Results 91 to 100 of about 68,825 (119)

Design and optimization of laminated busbar to reduce transient voltage spike

2012 IEEE International Symposium on Industrial Electronics, 2012
The presence of loop inductance causes significant surge voltage due to hard-switching operation of voltage source inverters. This generally requires high-voltage rating of switching devices, which results in additional cost and power loss. This paper presents a surge voltage model to study busbar stray inductances in Electric Vehicle systems.
Xuhui Wen, Weidong Xiao 0001
openaire   +2 more sources

Design of Laminated Busbar for SiC MOSFETs Dynamic Test Platform

2020 17th China International Forum on Solid State Lighting & 2020 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS), 2020
In order to test the dynamic characteristics of SiC MOSFETs more accurately, it is necessary to redesign the dynamic test platform for SiC MOSFETs. The parasitic inductance of the power circuit of the dynamic test platform is analyzed, and different stacked bus structures are designed according to the test requirements of different devices.
Wang Yi-fan, Xiangwen Zhu, Zhang Bin, Qing Guo, Jinlong Gong, Zun Wang   +5 more
openaire   +1 more source

Accurate Modeling of the Effective Parasitic Parameters for the Laminated Busbar Connected With Paralleled SiC MOSFETs

IEEE Transactions on Circuits and Systems I: Regular Papers, 2021
Silicon Carbide (SiC) MOSFETs are usually paralleled to increase the current capability for high power applications. While, the asymmetrical parasitic parameters of the wide-used laminated busbar can cause current imbalance for paralleled MOSFETs. The fast switching of SiC devices can further deteriorate the imbalance.
Jianing Wang 0001, Shaolin Yu, Xing Zhang 0010, Zhaoyang Wei, Nan Jiang, Wenjie Chen, Enli Du   +6 more
openaire   +1 more source

Thermal Analysis of the Laminated Busbar System of a Multilevel Converter

IEEE Transactions on Power Electronics, 2016
Laminated busbar systems are commonly used in power electronic converters because of their low stray inductance. While the electromagnetic analysis of a busbar system is widely presented in the literature, there is a lack of accurate thermal modeling. In this paper, the thermal analysis of the busbar system is presented.
Liudmila Smirnova, Raimo Juntunen, Kirill Murashko, Tatu Musikka, Juha Pyrhonen   +4 more
openaire   +1 more source

Investigation, Evaluation, and Optimization of Stray Inductance in Laminated Busbar

IEEE Transactions on Power Electronics, 2014
Wiring inductance has a critical effect on electrical, thermal, and electromagnetic compatibility (EMC) performances in inverters. Therefore, the low stray inductance laminated busbar, as a state-of-the-art pathway interface, is widely used in high-power inverters.
Cai Chen, Xuejun Pei, Yu Chen, Yong Kang
openaire   +1 more source

Modeling and optimization of high power inverter three-layer laminated busbar

2012 IEEE Energy Conversion Congress and Exposition (ECCE), 2012
This paper focuses on the modeling and optimization of the laminated busbar used in high power inverters. First, through the circuit structure analysis, the commutation loops of the laminated busbar are analyzed in a single-phase H-bridge inverter; then, the commutation loops are modeled and simulated via the three-dimensional (3-D) finite element ...
Cai Chen, Xuejun Pei, Yunhao Shi, Xinchun Lin, Xinming Liu, Yong Kang   +5 more
openaire   +1 more source

Optimization of Laminated Busbar for Three-Level NPC Topology Using SiC Module

2020 IEEE 9th International Power Electronics and Motion Control Conference (IPEMC2020-ECCE Asia), 2020
In high power applications, laminated busbar has been used as main connection to reduce the loop stray inductance. Nowadays, the introduction of SiC device brings more strict requirements on busbar design because of its higher switching speed. This paper presents an optimization of busbar for three-level NPC topology using 62mm package SiC module by ...
Yiting Xie, Hongkeng Zhu, Bingyang Li, Jiwen Wei, Kangping Wang, Xu Yang, Laili Wang   +6 more
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Laminated busbar design criteria in power converters for electrified powertrain applications

2014 IEEE Transportation Electrification Conference and Expo (ITEC), 2014
Stray inductance of the DC bus in switching power converters causes transient overvoltages across the power devices, creating a need for higher rated, more costly switches. Moreover, EMI filters become necessary to mitigate the high frequency noise generated by the inductive loop of the busbar.
Mariam Khan, Pierre Magne, Berker Bilgin, Sanjaka Wirasingha, Ali Emadi   +4 more
openaire   +1 more source

A novel double-sided cooling packaging structure of SiC-based half bridge module integrating the laminated busbar

Microelectronics Reliability, 2021
Abstract This paper presents a novel double-sided cooling SiC-based half-bridge (HB) module with laminated busbar. The novelty of this module lies in the integration of a laminated busbar which can result in a significant reduction of the module parasitic inductance. Moreover, a 3D vertical structure design can reduce the commutation loop area inside
Jianing Wang, Yuanjian Liu, Shaolin Yu, Chen Wang, Lijian Ding, Nan Jiang   +5 more
openaire   +1 more source

The Effect of DC Electrothermal Aging on Breakdown Strength of Poly (ethylene terephthalate) Used in Laminated Busbar

2020 IEEE International Conference on High Voltage Engineering and Application (ICHVE), 2020
The effect of DC electrothermal aging on breakdown strength $(\pmb{E}_{\mathbf{b}})$ of polyethylene terephthalate (PET) used in laminated busbar is studied. It is found that a maximum $\pmb{E}_{\mathbf{b}}$ of 837 kV/mm was found for 96 hours' aged sample. The dependence of activation energy of dc conductivity on aging time is investigated.
Lei Xin, Men Guo, Chuang Zhang, Jiao Xiang, Shihang Wang, Xiaotong Zhang, Jianying Li   +6 more
openaire   +1 more source