Results 111 to 120 of about 299,152 (273)
The derivation algebra and automorphism group of the electrical Lie algebra of type D5
In this paper, we mainly investigate the derivation algebra and automorphism group of type D5 electrical Lie algebra. We prove that the outer derivations are four-dimensional, and the automorphism group Aut $\mathcal{L} \cong \mathbb{C}^* \ltimes\left ...
LI Zhiling, SHEN Ran
doaj +1 more source
Phase Field Failure Modeling: Brittle‐Ductile Dual‐Phase Microstructures under Compressive Loading
The approach by Amor and the approach by Miehe and Zhang for asymmetric damage behavior in the phase field method for fracture are compared regarding their fitness for microcrack‐based failure modeling. The comparison is performed for the case of a dual‐phase microstructure with a brittle and a ductile constituent.
Jakob Huber, Jan Torgersen, Ewald Werner
wiley +1 more source
Solving Quantum Dynamics with a Lie-Algebra Decoupling Method
Quantum technologies rely on the control of quantum systems at the level of individual quanta. Mathematically, this control is described by Hamiltonian or Liouvillian evolution, requiring the application of various techniques to solve the resulting ...
Sofia Qvarfort, Igor Pikovski
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Numerical Exploration of Thermal Shock Resistance in MgO–C Refractories
A mesostructure‐resolved numerical framework is developed to evaluate the thermal shock resistance of MgO–C refractories. By modeling interface debonding under rapid temperature changes and introducing a modified thermal shock parameter that accounts for mesocracks, the study shows how graphite content and aggregate size influence thermal shock ...
Jishnu Vinayak Gopi +3 more
wiley +1 more source
Multimodal Data‐Driven Microstructure Characterization
A self‐consistent autonomous workflow for EBSP‐based microstructure segmentation by integrating PCA, GMM clustering, and cNMF with information‐theoretic parameter selection, requiring no user input. An optimal ROI size related to characteristic grain size is identified.
Qi Zhang +4 more
wiley +1 more source
The Decomposition of Lie Derivations
A linear mapping \(D\colon A\to E\) from an algebra \(A\) into an \(A\)-bimodule \(E\) is called a Lie derivation if \(D([a,b])=[a,D(b)]+[D(a),b]\) for all elements \(a,b\in A\). Every derivation \(d\colon A\to E\) is a Lie derivation, and so is every centre-valued trace \(\tau\); the latter is a linear mapping \(\tau\colon A\to E\) which takes its ...
openaire +2 more sources
Do not let thermal drift and instrument artifacts deceive high‐temperature nanoindentation results. We compare classical Oliver–Pharr and automatic image recognition analyses across steels and a Ni alloy to quantify these effects. Accounting for artifacts reveals systematic softening with temperature, while Cr and Ni additions boost resistance ...
Velislava Yonkova +2 more
wiley +1 more source
A novel workflow for investigating hydride vapor phase epitaxy for GaN bulk crystal growth is proposed. It combines Design of experiments (DoE) with physical simulations of mass transport and crystal growth kinetics, serving as an intermediate step between DoE and experiments.
J. Tomkovič +7 more
wiley +1 more source
Viktoriia Shtefan, Thorgund Nemec, Ute Hempel, Annett Gebert and coworkers demonstrate that anodic treatment of Ti–Cu‐based metallic glass in a nontoxic pyrophosphate electrolyte forms a protective bilayered Ti/Zr‐oxide film enriched with Cu nanocrystals.
Viktoriia Shtefan +8 more
wiley +1 more source
This plot compares experimental tensile stress–strain curves (with 4 different strain rates) and corresponding modelled curves (obtained using the optimised sets of Voce and Miller–Norton parameter values shown). The inferred M‐N values, characterizing the creep, are very similar to those obtained via conventional creep testing.
S. Ooi, R. P. Thompson, T. W. Clyne
wiley +1 more source

