Results 41 to 50 of about 2,775 (244)

Comparative study on the bonding property of laser and reflow soldered Sn-3.0Ag-0.5Cu/Ni–P microbumps after isothermal aging and multiple reflowing

Journal of Materials Research and Technology
Laser soldering has attracted attention in microbumps joining field due to its noncontact and localized heating, a short joining time, fluxless and easy automation. In this study, Sn-3.0Ag-0.5Cu/Ni–P microbumps were prepared by laser soldering and reflow
Yang Wu, Zhijie Zhang, Leida Chen, Shuye Zhang   +3 more
doaj   +1 more source

Low-cost electronic circuitry for photoacoustic gas sensing

HardwareX, 2022
The circuitry comprises a sine wave generator based on direct digital synthesis, a laser diode driver module, a band-pass frequency filter, a synchronous detector with phase adjustment circuitry and a low pass filter to form an analog lock-in amplifier ...
Kanchalar Keeratirawee, Jasmine S. Furter, Peter C. Hauser   +2 more
doaj   +1 more source

Laser soldering and laser droplet joining for mechanical and electrical contacting of LTCC/PZT laminates

, 2022
S.75-80Present research in the field of active noise reduction for automotive components deals with piezoelectric laminates embedded into parts like aluminium gear boxes, car bodies or clutch housings fabricated by die casting or forced-locked insertion.
Flössel, Markus, Schmidt, Michael, Geiger, Manfred, Albert, Florian, Pfeiffer, Carolin, Michaelis, Alexander   +5 more
core   +1 more source

Hot‐Film and Calorimetric Methods With Transient Heating for Measurement of High Biofluid Flow Rate

Advanced Functional Materials, EarlyView.
Accurate measurement of biofluid flow rate is vital for clinical diagnostics. We propose a transient heating strategy using short thermal pulses and peak temperature tracking to enhance the flow sensitivity of the hot‐Film and calorimetric methods. Simulations show how optimal heating time maximizes sensitivity across flow rates.
Yuanting Wei, Shupeng Li, Kyung Rok Pyun, Tianyu Yang, Bosung Kim, Haotian Yang, John A. Rogers, Yonggang Huang, Haohui Zhang   +8 more
wiley   +1 more source

High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology

, 2012
High power semiconductor laser arrays have found increased applications in many fields. In this work, a hard soldering microchannel cooler (HSMCC) technology was developed for packaging high power diode laser array.
Lingling Xiong, Kang, Lijun, Xingsheng Liu, Xiong, Lingling, Wang, Jingwei, Pu Zhang, Li, Xiaoning, Zhiqiang Nie, Liu, Xingsheng, Xiaoning Li, Jingwei Wang, Lijun Kang, Nie, Zhiqiang, Zhang, Pu   +13 more
core   +1 more source

Plasmon-enhanced nanosoldering of silver nanoparticles for high-conductive nanowires electrodes

Opto-Electronic Advances, 2021
The silver nanowires (Ag NWs) electrodes, which consist of incompact Ag nanoparticles (NPs) formed by multi-photon photoreduction, usually have poor conductivities.
Yuan-Yuan Zhao, Xue-Liang Ren, Mei-Ling Zheng, Feng Jin, Jie Liu, Xian-Zi Dong, Zhen-Sheng Zhao, Xuan-Ming Duan   +7 more
doaj   +1 more source

Optimization Of Laser Soldering Parameters On Passive Devices [PDF]

, 2021
Laser soldering is a non-contact process that important in soldering technology for miniature components because it can emit a controlled heating from laser beam to a specific location of solder joint and this process also can prevent damaging other ...
Nazarudin, Muhammad Zaim Hanif
core  

Flip-Chip Bonding of InP Die on SiN-Based TriPleX Carrier With Novel Laser Soldering [PDF]

, 2023
In this paper, we present a flip-chip bonding concept for InP die on SiN-based TriPleX carrier using laser soldering. The InP die and SiN-based TriPleX carrier include the metalization patterns for commonly used photonic integrated circuit reference ...
Kerstin Wörhoff, Christoph Mittelstädt, Leijtens, Xaveer J.M.; id_orcid, Beste, Lucas, van Kerkhof, Joost, Santos, Rui, Alexander Khachikyan, Rui Santos, Khachikyan, Alexander, Wörhoff, Kerstin, Lucas Beste, Kevin Williams, Joost Van Kerkhof, Dekker, Ronald, Ronald Dekker, Williams, Kevin A., Mittelstädt, Christoph, Xaveer Leijtens, Tian, Wenjing ; id_orcid, Wenjing Tian   +19 more
core   +1 more source

Swelling‐Induced Stress‐Assisted Transfer of Nanodiamond Arrays With a PVA Carrier Tape for Conformal Bio‐Integrated Sensing and Labelling

Advanced Functional Materials, EarlyView.
This work introduces a swelling‐induced, stress‐assisted water‐soluble PVA tape strategy to transfer‐print nanodiamond quantum‐sensor arrays onto soft, curved biological interfaces. The room‐temperature, water‐triggered process achieves >98% fidelity and residue‐free integration, enabling conformal quantum sensing on contact lenses, neural probes, and ...
Luyao Zhang, Lingzhi Wang, Xinhao Hu, Tai Nam Yip, Mingze Sun, Jixiang Jing, Lizhi Xu, Yuan Lin, Yong Hou, Zhiqin Chu   +9 more
wiley   +1 more source

Electroplating and Ablative Laser Structuring of Elastomer Composites for Stretchable Multi-Layer and Multi-Material Electronic and Sensor Systems

Micromachines, 2021
In this work we present the concept of electroplated conductive elastomers and ablative multi-layer and multi-material laser-assisted manufacturing to enable a largely automated, computer-aided manufacturing process of stretchable electronics and sensors.
Simon P. Stier, Holger Böse
doaj   +1 more source