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Optimization of Laminated Busbar for Three-Level NPC Topology Using SiC Module

2020 IEEE 9th International Power Electronics and Motion Control Conference (IPEMC2020-ECCE Asia), 2020
In high power applications, laminated busbar has been used as main connection to reduce the loop stray inductance. Nowadays, the introduction of SiC device brings more strict requirements on busbar design because of its higher switching speed. This paper presents an optimization of busbar for three-level NPC topology using 62mm package SiC module by ...
Yiting Xie   +6 more
openaire   +1 more source

Laminated busbar design criteria in power converters for electrified powertrain applications

2014 IEEE Transportation Electrification Conference and Expo (ITEC), 2014
Stray inductance of the DC bus in switching power converters causes transient overvoltages across the power devices, creating a need for higher rated, more costly switches. Moreover, EMI filters become necessary to mitigate the high frequency noise generated by the inductive loop of the busbar.
Mariam Khan   +4 more
openaire   +1 more source

Feasibility analysis of different conducting and insulation materials used in laminated busbars

Materials Today: Proceedings, 2020
Abstract This paper discusses the DC power distribution topology by means of laminated busbar for medium power applications such as energy storage systems in electric vehicles. The optimized power distribution for laminated busbar is compared for materials such as copper, aluminum and Gold.
R. Karthik Rao   +3 more
openaire   +1 more source

Thermal Analysis of the Laminated Busbar System of a Multilevel Converter

IEEE Transactions on Power Electronics, 2016
Laminated busbar systems are commonly used in power electronic converters because of their low stray inductance. While the electromagnetic analysis of a busbar system is widely presented in the literature, there is a lack of accurate thermal modeling. In this paper, the thermal analysis of the busbar system is presented.
Liudmila Smirnova   +4 more
openaire   +1 more source

Accurate Modeling of the Effective Parasitic Parameters for the Laminated Busbar Connected With Paralleled SiC MOSFETs

IEEE Transactions on Circuits and Systems I: Regular Papers, 2021
Silicon Carbide (SiC) MOSFETs are usually paralleled to increase the current capability for high power applications. While, the asymmetrical parasitic parameters of the wide-used laminated busbar can cause current imbalance for paralleled MOSFETs. The fast switching of SiC devices can further deteriorate the imbalance.
Jianing Wang   +6 more
openaire   +1 more source

Modeling and optimization of high power inverter three-layer laminated busbar

2012 IEEE Energy Conversion Congress and Exposition (ECCE), 2012
This paper focuses on the modeling and optimization of the laminated busbar used in high power inverters. First, through the circuit structure analysis, the commutation loops of the laminated busbar are analyzed in a single-phase H-bridge inverter; then, the commutation loops are modeled and simulated via the three-dimensional (3-D) finite element ...
Cai Chen   +5 more
openaire   +1 more source

Applying laminated busbars to enhance DC power distribution systems

2004 10th International Workshop on Computational Electronics (IEEE Cat. No.04EX915), 2005
The intent of this paper will be an overview of how to design and implement laminated busbars into DC power distribution systems. It will include; electrical, physical and thermal characteristics obtained by utilizing a laminated busbar for DC power distribution.
openaire   +1 more source

A Frequency-domain Method for Stray Parameters Extraction in Arbitrary Section of Laminated Busbars

2020 IEEE Energy Conversion Congress and Exposition (ECCE), 2020
Extraction for non-ideal stray parameters in power electronic systems has received widespread attention. However, the existing researches mostly target on improving the extraction accuracy in a typical region, ignoring the universal extraction method in arbitrary part of circuits.
Mingyang Wang   +3 more
openaire   +1 more source

A novel double-sided cooling packaging structure of SiC-based half bridge module integrating the laminated busbar

Microelectronics Reliability, 2021
Abstract This paper presents a novel double-sided cooling SiC-based half-bridge (HB) module with laminated busbar. The novelty of this module lies in the integration of a laminated busbar which can result in a significant reduction of the module parasitic inductance. Moreover, a 3D vertical structure design can reduce the commutation loop area inside
Jianing Wang   +5 more
openaire   +1 more source

The Effect of DC Electrothermal Aging on Breakdown Strength of Poly (ethylene terephthalate) Used in Laminated Busbar

2020 IEEE International Conference on High Voltage Engineering and Application (ICHVE), 2020
The effect of DC electrothermal aging on breakdown strength $(\pmb{E}_{\mathbf{b}})$ of polyethylene terephthalate (PET) used in laminated busbar is studied. It is found that a maximum $\pmb{E}_{\mathbf{b}}$ of 837 kV/mm was found for 96 hours' aged sample. The dependence of activation energy of dc conductivity on aging time is investigated.
Lei Xin   +6 more
openaire   +1 more source

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