Results 201 to 210 of about 2,775 (244)
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Optimal solder and power density for diode laser tissue soldering (LTS)
Lasers in Surgery and Medicine, 2001AbstractBackground and ObjectiveLaser tissue soldering (LTS) using albumin and indocyanine green dye (ICG) is an effective technique utilized in various reconstructive surgical procedures. The purpose of this study was to describe in vivo and in vitro temperature profiles of an albumin‐based solder while varying ICG concentration and laser power ...
C S, Cooper +3 more
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2014 International Conference on Electronics Packaging (ICEP), 2014
Recently, a high accuracy soldering method is required. Then, laser soldering has attracted attention. In laser soldering, it is difficult to detect an optimal laser condition depending on production conditions, because the amount of heat transfer from solder through copper wiring is different in circuit boards and soldering positions.
Dai Imai +4 more
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Recently, a high accuracy soldering method is required. Then, laser soldering has attracted attention. In laser soldering, it is difficult to detect an optimal laser condition depending on production conditions, because the amount of heat transfer from solder through copper wiring is different in circuit boards and soldering positions.
Dai Imai +4 more
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A New Dispensing Solder Paste for Laser Soldering Technology
Soldering and Reliability Conferences, 2016ABSTRACT Laser soldering method becomes attractive in the packaging and assembly of surface-mounted devices and microelectronics. The method transfers laser energy for reflow process with a non-contact procedure and determines the soldering location precisely.
Hsiang-Chuan Chen +4 more
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Development of high speed laser soldering process for lead-free solder with diode-laser
SPIE Proceedings, 2003The compactness of electronic equipments is leading the narrow pitch assembly of components on board or film by soldering. Diode-laser soldering system had already been realized as a high-density assembly process; however, the soldering quality became unstable when the system targeted to achieve short time, such as sub second, soldering, i.e.
Jing-bo Wang +7 more
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Absorption Behaviour of Solder Pastes in Laser Soldering
1994The aim of these investigations is to examine various solder pastes for their absorption behaviour with respect to laser beam of wavelength of 1.06 μm. It is intended to varify the importance of absorption of flux over metallic composition and reactivity of flux.
Christoph Hamann +3 more
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Laser soldering of articular cartilage
SPIE Proceedings, 2001The surgical treatment of full thickness cartilage defects in the knee joint remains a therapeutic challenge. Recently, new techniques for articular cartilage transplantation, such as mosaicplasty, have become available for cartilage repair. The long-term success of these techniques, however, depends not only on the chondrocyte viability, but also on a
Benno J. Zueger +6 more
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The Journal of the Acoustical Society of America, 1991
Laser soldering in a tape automated bonding procedure is carried out on outer ends of a number of high density leads (72) printed on a film (78) of mylar and having inner ends connected to a circuit chip (70). The outer ends of the leads are soldered, without the use of flux, by application of heat and ultrasonic energy in a timed program while ...
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Laser soldering in a tape automated bonding procedure is carried out on outer ends of a number of high density leads (72) printed on a film (78) of mylar and having inner ends connected to a circuit chip (70). The outer ends of the leads are soldered, without the use of flux, by application of heat and ultrasonic energy in a timed program while ...
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Laser processing of solder mask
ICALEO 2005: 24th International Congress on Laser Materials Processing and Laser Microfabrication, 2005The manufacturing of printed circuit boards (PCBs) is carried out traditionally with fotoresist and etching. The board is usually coated with solder mask after processing of wiring. The pressure from the constant need of ever smaller features in electronics has, however, caused also need to manufacture circuits with smaller feature size and better ...
Antti Salminen, Tony Vesterinen
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Laser Soldering of Sn-based Solders with Different Melting Points
2020 21st International Conference on Electronic Packaging Technology (ICEPT), 2020With the miniaturization and multi-functionalization of electronic devices, a large number of electronic components with various requirements on the interconnections and packaging need to be integrated on one substrate. There are specific cases when it is necessary to use a series of solders with the melting points in a wide range.
Hua Chen +3 more
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Semiconductor Diode Lasers for Soldering
Hybrid Circuits, 1992The application of laser technology has recently become economically viable for microelectronics and surface mount technology. Semiconductor laser technology may prove to be the only technology capable of solving the assembly problems that will accompany further advances in microelectronics.
D.G. Whitehead +2 more
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