Results 71 to 80 of about 31,512 (272)

Conductive Bonding and System Architectures for High‐Performance Flexible Electronics

open access: yesAdvanced Functional Materials, EarlyView.
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley   +1 more source

The intermetallic compound BaAgBi

open access: yesActa Crystallographica Section E Structure Reports Online, 2002
BaAgBi was obtained as a by-product when Ba [rod, Alfa–Aesar (99.99%)], Ag [powder, −100 mesh, Alfa–Aesar (99.999%)], and Bi [powder, −100 mesh, Alfa–Aesar (99.999%)] were loaded into a tantalum tube (Nobel-Met. Ltd, >99.85%, 0.375 in. OD) in a 1:1:2 molar ratio in an Ar-filled glovebox.
Kang, Sung Kwon, Miller, Gordon
openaire   +3 more sources

Nanolayer‐Encapsulated Stretchable Liquid‐Metal Sheets for Thermal Management

open access: yesAdvanced Functional Materials, EarlyView.
A stretchable liquid metal sheet with both high thermal conductivity and mechanical flexibility is developed. Its trilayer structure, comprising copper‐particle‐dispersed gallium liquid metal encapsulated by styrene‐butadiene‐styrene nanosheets, shows 40.4 W m−1 K−1 conductivity, elongation exceeding 200%, and retention of 96% of its initial ...
Daisuke Kuse   +16 more
wiley   +1 more source

Unusual weak magnetic exchange in two different structure types: YbPt$_2$Sn and YbPt$_2$In

open access: yes, 2014
We present the structural, magnetic, thermodynamic, and transport properties of the two new compounds YbPt$_2$Sn and YbPt$_2$In. X-ray powder diffraction shows that they crystallize in different structure types, the hexagonal ZrPt$_2$Al and the cubic ...
Brando, Manuel   +6 more
core   +1 more source

Solid-state interdiffusion reactions in Ni/Ti and Ni/Zr multilayered thin films [PDF]

open access: yes, 1987
We have performed a comparative transmission electron microscopy study of solid-state interdiffusion reactions in multilayered Ni/Zr and Ni/Ti thin films.
Fultz, B.   +3 more
core   +1 more source

Frontier Advances of Emerging High‐Entropy Anodes in Alkali Metal‐Ion Batteries

open access: yesAdvanced Functional Materials, EarlyView.
Recent advances in microscopic morphology control of high‐entropy anode materials for alkali metal‐ion batteries. Abstract With the growing demand for sustainable energy, portable energy storage systems have become increasingly critical. Among them, the development of rechargeable batteries is primarily driven by breakthroughs in electrode materials ...
Liang Du   +14 more
wiley   +1 more source

Vacuum Brazing Ti–15–3 with a TiNiNb Braze Alloy

open access: yesMetals, 2019
Among all types of brazing fillers, Ti-based fillers show satisfactory joint strengths in brazing titanium alloys. However, the major concern in using such fillers is the formation of Cu/Ni/Ti intermetallic compound(s) in the joint.
Chuan-Sheng Kao   +3 more
doaj   +1 more source

Enhanced iron magnetic moment in the ThFe11C2 intermetallic compound [PDF]

open access: yes, 2011
International audienceDetailed theoretical investigations on the electronic and magnetic properties of the ThFe11C2 compound have been performed using both the linear muffin-tin orbital and Korringa-Kohn-Rostocker methods of band structure calculation ...
Benea, D.   +4 more
core   +4 more sources

Electrocatalytic Reduction of CO2 to Ethylene: Catalyst Design and Synchrotron‐Based Characterizations

open access: yesAdvanced Functional Materials, EarlyView.
This review evaluates strategies for electrochemical CO2 reduction to ethylene, focusing on copper‐based catalyst design and microenvironment modulation to achieve industrial‐grade performance. By leveraging operando synchrotron‐based characterizations, we provide a multiscale understanding of dynamic structural transformations and key reaction ...
Meng Zhang, Zuolong Chen, Yimin A. Wu
wiley   +1 more source

Ti6Al4V‐Bioglass‐Copper Composites for Load‐Bearing Implants

open access: yesAdvanced Healthcare Materials, EarlyView.
We have designed and manufactured a novel Ti64‐based composite by adding 45S5 bioglass (BG) and copper (Cu). Adding BG on titanium improves wear resistance and biocompatibility, whereas Cu addition improves mechanical strength while providing inherent lifelong bacterial resistance.
Lochan Upadhayay   +3 more
wiley   +1 more source

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