Results 51 to 60 of about 766,709 (285)

Microstructure Modification of Additively Manufactured Mo–9Si–8B by Annealing and Its Effects on High‐Temperature Mechanical Properties

Advanced Engineering Materials, EarlyView.
Postbuild annealing systematically modifies the phase fractions and morphology of EB‐PBF processed Mo–9Si–8B. Quantitative microstructure–property correlations reveal how controlled phase evolution enhances high‐temperature compressive strength and creep resistance.
Christopher Schmidt, Yong Chen, Georg Hasemann, Benjamin Wahlmann, Carolin Körner, Manja Krüger   +5 more
wiley   +1 more source

Effect of non-standard SnAg surface finishes on properties of solder joints

Applied Surface Science Advances, 2023
In this study, the effects of nonstandard near-eutectic SnAg surfaces on the wettability, intermetallic compound growth and mechanical properties of solder joints were investigated.
Alena Pietrikova, Daniel Dzivy, Peter Provazek, Lubomir Livovsky, Robert Dzunda, Karel Dusek, David Busek   +6 more
doaj   +1 more source

The intermetallic compound BaAgBi

Acta Crystallographica Section E Structure Reports Online, 2002
BaAgBi was obtained as a by-product when Ba [rod, Alfa–Aesar (99.99%)], Ag [powder, −100 mesh, Alfa–Aesar (99.999%)], and Bi [powder, −100 mesh, Alfa–Aesar (99.999%)] were loaded into a tantalum tube (Nobel-Met. Ltd, >99.85%, 0.375 in. OD) in a 1:1:2 molar ratio in an Ar-filled glovebox.
Kang, Sung Kwon, Miller, Gordon
openaire   +3 more sources

Entropy‐Driven Design of Low‐Melting‐Point Alloys via Compositionally Complex Strategy

Advanced Engineering Materials, EarlyView.
Conventional low‐melting‐point alloys (LMPAs) are limited by a narrow compositional space and inherent property trade‐offs. This review presents an entropy‐driven design strategy that overcomes these limitations, ushering in a new class of low‐melting‐point compositionally complex alloys (LMCCAs).
Yinghui Shang, Jianxiang Zhao, Zhaoqi Chen, Hao Gong, Yinsen Yan, Junlei Tao, Yong Yang   +6 more
wiley   +1 more source

Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature

Applied Sciences, 2020
In this study, the effects of electromigration on a solder/copper substrate due to temperature and current density stress were investigated. The copper–tin (Cu–Sn) film samples were subjected under a fixed current and various heating conditions (130 °C ...
Zhao-Ying Wang, Nhat Minh Dang, Po-Hsun Wang, Terry Yuan-Fang Chen, Ming-Tzer Lin   +4 more
doaj   +1 more source

Enhancing the phase stability of TiNi intermetallic compound via nanocrystallization in an irradiated multicomponent vanadium alloy

Materials & Design, 2022
Intermetallic compounds often have a low radiation tolerance due to the low recombination rate of radiation-induced defects. In the present work, we designed a novel multicomponent vanadium-based alloy (MVA), V34Ti25Cr10Ni30Pd1, containing a micron-scale
Z.F. Wu, Y.X. Liang, J.J. Tang, Y.F. Wang, S.L. Zhang, Q.N. Meng, Y. Yan, C. Xu, J. Wang, T.D. Shen, Y.Q. Qiao, E.G. Fu   +11 more
doaj   +1 more source

Large positive magnetoresistance in intermetallic compound NdCo2Si2

, 2018
The magnetic, magneto-transport and magnetocaloric properties of antiferromagnetic intermetallic compound NdCo2Si2 (T-N = 32 K) have been studied. The compound yields a positive magnetoresistance (MR) of about similar to 123% at similar to 5 K in 8 T ...
BANDYOPADHYAY, B, RAWAT, R, CHOWDHURY, RR, DAS, I, DHARA, S   +4 more
core   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

Advanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová, Markéta Klimtová, Mohd Faizul Mohd Sabri, Yew Hoong Wong, Petr Veselý, Martin Plaček, Karel Dušek   +6 more
wiley   +1 more source

Microstructure Modification of Purple Gold Intermetallic Compound Through Si–Co Additions and Copper Mold Casting

Metals
The brittleness of 18-karat purple gold originates from the AuAl2 intermetallic compound. This study investigates the microstructural modification of the AuAl2 intermetallic compound by adding silicon (Si) and cobalt (Co) and by rapid solidification in ...
Adiruj Peerawat, Jingran Yang, Jinkang Lu, Jie Yu, Kageeporn Wongpreedee   +4 more
doaj   +1 more source

Pitting Corrosion of Ni3(Si,Ti) Intermetallic Compound at Various Chloride Concentrations

International Journal of Science and Engineering, 2013
The pitting corrosion of Ni3(Si,Ti) intermetallic compound was investigated as function of chloride concentration by using electrochemical method and scanning electron microscope in sodium chloride solutions at 293 K.
Gadang Priyotomo
doaj   +1 more source