Results 21 to 30 of about 260,655 (288)

Integrated through-silicon-via-based inductor design in buck converter for improved efficiency

open access: yesElectrical engineering & Electromechanics, 2023
Introduction. Through-silicon-via (TSV) is one of the most important components of 3D integrated circuits. Similar to two-dimensional circuits, the performance evaluation of 3D circuits depends on both the quality factor and inductance.
A. Namoune   +4 more
doaj   +1 more source

An Inductive Method to Select Simulation Points

open access: yes2015 Third International Symposium on Computing and Networking (CANDAR), 2015
The time for processor simulation can be drastically reduced by selecting simulation points, which are such dynamic sections from execution program that the overall behavior for the program can be estimated by simulating only for thoses sections. Existing methods to select simulation points such as SimPoint, are deductive, selects simulation points ...
Minseong Choi   +3 more
openaire   +3 more sources

Electrical Circuits Simulator in Null-Flux Electrodynamic Suspension Analysis

open access: yesApplied Sciences, 2023
This paper employed an electrical circuit simulator to investigate an electrodynamic suspension system (EDS) for passenger rail transport applications.
Thaís N. França   +5 more
doaj   +1 more source

On the Simulation of Three Phase Induction Machine

open access: yesTechnological Engineering, 2019
Abstract Three phase induction motor is the most popular type AC motor. it is very commonly used for industrial drives. It is cheap, robust, efficient and reliable. It has good speed regulation and high starting torque. It requires little maintenance. It has a reasonable over load capacity.
MUHANNED AL-RAWI, MUAAYED AL-RAWI
openaire   +1 more source

Frequency Dependent Model of Leakage Inductance for Magnetic Components [PDF]

open access: yes, 2012
Theoretical methods for the calculation of winding losses with respect to frequency have been well documented, but the variation in leakage inductance of magnetic components due to frequency has been less well addressed. In this paper Dowell’s well-known
Wilcock, Reuben   +5 more
core   +1 more source

Closed-Form Formulas for Automated Design of SiC-Based Phase-Shifted Full Bridge Converters in Charger Applications

open access: yesEnergies, 2021
Phase-Shifted Full Bridge (PSFB) topology in its four-diode variant is the choice with the lowest part count in applications that demand high power, high voltage, and galvanic isolation, such as in Electric Vehicle (EV) chargers. Even though the topology
Kornel Wolski   +3 more
doaj   +1 more source

Optimized Design of OTA-Based Gyrator Realizing Fractional-Order Inductance Simulator: A Comprehensive Analysis

open access: yesApplied Sciences, 2020
A detailed analysis of an operational transconductance amplifier based gyrator implementing a fractional-order inductance simulator is presented.
David Kubanek   +4 more
doaj   +1 more source

Microwave Kinetic Inductance Detectors [PDF]

open access: yes, 2005
Low temperature detectors have been a subject of intense interest to the scientific community over the last decade. These detectors work at very low temperatures, often well below 1 Kelvin, to minimize the noise in the measurement of photons.
Mazin, Benjamin A.
core   +1 more source

CNTFET based inductance simulator circuits employing single CFOA and its filter applications

open access: yes, 2022
The purpose of this paper is to design novel inductance simulator topologies using 32 nm carbon nanotube field effect transistor (CNTFET) technology. In a CMOS CFOA structure, we replaced MOS transistors by CNFETs and determined the optimum tube numbers ...
KAÇAR, FIRAT   +2 more
core   +1 more source

On the applicability of two‐bit carbon nanotube through‐silicon via for power distribution networks in 3‐D integrated circuits

open access: yesIET Circuits, Devices and Systems, 2021
This study investigates the possibility of the carbon nanotube (CNT)‐based through‐silicon vias (TSVs) for improving power integrity of 3‐D integrated circuits (3‐D ICs).
Qing‐Hao Hu   +4 more
doaj   +1 more source

Home - About - Disclaimer - Privacy