Results 211 to 220 of about 2,775 (244)
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1993
Abstract Laser soldering uses a well-focused, highly controlled beam to deliver energy to a desired location for a precisely measured length of time. This article focuses on two types of laser soldering operations, namely, blind laser soldering and intelligent laser soldering.
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Abstract Laser soldering uses a well-focused, highly controlled beam to deliver energy to a desired location for a precisely measured length of time. This article focuses on two types of laser soldering operations, namely, blind laser soldering and intelligent laser soldering.
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Laser soldering of enameled wires
SPIE Proceedings, 2009In electrical connections with enameled copper wires, isolation material residue can be found in the solder area when the coating is not stripped. This residue can lead to mechanical and electrical problems. In electronic devices and MEMS, quality requirements increase with rising thermal requirements for electrical contacts made from enameled copper
S. Böhm, G. Hemken, K. Noack
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Optics and Lasers in Engineering, 2006
Abstract A novel process for laser soldering of flip-chips on transparent printed circuit board assemblies is presented. The experiments were carried out on silver test patterns printed on glass wafers using a roller-type gravure offset printing method. The contact pads, where the bumps of the flip-chips are positioned, were covered with a thin layer
K. Kordás +6 more
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Abstract A novel process for laser soldering of flip-chips on transparent printed circuit board assemblies is presented. The experiments were carried out on silver test patterns printed on glass wafers using a roller-type gravure offset printing method. The contact pads, where the bumps of the flip-chips are positioned, were covered with a thin layer
K. Kordás +6 more
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Laser Soldering Of Pigtails On Fuses
SPIE Proceedings, 1989Miniature fuses are provided with end wires, so called pigtails, for mounting purposes. The process of laser soldering of the pigtails directly on the endcaps of the finished fuses is developed. It is demonstrated that this process is feasible for production purpose. The process has been patented.
Martien H. H. van Dijk +2 more
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Laser beam soldering: an attractive alternative to conventional soldering technologies
SPIE Proceedings, 2003Laser beam soldering (LBS) is a non-standard manufacturing process for electronic packaging and interconnection technology today. Due to the actual trend towards complex and cost intensive products, LBS gains more attention for certain applications in this field.
Luedger Bosse +4 more
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Free-electron laser tissue-soldering in vitro with an albumin solder
SPIE Proceedings, 2000The purpose of this study was to explore the feasibility of using a free-electron laser (FEL) to photothermally coagulate an albumin solder for laser-assisted incision closure. A 50%(w/v) bovine serum albumin solder was used to repair an incision in bovine aorta.
Brian S. Sorg +4 more
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Laser Inspection Or Soldered Connections
SPIE Proceedings, 1986A sensitive infrared detection system monitors the slight warming and cooling of a solder joint on a PWB in response to a focused laser beam pulse lasting for 30 milliseconds. Heating and cooling rates depend on the surface finish of the solder and also upon its interr.1 features.
Richard I. Alper, Alan C. Traub
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Interactions of fibroblasts with soldered and laser-welded joints
Biomaterials, 2004Relatively little is known about the biocompatibility of the soldered or laser-welded joints of dental appliances. We investigated the reaction of human gingival fibroblasts cultured in vitro in direct contact with samples of soldered and laser-welded joints from orthodontic lingual arches.
SOLMI, ROSSELLA +7 more
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Albumin–genipin solder for laser tissue repair
Lasers in Surgery and Medicine, 2004AbstractBackgroundLaser tissue soldering (LTS) is an alternative technique to suturing for tissue repair that avoids foreign body reaction and provides immediate sealing of the wound. One of the major drawbacks of LTS, however, is the weak tensile strength of the solder welds when compared to sutures.
A, Lauto +5 more
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Interfacial reaction on different solder composition after laser soldering
Materialwissenschaft und WerkstofftechnikAbstractThis study used electroless nickel‐immersion gold surface finish. The lead free solder used are tin‐silver‐copper 305 and tin‐silver‐copper 307 solder alloys. The difference in copper composition will affect the intermetallic compound′s microstructure after the laser soldering process.
F. Muhamad Razizy +2 more
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