Results 241 to 250 of about 317,446 (301)

Revealing and Engineering Assembly Pathways of 3D DNA Origami Crystals. [PDF]

open access: yesACS Nano
Michelson AN   +5 more
europepmc   +1 more source

A Comparison of Millisecond Annealing of B Implants and Isothermal Annealing for Times of a Few Seconds

open access: yesMRS Proceedings, 1984
ABSTRACTThe annealing behaviour of B implants in the millisecond time regime using a combination of swept line beam and background heating is compared with isothermal annealing with heating cycles of a few seconds.
R. A. Mcmahon   +4 more
openaire   +2 more sources

Polysilicon Grain Growth by Rapid Isothermal Annealing

open access: yesMRS Proceedings, 1984
ABSTRACTone method of reducing the area occupied by a RAM cell is to stack the p- and n-channel devices on top of one another. This “stacked CMOS” structure is a first step towards three dimensional integration. The simplest approach is to use polysilicon as the substrate for the top transistors. This paper describes the results of grain growth studies
R. F. Pinizzotto   +3 more
openaire   +2 more sources

Two-step relaxations in metallic glasses during isothermal annealing

open access: yesIntermetallics, 2018
Isothermal annealing is a very useful strategy in modulating the properties and structures of metallic glasses, which has been regarded as a single relaxation progress.
Juntao Huo, Jun-Qiang Wang, Lijian Song
exaly   +1 more source

The isothermic annealing of bainite

Canadian Metallurgical Quarterly, 1975
AbstractBainitic high carbon steel has been isothermally annealed in the temperature range, 823–973K, in order to follow changes in structure and mechanical properties. The kinetic data for carbide coarsening were found to be in substantial agreement with the Ostwald ripening theory at the higher annealing temperatures. The observed divergence from the
G. Deep, W.M. Williams
openaire   +1 more source

Isothermal annealing of arsenic-implanted silicon

Journal of Physics C: Solid State Physics, 1974
Isothermal annealing studies of arsenic-implanted silicon have been made at temperatures above 550 degrees C for a dose below the amorphization limit. The process appears to follow first-order reaction kinetics with an activation energy of about 1 eV in the temperature range 550-850 degrees C.
F Cappellani, G Restelli, L Spinoni
openaire   +1 more source

The rapid isothermal annealing of tantalum silicide

Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 1985
Abstract Silicon-poor tantalum silicide films cosputtered on polycrystalline silicon over thermal oxide on silicon were rapidly annealed for various temperatures and times using a graphite strip heater. Rutherford backscattering and X-ray diffraction showed rapid formation of a stoichiometric tantalum disilicide via Si diffusion from the ...
K. Daneshvar, R.E. Jones
openaire   +1 more source

The isothermal annealing of boron implanted silicon

Radiation Effects, 1971
Abstract Isothermal annealing studies of boron implanted silicon have been made at temperatures above 600°C for boron doses in the range of 1014 to 1015 ions/cm2. A 5 eV activation energy is obtained in the temperature range 600°C to 900°C. This value is the same as that associated with the generation and subsequent migration of vacancies in silicon ...
T. E. Seidel, A. U. Mac Rae
openaire   +1 more source

Isothermal Annealing of Boron Implanted Silicon

Physica Scripta, 1974
The sheet resistivity has been measured in isothermal annealing studies of 10 kohm cm silicon implanted with 40 keV boron ions. The doses used were 2 x 1012 and 2 x 1014 ions/cm2. The annealing was performed in the temperature range 300 to 800°C and the maximum annealing time used was 4 hours at each temperature.
null S Peterström, null G Holmén
openaire   +1 more source

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