Results 181 to 190 of about 1,156,431 (219)
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The Journal of the Acoustical Society of America, 1991
Laser soldering in a tape automated bonding procedure is carried out on outer ends of a number of high density leads (72) printed on a film (78) of mylar and having inner ends connected to a circuit chip (70). The outer ends of the leads are soldered, without the use of flux, by application of heat and ultrasonic energy in a timed program while ...
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Laser soldering in a tape automated bonding procedure is carried out on outer ends of a number of high density leads (72) printed on a film (78) of mylar and having inner ends connected to a circuit chip (70). The outer ends of the leads are soldered, without the use of flux, by application of heat and ultrasonic energy in a timed program while ...
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Optics and Lasers in Engineering, 2006
Abstract A novel process for laser soldering of flip-chips on transparent printed circuit board assemblies is presented. The experiments were carried out on silver test patterns printed on glass wafers using a roller-type gravure offset printing method. The contact pads, where the bumps of the flip-chips are positioned, were covered with a thin layer
K. Kordás +6 more
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Abstract A novel process for laser soldering of flip-chips on transparent printed circuit board assemblies is presented. The experiments were carried out on silver test patterns printed on glass wafers using a roller-type gravure offset printing method. The contact pads, where the bumps of the flip-chips are positioned, were covered with a thin layer
K. Kordás +6 more
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Laser Soldering of Sn-based Solders with Different Melting Points
2020 21st International Conference on Electronic Packaging Technology (ICEPT), 2020With the miniaturization and multi-functionalization of electronic devices, a large number of electronic components with various requirements on the interconnections and packaging need to be integrated on one substrate. There are specific cases when it is necessary to use a series of solders with the melting points in a wide range.
Hua Chen +3 more
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Laser processing of solder mask
ICALEO 2005: 24th International Congress on Laser Materials Processing and Laser Microfabrication, 2005The manufacturing of printed circuit boards (PCBs) is carried out traditionally with fotoresist and etching. The board is usually coated with solder mask after processing of wiring. The pressure from the constant need of ever smaller features in electronics has, however, caused also need to manufacture circuits with smaller feature size and better ...
Antti Salminen, Tony Vesterinen
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Laser soldering of enameled wires
SPIE Proceedings, 2009In electrical connections with enameled copper wires, isolation material residue can be found in the solder area when the coating is not stripped. This residue can lead to mechanical and electrical problems. In electronic devices and MEMS, quality requirements increase with rising thermal requirements for electrical contacts made from enameled copper
S. Böhm, G. Hemken, K. Noack
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Laser Inspection Or Soldered Connections
SPIE Proceedings, 1986A sensitive infrared detection system monitors the slight warming and cooling of a solder joint on a PWB in response to a focused laser beam pulse lasting for 30 milliseconds. Heating and cooling rates depend on the surface finish of the solder and also upon its interr.1 features.
Richard I. Alper, Alan C. Traub
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Laser Soldering Of Pigtails On Fuses
SPIE Proceedings, 1989Miniature fuses are provided with end wires, so called pigtails, for mounting purposes. The process of laser soldering of the pigtails directly on the endcaps of the finished fuses is developed. It is demonstrated that this process is feasible for production purpose. The process has been patented.
Martien H. H. van Dijk +2 more
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Semiconductor Diode Lasers for Soldering
Hybrid Circuits, 1992The application of laser technology has recently become economically viable for microelectronics and surface mount technology. Semiconductor laser technology may prove to be the only technology capable of solving the assembly problems that will accompany further advances in microelectronics.
D.G. Whitehead +2 more
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Free-electron laser tissue-soldering in vitro with an albumin solder
SPIE Proceedings, 2000The purpose of this study was to explore the feasibility of using a free-electron laser (FEL) to photothermally coagulate an albumin solder for laser-assisted incision closure. A 50%(w/v) bovine serum albumin solder was used to repair an incision in bovine aorta.
Brian S. Sorg +4 more
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Laser beam soldering: an attractive alternative to conventional soldering technologies
SPIE Proceedings, 2003Laser beam soldering (LBS) is a non-standard manufacturing process for electronic packaging and interconnection technology today. Due to the actual trend towards complex and cost intensive products, LBS gains more attention for certain applications in this field.
Luedger Bosse +4 more
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