Results 31 to 40 of about 2,775 (244)
Photonic flip-chip assembly of InP on TriPleX with laser soldering [PDF]
, 2022 We present a photonic flip-chip assembly for a 4 mm × 4.6 mm InP die with 58 electrical connections on a 16 mm × 8 mm TriPleX die by using laser soldering. Two laser soldering schemes are investigated and show reliable contacts with a 6 N shear force: (1)
Khachikyan, Alexander +9 more
core +2 more sources
Laser soldering of sapphire substrates using a BaTiAl6O12 thin-film glass sealant
, 2022 S.153-161Two sapphire substrates are tightly bonded through a BaTiAl6O12-glass thin film, by irradiation with a nanosecond laser. After the laser process, the composition of the glass sealant changes, due to incorporation of Al2O3 from the upper ...
Lorenz, M. +6 more
core +1 more source
Laser-Induced Period Surface Structures to Improve Solderability of Electrical Solder Pads
Applied Sciences, 2021 We report on structuring copper representing soldering pads of printed circuit boards by laser-induced periodic surface structures. Femtosecond laser radiation is used to generate low spatial frequency laser-induced surface structures, having a spatial ...
Stefan Rung, Ralf Hellmann
doaj +1 more source
Submicron accuracy optimization for laser beam soldering processes
, 2022 Paper 758505Laser beam soldering is a packaging technology alternative to polymeric adhesive bonding in terms of stability and functionality. Nevertheless, when packaging especially micro optical and MOEMS systems this technology has to fulfil stringent ...
Beckert, E. +7 more
core +1 more source
Open-source colorimeter assembled from laser-cut plates and plug-in circuits
HardwareX, 2021 Colorimetric analysis is a fundamental technique for quantifying the concentration of a substance in solution. It is frequently used in primary and secondary education to enhance students’ interest in chemistry, biology, life science, and environmental ...
Kosaku Kurata
doaj +1 more source
Solderjet bumping packaging technique optimization for the miniaturization of laser devices
Journal of the European Optical Society-Rapid Publications, 2017 Background Low-stress soldering techniques can guarantee a minimized input of thermal energy allowing for the design and later assembly of more robust and miniaturized optical devices.
P. Ribes-Pleguezuelo +6 more
doaj +1 more source
A Simplified Technique for the Fabrication of Esthetic and Functional Space Maintainers in Pediatric Dentistry. [PDF]
J Esthet Restor DentABSTRACT Introduction Premature loss of primary molars remains a frequent clinical problem in pediatric dentistry and may lead to space loss, occlusal disturbances, and the need for future orthodontic intervention. Conventional space maintainers, such as the band‐and‐loop appliance, are effective in preserving arch length but do not restore occlusal ...
Caldas LD +3 more
europepmc +2 more sources
Optimization Of Laser Soldering Parameters On Passive Devices [PDF]
, 2022 Laser soldering is a non-contact process that is important in soldering technology for miniature components because it can emit a controlled heating from laser beam to a specific location of solder joint and this process also can prevent damaging other
Ahmad Nadzri, Faiz Farhan
core
Journal of Materials Research and TechnologyThis study introduces a novel method for integrating aluminum flexible printed circuit boards (FPCBs) and copper FPCBs into battery management systems (BMS) using and instantaneous large area facial laser source soldering.
Seoah Kim +8 more
doaj +1 more source
Dissimilar Welding and Joining of Cemented Carbides
Metals, 2019 Cemented carbides have been widely used in aerospace, biomedical/wearable sensor, automobile, microelectronic, and other manufacturing industries owing to their superior physical and chemical properties at elevated temperatures. These superior properties,
Binghui Ma +5 more
doaj +1 more source