Results 121 to 130 of about 727 (148)
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A Laminated Busbar Design for Multiple IGBT Modules Paralleling

Lecture Notes in Electrical Engineering, 2023
Feng Mu
exaly   +2 more sources

The Method for Decoupling the Parasitic Inductance of the Laminated Busbar with SiC MOSFETs in Parallel

2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia), 2021
Shaolin Yu, Jianing Wang, Xing Zhang
exaly   +2 more sources

Analysis of Mutual Inductance Between Parallel Branches for ANPC Laminated Busbar

2023 IEEE 14th International Symposium on Power Electronics for Distributed Generation Systems (PEDG), 2023
Sideng Hu   +2 more
exaly   +2 more sources

Testing Partial Discharges in Laminated Busbar for Electrified Transportation: An Innovative Approach

2022 IEEE Electrical Insulation Conference (EIC), 2022
Gian Carlo Montanari
exaly   +2 more sources

Analysis of Clearance Effect for Perforated Terminals Isolation of a Laminated Busbar to Parasitic Parameters

2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia), 2022
Keiji Wada
exaly   +2 more sources

On the Likelihood of Partial Discharge Inception in Laminated Busbars from Electrified Ships

2021 IEEE Electric Ship Technologies Symposium (ESTS), 2021
The likelihood of PD inception in Laminated Bus Bars (LBB) in the presence of defects embedded in the insulating material is investigated in this paper. The rationale behind is to understand if there is any potentiality of PD inception in defects internal to resin, considering the design electric fields, but also potential defects that can be present ...
Montanari G. C.   +4 more
openaire   +2 more sources

Multiphysics topology optimization for laminated busbars

2016 IEEE Conference on Electromagnetic Field Computation (CEFC), 2016
Laminated busbars acquire significant importance even if they are a passive component in converters. Their flat and overlapped conducting layers allow good heat dissipation and reduced stray inductance. Topology optimization enables balancing the amount of copper used with the maximum temperature and stray inductance of the busbar.
Oriol Puigdellivol   +4 more
openaire   +1 more source

Design and optimization of laminated busbar to reduce transient voltage spike

2012 IEEE International Symposium on Industrial Electronics, 2012
The presence of loop inductance causes significant surge voltage due to hard-switching operation of voltage source inverters. This generally requires high-voltage rating of switching devices, which results in additional cost and power loss. This paper presents a surge voltage model to study busbar stray inductances in Electric Vehicle systems.
Xuhui Wen, Weidong Xiao
openaire   +1 more source

Design of Laminated Busbar for SiC MOSFETs Dynamic Test Platform

2020 17th China International Forum on Solid State Lighting & 2020 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS), 2020
In order to test the dynamic characteristics of SiC MOSFETs more accurately, it is necessary to redesign the dynamic test platform for SiC MOSFETs. The parasitic inductance of the power circuit of the dynamic test platform is analyzed, and different stacked bus structures are designed according to the test requirements of different devices.
Wang Yi-fan   +5 more
openaire   +1 more source

Feasibility analysis of different conducting and insulation materials used in laminated busbars

Materials Today: Proceedings, 2020
Abstract This paper discusses the DC power distribution topology by means of laminated busbar for medium power applications such as energy storage systems in electric vehicles. The optimized power distribution for laminated busbar is compared for materials such as copper, aluminum and Gold.
R. Karthik Rao   +3 more
openaire   +1 more source

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