Quantifying Information Distribution in Social Networks: The Structural Entropy Index of Community (SEIC) for Twitter Communication Analysis. [PDF]
Błocki W, Szewczyk M, Adamski A.
europepmc +1 more source
Metasurface‐engineered NC‐TENG arrays integrate tactile pressure mapping, non‐contact gesture sensing, and acoustic signal readouts in one ultrathin module, and outperforms pristine PDMS in terms of electrical output and real‐time spatial mapping for next‐gen wearables.
Injamamul Arief +12 more
wiley +1 more source
Interpersonal communication anxiety in adolescents: scale development and the mediating role of cognitive flexibility in the relationship between perfectionism and anxiety. [PDF]
Kan MO, Demi̇r S.
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xx xx. ABSTRACT Diabetic foot ulcer (DFU) is a chronic complication of diabetes, primarily caused by hyperglycemia, peripheral vascular disease, and neuropathy. Characterized by persistent hyperglycemia, impaired perfusion, inflammation, and infection, DFUs pose significant challenges to healing and are associated with high morbidity and amputation ...
Tang Yuqing +5 more
wiley +1 more source
Structured liquid-based reconfigurable all-liquid optical fibers. [PDF]
Zhao S +11 more
europepmc +1 more source
Tunable Sensitivity in PAN/CNF/PEDOT:PSS Nanofiber‐Based Piezocapacitive Sensors
This study demonstrates highly tunable, flexible pressure sensors made from a nanofibrous composite of polyacrylonitrile (PAN) and carbon nanofibers (CNF) or poly(3,4‐ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS). By adjusting filler type, concentration, and mat thickness, the sensors achieve large sensitivity improvements, stable ...
Alireza Gholamhoseini +4 more
wiley +1 more source
Translation, Cross-Cultural Adaptation, and Psychometric Validation of the TeamSTEPPS® Teamwork Attitudes Questionnaire: A Methodological Study. [PDF]
Velez L +6 more
europepmc +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Reconfigurable SiC gratings in PDMS: a portable approach for atmospheric optical communication networks. [PDF]
Ma W +11 more
europepmc +1 more source
Hybrid‐filled voxel AM enables integration of high‐permittivity materials into additively manufactured devices. Using this approach, a graded refractive index (GRIN) lens is demonstrated, achieving a 50% antenna size reduction with enhanced directivity.
Qianfang Zheng +4 more
wiley +1 more source

