Results 211 to 220 of about 2,726,774 (304)

Large‐Area 2D Metasurface‐Based Triboelectric E‐Skin Arrays: Contact & Proximity Tactile Mapping with Broadband Acoustic Readouts

open access: yesAdvanced Materials, EarlyView.
Metasurface‐engineered NC‐TENG arrays integrate tactile pressure mapping, non‐contact gesture sensing, and acoustic signal readouts in one ultrathin module, and outperforms pristine PDMS in terms of electrical output and real‐time spatial mapping for next‐gen wearables.
Injamamul Arief   +12 more
wiley   +1 more source

Microenvironment Modulation‐Based Nanomaterial‐Loaded Hydrogel Dressings for Diabetic Foot Ulcers: Research Progress and Future Perspectives

open access: yesAdvanced Materials Interfaces, EarlyView.
xx xx. ABSTRACT Diabetic foot ulcer (DFU) is a chronic complication of diabetes, primarily caused by hyperglycemia, peripheral vascular disease, and neuropathy. Characterized by persistent hyperglycemia, impaired perfusion, inflammation, and infection, DFUs pose significant challenges to healing and are associated with high morbidity and amputation ...
Tang Yuqing   +5 more
wiley   +1 more source

Structured liquid-based reconfigurable all-liquid optical fibers. [PDF]

open access: yesNat Commun
Zhao S   +11 more
europepmc   +1 more source

Tunable Sensitivity in PAN/CNF/PEDOT:PSS Nanofiber‐Based Piezocapacitive Sensors

open access: yesAdvanced Materials Interfaces, EarlyView.
This study demonstrates highly tunable, flexible pressure sensors made from a nanofibrous composite of polyacrylonitrile (PAN) and carbon nanofibers (CNF) or poly(3,4‐ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS). By adjusting filler type, concentration, and mat thickness, the sensors achieve large sensitivity improvements, stable ...
Alireza Gholamhoseini   +4 more
wiley   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

Reconfigurable SiC gratings in PDMS: a portable approach for atmospheric optical communication networks. [PDF]

open access: yesLight Sci Appl
Ma W   +11 more
europepmc   +1 more source

Design and Fabrication of High Dielectric GRIN Lens for a Directive Antenna Using a Hybrid Filled Voxel Additive Manufacturing Technique

open access: yesAdvanced Materials Technologies, EarlyView.
Hybrid‐filled voxel AM enables integration of high‐permittivity materials into additively manufactured devices. Using this approach, a graded refractive index (GRIN) lens is demonstrated, achieving a 50% antenna size reduction with enhanced directivity.
Qianfang Zheng   +4 more
wiley   +1 more source

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