveraging air pressure to dynamically tune resonance frequencies for effective noise attenuation.
William Kaal +2 more
wiley +1 more source
Wireless Power Transfer Efficiency Optimization Tracking Method Based on Full Current Mode Impedance Matching. [PDF]
Xu Y, Zhang Y, Wu T.
europepmc +1 more source
High Quality Factor, High Sensitivity Metamaterial Graphene-Perfect Absorber Based on Critical Coupling Theory and Impedance Matching. [PDF]
Cen C +8 more
europepmc +1 more source
Powder Optimization Strategies for Binder Jetting Printing of BaTiO3 and Ba0,6Sr0,4TiO3 Ceramics
Powder optimization is investigated to enable binder jetting of BaTiO3 and Ba0.6Sr0.4TiO3 ferroelectric ceramics. The antagonistic relationship between flowability and binder compatibility is addressed through binder impregnation of granulated powders and fumed silica addition to fine powders.
Fanny Pruvost +4 more
wiley +1 more source
Improved Multilayered (Bi,Sc)O3-(Pb,Ti)O3 Piezoelectric Energy Harvesters Based on Impedance Matching Technique. [PDF]
Kim BS, Ji JH, Kim HT, Kim SJ, Koh JH.
europepmc +1 more source
The wettability of aluminum droplets (Al) on different copper substrates (Cu), where liquid Al spreads on solid Cu surfaces to form a liquid–solid interface, is studied numerically and experimentally. The experimental and numerical results show good agreement in the fast‐spreading regime.
Shan Lyu +8 more
wiley +1 more source

