Results 51 to 60 of about 11,226 (306)

Solid‐State Diffusion and Intermetallic Phase Formation in Roll‐Bonded Mg–Zn Composites With Kirigami‐Patterned Inlay

Advanced Engineering Materials, EarlyView.
Mg–Zn composites with a thickness of 0.21 mm were fabricated using roll bonding of a kirigami‐patterned Mg alloy inlay within a Zn matrix. Thermal activation following this process led to the formation of tailored intermetallic structures, which provided the composite with enhanced flexural strength.
Yaroslav Frolov, Oleksandr Bobukh, Christian Klose, Florian Nürnberger, Hans Jürgen Maier   +4 more
wiley   +1 more source

OBTAINING INTERMETALLIC COMPOUNDS IN Al–Ti–Zn SYSTEM

Записки Горного института, 2018
Binary intermetallic compounds – titanium aluminides (TiAl, Ti3Al) – when added to the alloys, significantly increase their strength and special properties. The most promising direction to produce intermetallic compounds are mechanochemical technologies,
V. V. Kaminskii, S. A. Petrovich, V. A. Lipin   +2 more
doaj   +1 more source

The intermetallic compound BaAgBi

Acta Crystallographica Section E Structure Reports Online, 2002
BaAgBi was obtained as a by-product when Ba [rod, Alfa–Aesar (99.99%)], Ag [powder, −100 mesh, Alfa–Aesar (99.999%)], and Bi [powder, −100 mesh, Alfa–Aesar (99.999%)] were loaded into a tantalum tube (Nobel-Met. Ltd, >99.85%, 0.375 in. OD) in a 1:1:2 molar ratio in an Ar-filled glovebox.
Kang, Sung Kwon, Miller, Gordon
openaire   +3 more sources

Phase Field Failure Modeling: Brittle‐Ductile Dual‐Phase Microstructures under Compressive Loading

Advanced Engineering Materials, EarlyView.
The approach by Amor and the approach by Miehe and Zhang for asymmetric damage behavior in the phase field method for fracture are compared regarding their fitness for microcrack‐based failure modeling. The comparison is performed for the case of a dual‐phase microstructure with a brittle and a ductile constituent.
Jakob Huber, Jan Torgersen, Ewald Werner
wiley   +1 more source

Fatigue Crack Initiation and Growth in Nanocrystalline Ni at Multiple Length‐Scales

Advanced Engineering Materials, EarlyView.
Overview of miniaturized in situ SEM fatigue setup and resultant fatigue crack growth data for nanocrystalline Ni. The presented study focuses on the analysis of fatigue crack growth rate (FCGR) in focused ion beam‐notched microcantilevers prepared from nanocrystalline (NC) Ni as a model material.
Igor Moravcik, Alexander Jelinek, Markus Alfreider, Jutta Luksch, Anton Hohenwarter, Florian Schaefer, Christian Motz, Daniel Kiener   +7 more
wiley   +1 more source

Effect of non-standard SnAg surface finishes on properties of solder joints

Applied Surface Science Advances, 2023
In this study, the effects of nonstandard near-eutectic SnAg surfaces on the wettability, intermetallic compound growth and mechanical properties of solder joints were investigated.
Alena Pietrikova, Daniel Dzivy, Peter Provazek, Lubomir Livovsky, Robert Dzunda, Karel Dusek, David Busek   +6 more
doaj   +1 more source

Creep‐Induced Microstructural Evolution in an A2‐B2 Superalloy

Advanced Engineering Materials, EarlyView.
A 27.3Ta‐27.3Mo‐27.3Ti‐8Cr‐10Al (at.%) refractory high‐entropy alloy with precipitation‐strengthened A2‐B2 microstructure was studied by creep tests at 1030°C, which demonstrate a transition in deformation mechanisms in the range of 100–150 MPa applied stress. This is associated with changes in dislocation–precipitate interactions. Relevant deformation
Liu Yang, Aparajita Pramanik, Sandipan Sen, Shubhashis Dixit, Marcel Muench, R. J. Vikram, Daniel Schliephake, Yolita M. Eggeler, Ankur Chauhan, Martin Heilmaier, Alexander Kauffmann   +10 more
wiley   +1 more source

Pitting Corrosion of Ni3(Si,Ti) Intermetallic Compound at Various Chloride Concentrations

International Journal of Science and Engineering, 2013
The pitting corrosion of Ni3(Si,Ti) intermetallic compound was investigated as function of chloride concentration by using electrochemical method and scanning electron microscope in sodium chloride solutions at 293 K.
Gadang Priyotomo
doaj   +1 more source

Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature

Applied Sciences, 2020
In this study, the effects of electromigration on a solder/copper substrate due to temperature and current density stress were investigated. The copper–tin (Cu–Sn) film samples were subjected under a fixed current and various heating conditions (130 °C ...
Zhao-Ying Wang, Nhat Minh Dang, Po-Hsun Wang, Terry Yuan-Fang Chen, Ming-Tzer Lin   +4 more
doaj   +1 more source

Enhancing the phase stability of TiNi intermetallic compound via nanocrystallization in an irradiated multicomponent vanadium alloy

Materials & Design, 2022
Intermetallic compounds often have a low radiation tolerance due to the low recombination rate of radiation-induced defects. In the present work, we designed a novel multicomponent vanadium-based alloy (MVA), V34Ti25Cr10Ni30Pd1, containing a micron-scale
Z.F. Wu, Y.X. Liang, J.J. Tang, Y.F. Wang, S.L. Zhang, Q.N. Meng, Y. Yan, C. Xu, J. Wang, T.D. Shen, Y.Q. Qiao, E.G. Fu   +11 more
doaj   +1 more source