Results 101 to 110 of about 29,057 (291)

Looking for new thermoelectric materials among the TMX intermetallics using high-throughput calculations

, 2018
Within 4 different crystal structures, 2280 ternary intermetallic configurations have been investigated via high-throughput density functional theory calculations in order to discover new semiconducting materials.
Alleno, Eric, Barreteau, Celine, Crivello, Jean-Claude, Joubert, Jean-Marc   +3 more
core   +1 more source

Laser‐Based Solidification of Cermets/Cemented Carbides: Processing‐Microstructure‐Property Relationships

Advanced Materials Technologies, EarlyView.
Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya, Farid Akhtar, Konda Gokuldoss Prashanth   +2 more
wiley   +1 more source

Synthesis of Intermetallics in Fe-Al-Si System by Mechanical Alloying

Metals, 2018
Fe-Al-Si alloys have been recently developed in order to obtain excellent high-temperature mechanical properties and oxidation resistance. However, their production by conventional metallurgical processes is problematic.
Kateřina Nová, Pavel Novák, Filip Průša, Jaromír Kopeček, Jaroslav Čech   +4 more
doaj   +1 more source

Thermoelectric performance of p-type half-Heusler alloys ScMSb (M = Ni, Pd, Pt) by ab initio calculations

, 2018
Structural, electronic, and transport properties of ScNiSb, ScPdSb, and ScPtSb were investigated from first principles. Electronic band structures derived within the fully relativistic MBJLDA approach were compared with those obtained from the standard ...
Bilinska, Kaja, Ciesielski, Kamil, Kaczorowski, Dariusz, Winiarski, Maciej J.   +3 more
core   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

Advanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal, Davey Boss, René H. Poelma, Elias Vlieg, John J. Schermer   +4 more
wiley   +1 more source

Laser Micromachining of Liquid Metal Patterns for Stretchable Electronic Circuits

Advanced Materials Technologies, EarlyView.
A cleanroom‐free fabrication strategy combines UV‐laser micromachining with a copper foil wetting layer to rapidly produce high resolution, liquid metal based stretchable electronic circuits on diverse substrates. The scalable, maskless process enables complex circuit designs (<$<$3 h, ∼$\sim$15/device) with excellent electrical stability under strain,
Merjen Palvanova, Patrick McManigal, Grace Fredrickson, Eric J. Markvicka   +3 more
wiley   +1 more source

Overcoming Printing and Interfacial Challenges in Liquid Metal Direct Writing for Integrated Stretchable Electronics

Advanced Materials Technologies, EarlyView.
Liquid metal direct writing is advanced from a technological and fundamental point. Utilizing a kinematic bed, printing on large surfaces with irregularities is enabled. Furthermore, a pressure‐driven flow during printing is discovered that affects the thickness of traces.
Maximilian Krack, Lennert Purnal, Parth Vinayakrao Sewlikar, Sam Cuyvers, Gus Geurts, Rathul Nengminza Sangma, Derese Desta, Dieter Reenaers, Bart Ruttens, Iris De Graeve, Tom Hauffman, Seppe Terryn, Bram Vanderborght, Michaël Daenen, Wim Deferme, Monika Rai   +15 more
wiley   +1 more source

Advances in Solid‐Phase Processing Techniques: Innovations, Applications, and Future Perspectives

Advanced Materials Technologies, EarlyView.
Based on practical manufacturing challenges, this review examines advanced solid‐phase processing techniques that overcome the inherent limitations of conventional melting‐based and traditional solid‐phase manufacturing, enabling the production of higher‐performance components at reduced cost through process innovation and improved supply‐chain ...
Tianhao Wang
wiley   +1 more source

Recyclable and Binder‐Free EGaIn–Carbon Liquid Metal Composite: A Sustainable Approach for High‐Performance Stretchable Electronics, Thermal‐Interfacing and EMI‐Shielding

Advanced Materials Technologies, EarlyView.
Binder‐free EGaIn–CB composite deliver printable, recyclable liquid‐metal conductors without sintering or polymer binders. Only 1.5 wt% CB yields shear‐thinning, high‐viscosity rheology, ∼60% bulk EGaIn conductivity, robust stretchability, high thermal conductivity, and strong EMI shielding (35 → 70 dB at 100% strain).
Elahe Parvini, Abdollah Hajalilou, Pedro A. Lopes, Tiago A. Morgado, Mahmoud Tavakoli   +4 more
wiley   +1 more source

Incorporating Si into Sb2Se3: Tailoring Optical Phase Change Materials via Nanocomposites

Advanced Optical Materials, EarlyView.
We study the structural, optical, and thermal effects of adding silicon to Sb2Se3 and demonstrate that the as‐deposited solid solution phase segregates after electro‐thermal switching, creating a nanocomposite with effective‐medium properties and a phase‐change response.
Chih‐Yu Lee, Yi‐Siou Huang, Felix Adams, Chuanyu Lian, Hongyi Sun, Jie Zhao, Zichao Ye, Nathan Youngblood, Juejun Hu, Leslie H Allen, Yifei Mo, Ichiro Takeuchi, Carlos A Ríos Ocampo   +12 more
wiley   +1 more source