Results 61 to 70 of about 4,474,374 (408)
Nature Communications, 2017 High-density information storage calls for the development of modern electronics with multiple stacking architectures that increase the complexity of three-dimensional interconnectivity. Here, Wu et al.
Chaoxing Wu +4 more
doaj +1 more source
Zinc hybrid sintering for printed transient sensors and wireless electronics
npj Flexible Electronics, 2023 Transient electronics offer a promising solution for reducing electronic waste and for use in implantable bioelectronics, yet their fabrication remains challenging.
N. Fumeaux, D. Briand
doaj +1 more source
Sensors, 2014 Recharging implantable electronics from the outside of the human body is very important for applications such as implantable biosensors and other implantable electronics.
Yong Song +5 more
doaj +1 more source
Metals, 2021 With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed ...
Do Hoon Cho +4 more
doaj +1 more source
Monolithic Pixel Sensors in Deep-Submicron SOI Technology with Analog and Digital Pixels
, 2008 This paper presents the design and test results of a prototype monolithic pixel sensor manufactured in deep-submicron fully-depleted Silicon-On-Insulator (SOI) CMOS technology.
Battaglia +19 more
core +1 more source
Monolithic Pixel Sensors in Deep-Submicron SOI Technology
, 2009 Monolithic pixel sensors for charged particle detection and imaging applications have been designed and fabricated using commercially available, deep-submicron Silicon-On-Insulator (SOI) processes, which insulate a thin layer of integrated full CMOS ...
+11 more
core +1 more source
InGaAs/InP double heterostructures on InP/Si templates fabricated by wafer bonding and hydrogen-induced exfoliation [PDF]
, 2003 Hydrogen-induced exfoliation combined with wafer bonding has been used to transfer ~600-nm-thick films of (100) InP to Si substrates. Cross-section transmission electron microscopy (TEM) shows a transferred crystalline InP layer with no observable ...
Ahrenkiel, S. P. +4 more
core +1 more source
Proceedings of the Royal Society A, 2016 Multi-layer structures with soft (compliant) interlayers have been widely used in flexible electronics and photonics as an effective design for reducing interactions among the hard (stiff) layers and thus avoiding the premature failure of an entire ...
Shuang Li, Yewang Su, Rui Li
semanticscholar +1 more source
The Layer 0 Inner Silicon Detector of the D0 Experiment
, 2009 This paper describes the design, fabrication, installation and performance of the new inner layer called Layer 0 (L0) that was inserted in the existing Run IIa Silicon Micro-Strip Tracker (SMT) of the D0 experiment at the Fermilab Tevatron collider.
A. Bean +54 more
core +1 more source
Josephson Effects in Double-Layer Quantum Hall States [PDF]
, 1998 Under quite plausible assumptions on double-layer quantum Hall states with strong interlayer correlation, we show in general framwork that coherent tunneling of a single electron between two layers is possible. It yields Josephson effects with unit charge tunneling.
arxiv +1 more source