Results 61 to 70 of about 4,291,211 (383)

Flexible three-dimensional artificial synapse networks with correlated learning and trainable memory capability

Nature Communications, 2017
High-density information storage calls for the development of modern electronics with multiple stacking architectures that increase the complexity of three-dimensional interconnectivity. Here, Wu et al.
Chaoxing Wu, Tae Whan Kim, Hwan Young Choi, Dmitri B. Strukov, J. Joshua Yang   +4 more
doaj   +1 more source

Graphene field-effect-transistors with high on/off current ratio and large transport band gap at room temperature

, 2010
Graphene is considered to be a promising candidate for future nano-electronics due to its exceptional electronic properties. Unfortunately, the graphene field-effect-transistors (FETs) cannot be turned off effectively due to the absence of a bandgap ...
Appenzeller J., Castro E. V., Chen Z., Farmer D. B., Han M. Y., Li X., Mak K. F., McCann E., Min H., Ni Z. H., Novoselov K. S., Novoselov K. S., Ohta T., Oostinga J. B., Pereira V. M., Ritter K. A., Ryzhii V., San-Jose P., Sze S. M., Tonouchi M., Wang F., Wang X., Xia F., Zhang Y., Zhang Y., Zhou S. Y.   +25 more
core   +1 more source

Single-Layer Graphene-Based Transparent and Flexible Multifunctional Electronics for Self-Charging Power and Touch-Sensing Systems.

ACS Applied Materials and Interfaces, 2019
Applications in the field of portable and wearable electronics are becoming multifunctional, and the achievement of transparent electronics extensively expands the applications into devices such as wearable flexible displays or skin-attachable mobile ...
Sungwoo Chun, Wonkyeong Son, Gwangyeob Lee, Shi-Hyeong Kim, J. W. Park, Seon Jeong Kim, Changhyun Pang, Changsoon Choi   +7 more
semanticscholar   +1 more source

Flexible supercapacitor electrodes based on real metal-like cellulose papers

Nature Communications, 2017
With ligand-mediated layer-by-layer assembly between metal nanoparticles and small organic molecules, the authors prepare metallic paper electrodes for supercapacitors with high power and energy densities.
Yongmin Ko, Minseong Kwon, Wan Ki Bae, Byeongyong Lee, Seung Woo Lee, Jinhan Cho   +5 more
doaj   +1 more source

The Layer 0 Inner Silicon Detector of the D0 Experiment

, 2009
This paper describes the design, fabrication, installation and performance of the new inner layer called Layer 0 (L0) that was inserted in the existing Run IIa Silicon Micro-Strip Tracker (SMT) of the D0 experiment at the Fermilab Tevatron collider.
A. Bean, A. Nomerotski, A. Zieminski, C.E. Gerber, C.H. Daly, Cooper, D. Buchholz, D. Butler, D. Markley, D. Olis, D. Strom, D. Tsybychev, E. Shabalina, F. Lehner, G.J. Otero y Garzón, Garcia-Sciveres, H. Gonzalez, H. Guldenman, H.J. Lubatti, J. Foglesong, J. Green, J. Howell, J. Wang, K. Hanagaki, K. Herner, K. Krempetz, K. Schultz, Krieger, L. Bagby, L. Christofek, Lutz, M. Demarteau, M. Hrycyk, M. Johnson, M. Kirby, M. Matulik, M. Roman, M. Tuttle, M. Utes, M. Weber, R. Angstadt, R. Lipton, R. Rucinski, R.D. Taylor, R.L. McCarthy, R.P. Smith, S.W. Youn, T. Bolton, T. Wesson, T. Zhou, W. Kuykendall, W.E. Cooper, Y. Orlov, Zimmerman, Zimmerman   +54 more
core   +1 more source

Electrical Control of Silicon Photonic Crystal Cavity by Graphene [PDF]

, 2012
Efficient conversion of electrical signal to optical signal in nano-photonics enables solid state integration of electronics and photonics. Combination of graphene with photonic crystals is promising for electro-optic modulation.
Kim, Jonghwan, Majumdar, Arka, Vuckovic, Jelena, Wang, Feng   +3 more
core   +1 more source

Monolithic Pixel Sensors in Deep-Submicron SOI Technology

, 2009
Monolithic pixel sensors for charged particle detection and imaging applications have been designed and fabricated using commercially available, deep-submicron Silicon-On-Insulator (SOI) processes, which insulate a thin layer of integrated full CMOS ...
, C Q Vu, D Bisello, D Contarato, F. Gaede ., L Glesener, M Battaglia, P Denes, P Giubilato, P. Giubilato ., R. Brun, S Mattiazzo   +11 more
core   +1 more source

3D Printing of Multilayered and Multimaterial Electronics: A Review

Advanced Electronic Materials, 2021
3D printing, also known as additive manufacturing, is a manufacturing process in which the materials are deposited layer by layer in an additive manner.
G. L. Goh, Haining Zhang, T. H. Chong, W. Yeong   +3 more
semanticscholar   +1 more source

A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process

Metals, 2021
With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed ...
Do Hoon Cho, Seong Min Seo, Jang Baeg Kim, Sri Harini Rajendran, Jae Pil Jung   +4 more
doaj   +1 more source

Optimizing the speed of a Josephson junction

, 2002
We review the application of dynamical mean-field theory to Josephson junctions and study how to maximize the characteristic voltage IcRn which determines the width of a rapid single flux quantum pulse, and thereby the operating speed in digital ...
Andreev A. F., B. K. NIKOLIĆ, Golubov A. A., Gor’kov L. P., Greene L. H., J. K. FREERICKS, Kulik I. O., Nikolić B. K., Nikolić B. K., P. MILLER, Sharvin Yu. V., Yu M., Zaitsev A. V.   +12 more
core   +1 more source