Results 31 to 40 of about 2,822,028 (303)
Fabrication of wafer-level thermocompression bonding
, 2002 Thermocompression bonding of gold is a promising technique for achieving low temperature, wafer-level bonding. The fabrication process for wafer bonding at 300ºC via compressing gold under 7 MPa of pressure is described in detail.
Tsau, C.H. +2 more
core +1 more source
Evaluation of Cu nano particles addition on the vertical density profile and mechanical properties of medium density fiberboard (MDF) [PDF]
تحقیقات علوم چوب و کاغذ ایران, 2014 This study was conducted to investigate the effect of Cu nano particles addition on the density profile and mechanical properties of medium density fiberboard.
Aliakbar Aenayati +3 more
doaj +1 more source
Spread Overreaction in International Bond Markets [PDF]
SSRN Electronic Journal, 1998 This paper applies the Campbell-Shiller (1987) methodology to a study of the joint behaviour of a three-month and a five-year government yield in the United States, Canada, the United Kingdom, Germany and Japan. The period studied is for most countries the mid-1970s to the third quarter of 1997.
openaire +1 more source
Low temperature thermo compression bonding with printed intermediate bonding layers
, 2022 S.299-310The paper describes capabilities of additive material transfer technologies Aerosol Jet Printing (AJP), Stencil Printing (STP) and Screen Printing (SP) based on nano particle inks with the purpose of intermediate bond layer manufacturing for ...
Wiemer, Maik +5 more
core +1 more source
Influence of bonding level on the bending fatigue behaviour of internal replacement pipe systems [PDF]
Internal replacement pipe (IRP) is a novel trenchless repair technology for rehabilitating legacy gas and oil pipelines. The current knowledge of the behaviour of IRP systems under repetitive traffic loading is limited due to insufficient research work ...
Kiriella, Shanika +7 more
core +1 more source
BioResources, 2023 Self-bonding bamboo particleboards were prepared via hot pressing of bamboo residue fermented by lactic acid bacteria. An orthogonal experiment was designed to investigate the effects of three factors (type of lactic acid bacteria used for fermentation ...
Mingjie Guan +4 more
doaj +2 more sources
Applied Sciences, 2023 Aiming at the lack of a precise discrete element model in the simulation analysis of corn straw crushing, this paper established bond models with different structure and particle models with different properties of corn straw based on Hertz-Mindlin with ...
Wenhang Liu +5 more
doaj +1 more source
Direct bonding with on-wafer metal interconnections
, 2022 S.391-396A low temperature direct bonding process with encapsulated metal interconnections was proposed. The process can be realized between silicon wafers or silicon and glass wafers.
Jia, C., Wiemer, M., Gessner, T.
core +1 more source
FEBS Letters, EarlyView.We present robust protocols for the preparation of supported lipid bilayers (SLBs) incorporating either Salmonella smooth LPS or outer membrane vesicles (OMVs). We use a combination of quartz crystal microbalance with dissipation (QCM‐D) and fluorescence microscopy to both characterize the SLBs of various compositions and to probe their interactions ...
Hudson P. Pace +6 more
wiley +1 more source
Biosensors, 2023 DNA hydrogels have gained significant attention in recent years as one of the most promising functional polymer materials. To broaden their applications, it is critical to develop efficient methods for the preparation of bulk-scale DNA hydrogels with ...
Xinyu Wang +5 more
doaj +1 more source