Results 51 to 60 of about 39,831 (300)

OBTAINING INTERMETALLIC COMPOUNDS IN Al–Ti–Zn SYSTEM

Записки Горного института, 2018
Binary intermetallic compounds – titanium aluminides (TiAl, Ti3Al) – when added to the alloys, significantly increase their strength and special properties. The most promising direction to produce intermetallic compounds are mechanochemical technologies,
V. V. Kaminskii, S. A. Petrovich, V. A. Lipin   +2 more
doaj   +1 more source

Superconductivity in Mg10Ir19B16

, 2006
Mg10Ir19B16, a previously unreported compound in the Mg-Ir-B chemical system, is found to be superconducting at temperatures near 5 K. The fact that the compound exhibits a range of superconducting temperatures between 4 and 5 K suggests that a range of ...
E. Morosan, H. W. Zandbergen, J. D. Thompson, M. Tanaka, Q. Xu, R. J. Cava, T. Klimczuk   +6 more
core   +2 more sources

Gallium-assisted diffusion bonding of stainless steel to titanium; microstructural evolution and bond strength [PDF]

, 2018
Strong joints between stainless steel 304L and pure titanium (grade-2) were made using the novel method of “gallium-assisted diffusion bonding”. The microstructural evolution and interfacial reactions were investigated in detail.
Akbulut, Banerjee, Cacciamani, Campbell, Cheepu, Deng, Elrefaey, Fuji, Ghosh, He, Kahraman, Kale, Kale, Kato, Kundu, Kundu, Kundu, Laik, Laik, Manikandan, Martinsen, Mudali, Neumann, Nobili, Okamoto, Orhan, Raj, Schwartz, Shirzadi, Wang   +29 more
core   +1 more source

Investigation of Oxygen‐Free Wetting Behavior of Aluminum on Copper via Molecular Dynamics Simulations and Experiments

Advanced Engineering Materials, EarlyView.
The wettability of aluminum droplets (Al) on different copper substrates (Cu), where liquid Al spreads on solid Cu surfaces to form a liquid–solid interface, is studied numerically and experimentally. The experimental and numerical results show good agreement in the fast‐spreading regime.
Shan Lyu, Timon Steinhoff, Finn‐Lennard Janthur, Sarah Seffer, Jörg Hermsdorf, Christian Klose, Ludger Overmeyer, Hans‐Jürgen Maier, Nina Merkert   +8 more
wiley   +1 more source

Large magnetoresistance anomalies in Dy7Rh3

, 2004
The compound Dy7Rh3 ordering antiferromagnetically below (TN=) 59 K has been known to exhibit a temperature (T) dependent electrical resistivity (rho) behavior in the paramagnetic state unusual for intermetallic compounds in the sense that there is a ...
E V Sampathkumaran, Kausik Sengupta, S Rayaprol, Sampathkumaran E V, Tsutaoka T, Tsutaoka T, van Dover R B   +6 more
core   +1 more source

In situ imaging of microstructure formation in electronic interconnections [PDF]

, 2016
The development of microstructure during melting, reactive wetting and solidification of solder pastes on Cu-plated printed circuit boards has been studied by synchrotron radiography.
Belyakov, H, Gourlay, CM, McDonald, SD, Mohd Salleh, MAA, Nogita, K, Xian, J, Yasuda, H   +6 more
core   +1 more source

Competing magnetic interactions and magnetoresistance anomalies in cubic intermetallic compounds, Gd4RhAl and Tb4RhAl, and enhanced magnetocaloric effect for the Tb case [PDF]

, 2021
Ram Kumar, Kartik K. Iyer, P. L. Paulose, E. V. Sampathkumaran   +3 more
openalex   +1 more source

Raman Spectroscopic Identification of Oxide Phases in a Corroded MgO–Steel Composite Anode Used in Aluminum Molten Salt Electrolysis

Advanced Engineering Materials, EarlyView.
Micro‐Raman spectroscopy is applied to characterize corrosion products in a recycled‐based MgO–316L steel composite anode after molten salt electrolysis. A depth‐dependent Fe–O/Fe–Al–O layer sequence of magnetite, hercynite, and an Al‐doped magnetite transition zone is identified.
Felix Drechsler, Serhii Yaroshevskyi, Alexander Adamczyk, Mahnaz Mehdizadehlima, Julia Richter, Cameliu Himcinschi, David Rafaja, Alexandros Charitos, Christos G. Aneziris, Jens Kortus   +9 more
wiley   +1 more source

Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature

Applied Sciences, 2020
In this study, the effects of electromigration on a solder/copper substrate due to temperature and current density stress were investigated. The copper–tin (Cu–Sn) film samples were subjected under a fixed current and various heating conditions (130 °C ...
Zhao-Ying Wang, Nhat Minh Dang, Po-Hsun Wang, Terry Yuan-Fang Chen, Ming-Tzer Lin   +4 more
doaj   +1 more source

Effect of non-standard SnAg surface finishes on properties of solder joints

Applied Surface Science Advances, 2023
In this study, the effects of nonstandard near-eutectic SnAg surfaces on the wettability, intermetallic compound growth and mechanical properties of solder joints were investigated.
Alena Pietrikova, Daniel Dzivy, Peter Provazek, Lubomir Livovsky, Robert Dzunda, Karel Dusek, David Busek   +6 more
doaj   +1 more source