Results 171 to 180 of about 1,400,119 (370)
This study demonstrates a novel, additive manufacturing approach to produce complex, porous tungsten carbide structures using water‐based direct ink writing/robocasting. Leveraging a modified commercial printer and heat treatment, the process yields lightweight, electrically conductive 3D architectures capable of supporting a mechanical load.
James Bentley Bevis+3 more
wiley +1 more source
Expectation values of local fields for a two-parameter family of integrable models and related perturbed conformal field theories [PDF]
Pascal Baseilhac, V.A. Fateev
openalex +1 more source
Beyond Order: Perspectives on Leveraging Machine Learning for Disordered Materials
This article explores how machine learning (ML) revolutionizes the study and design of disordered materials by uncovering hidden patterns, predicting properties, and optimizing multiscale structures. It highlights key advancements, including generative models, graph neural networks, and hybrid ML‐physics methods, addressing challenges like data ...
Hamidreza Yazdani Sarvestani+4 more
wiley +1 more source
Low‐Activation Compositionally Complex Alloys for Advanced Nuclear Applications—A Review
Low‐activation compositionally complex alloys (LACCAs) are advanced metallic materials primarily composed of low‐activation elements, offering advantages such as rapid compliance with operational standards and safe recyclability. This review highlights their potential for extreme high‐temperature irradiation environments as structural materials for ...
Yangfan Wang+8 more
wiley +1 more source
Finite volume form factors in integrable theories
We develop a new method to calculate finite size corrections for form factors in two-dimensional integrable quantum field theories. We extract these corrections from the excited state expectation value of bilocal operators in the limit when the operators
Zoltan Bajnok+3 more
doaj +1 more source
Differential equations and duality in massless integrable field theories at zero temperature [PDF]
Paul Fendley, Hubert Saleur
openalex +1 more source
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan+5 more
wiley +1 more source
Ethnography and Experiment in Social Psychological Theory Building: Tactics for Integrating Qualitative Field Data with Quantitative Lab Data [PDF]
Gary Alan Fine, Kimberly D. Elsbach
openalex +1 more source
Highly textured CeO2 nanowires and nanoporous thin films are successfully synthesized by water dissolution of Sr3Al2O6 (SAO) from the SAO:CeO2 vertically aligned nanocomposites (VANs). The morphology of CeO2 can be varied by VAN composition. It demonstrates a new method for synthesizing nanostructured CeO2 without chemical etching or complex micro ...
Benson Kunhung Tsai+8 more
wiley +1 more source