Results 111 to 120 of about 599 (148)

Feasibility analysis of different conducting and insulation materials used in laminated busbars

Materials Today: Proceedings, 2020
Abstract This paper discusses the DC power distribution topology by means of laminated busbar for medium power applications such as energy storage systems in electric vehicles. The optimized power distribution for laminated busbar is compared for materials such as copper, aluminum and Gold.
R. Karthik Rao, Phaneendra Babu Bobba, T. Suresh Kumar, Satyanarayana Kosaraju   +3 more
openaire   +3 more sources

Comparison Between Different Laminated Aluminum Busbars Expansion Joints in Terms of Mechanical Performance and Relative Costs

Minerals, Metals and Materials Series, 2020
Laminated aluminum expansion joints are an integral part of any busbar system and are commonly used in potline and substation DC circuits. These elements not only transfer electrical current from one rigid conductor to the next, but also deform to absorb thermal expansion in a controlled manner, therefore avoiding the generation of excessive ...
André Felipe Schneider, Daniel Richard, David Leroux, Olivier Charette, Francis Quintal   +4 more
openaire   +3 more sources

Effect of Frequency, Materials and Structural Variations on Stray Parameters of Laminated Busbars

Journal of Electrical Engineering & Technology, 2022
Aravind Venugopal, Femi Robert
openaire   +3 more sources

Effects of Electrothermal Aging on Surface Morphology and Dielectric Properties of Poly(Ethylene Terephthalate) in Laminated Busbars

IEEE Transactions on Dielectrics and Electrical Insulation, 2022
Xiaotong Zhang, Lei Xin, Jian Gao, Kai Yang, Chuang Zhang, Jianying Li   +5 more
openaire   +3 more sources

Design of Laminated Busbar for SiC MOSFETs Dynamic Test Platform

2020 17th China International Forum on Solid State Lighting & 2020 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS), 2020
In order to test the dynamic characteristics of SiC MOSFETs more accurately, it is necessary to redesign the dynamic test platform for SiC MOSFETs. The parasitic inductance of the power circuit of the dynamic test platform is analyzed, and different stacked bus structures are designed according to the test requirements of different devices.
Wang Yi-fan, Xiangwen Zhu, Zhang Bin, Qing Guo, Jinlong Gong, Zun Wang   +5 more
openaire   +1 more source

On the Likelihood of Partial Discharge Inception in Laminated Busbars from Electrified Ships

2021 IEEE Electric Ship Technologies Symposium (ESTS), 2021
The likelihood of PD inception in Laminated Bus Bars (LBB) in the presence of defects embedded in the insulating material is investigated in this paper. The rationale behind is to understand if there is any potentiality of PD inception in defects internal to resin, considering the design electric fields, but also potential defects that can be present ...
Montanari G. C., Ghosh R., Seri P., Defriece P., Schmeller J.   +4 more
openaire   +2 more sources

Design and optimization of laminated busbar to reduce transient voltage spike

2012 IEEE International Symposium on Industrial Electronics, 2012
The presence of loop inductance causes significant surge voltage due to hard-switching operation of voltage source inverters. This generally requires high-voltage rating of switching devices, which results in additional cost and power loss. This paper presents a surge voltage model to study busbar stray inductances in Electric Vehicle systems.
H. Wen, W. Xiao
openaire   +1 more source

Optimization of Laminated Busbar for Three-Level NPC Topology Using SiC Module

2020 IEEE 9th International Power Electronics and Motion Control Conference (IPEMC2020-ECCE Asia), 2020
In high power applications, laminated busbar has been used as main connection to reduce the loop stray inductance. Nowadays, the introduction of SiC device brings more strict requirements on busbar design because of its higher switching speed. This paper presents an optimization of busbar for three-level NPC topology using 62mm package SiC module by ...
Yiting Xie, Hongkeng Zhu, Bingyang Li, Jiwen Wei, Kangping Wang, Xu Yang, Laili Wang   +6 more
openaire   +1 more source

Laminated busbar design criteria in power converters for electrified powertrain applications

2014 IEEE Transportation Electrification Conference and Expo (ITEC), 2014
Stray inductance of the DC bus in switching power converters causes transient overvoltages across the power devices, creating a need for higher rated, more costly switches. Moreover, EMI filters become necessary to mitigate the high frequency noise generated by the inductive loop of the busbar.
Mariam Khan, Pierre Magne, Berker Bilgin, Sanjaka Wirasingha, Ali Emadi   +4 more
openaire   +1 more source

Accurate Modeling of the Effective Parasitic Parameters for the Laminated Busbar Connected With Paralleled SiC MOSFETs

IEEE Transactions on Circuits and Systems I: Regular Papers, 2021
Silicon Carbide (SiC) MOSFETs are usually paralleled to increase the current capability for high power applications. While, the asymmetrical parasitic parameters of the wide-used laminated busbar can cause current imbalance for paralleled MOSFETs. The fast switching of SiC devices can further deteriorate the imbalance.
Jianing Wang, Shaolin Yu, Xing Zhang, Zhaoyang Wei, Nan Jiang, Wenjie Chen, Enli Du   +6 more
openaire   +1 more source