Results 51 to 60 of about 4,291,211 (383)
High-Yield of Memory Elements from Carbon Nanotube Field-Effect Transistors with Atomic Layer Deposited Gate Dielectric [PDF]
, 2008 Carbon nanotube field-effect transistors (CNT FETs) have been proposed as possible building blocks for future nano-electronics. But a challenge with CNT FETs is that they appear to randomly display varying amounts of hysteresis in their transfer ...
Johansson, Andreas +6 more
core +4 more sources
Room-temperature high-precision printing of flexible wireless electronics based on MXene inks
Nature Communications, 2022 Wireless technologies-supported printed flexible electronics are crucial for the Internet of Things (IoTs), human-machine interaction, wearable and biomedical applications.
Yuzhou Shao +10 more
semanticscholar +1 more source
Substrate‐Free Transfer of Large‐Area Ultra‐Thin Electronics
Advanced Electronic Materials, 2023 Innovation in materials and technologies has promoted the fabrication of thin‐film electronics on substrates previously considered incompatible because of their chemical or mechanical properties.
Hugo De Souza Oliveira +5 more
doaj +1 more source
Cold cathodes based on carbonic nanostructured layered structures [PDF]
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, 2013 The paper describes formation conditions for and the structure of diamond-like materials films used in the manufacture of layered cold cathodes of emission electronics devices.
Belyanin A. F. +3 more
doaj
Frontiers in Chemistry, 2022 Liquid metal-based electronic devices are attracting increasing attention owing to their excellent flexibility and high conductivity. However, a simple way to realize liquid metal electronics on a microscale without photolithography is still challenging.
Jingzhou Zhang +6 more
doaj +1 more source
Surface morphology of polyimide thin film dip-coated on polyester filament for dielectric layer in fibrous organic field effect transistor [PDF]
, 2014 The idea of wearable electronics automatically leads to the concept of integrating electronic functions on textile substrates. Since this substrate type implies certain challenges in comparison with their rigid electronic companions, it is of utmost ...
Bruneel, Els +3 more
core +1 more source
InGaAs/InP double heterostructures on InP/Si templates fabricated by wafer bonding and hydrogen-induced exfoliation [PDF]
, 2003 Hydrogen-induced exfoliation combined with wafer bonding has been used to transfer ~600-nm-thick films of (100) InP to Si substrates. Cross-section transmission electron microscopy (TEM) shows a transferred crystalline InP layer with no observable ...
Ahrenkiel, S. P. +4 more
core +1 more source
Electronics, 2018 There has been increasing interests in the use of double layer capacitors (DLCs)—most commonly referred to as supercapacitors (SCs), ultra-capacitors (UCs), or hybrid capacitors (HCs)—in the field of power electronics.
I. N. Jiya, Nicoloy Gurusinghe, R. Gouws
semanticscholar +1 more source
High Dielectric Breakdown Strength Nanoplatelet‐Based Multilayer Thin Films
Macromolecular Materials and Engineering, 2023 Dielectric materials that can withstand high voltages are of great interest due to the growing need for high‐performance insulation systems in electronics. Polymer nanocomposites have gained popularity as electrical insulators due to their processability,
Bethany Palen +8 more
doaj +1 more source
Ion traps fabricated in a CMOS foundry [PDF]
, 2014 We demonstrate trapping in a surface-electrode ion trap fabricated in a 90-nm CMOS (complementary metal-oxide-semiconductor) foundry process utilizing the top metal layer of the process for the trap electrodes.
A. M. Eltony +8 more
core +2 more sources