Results 141 to 150 of about 2,583,949 (369)

Direct design of ground-state probabilistic logic using many-body interactions for probabilistic computing

Scientific Reports
In this work, an innovative design model aimed at enhancing the efficacy of ground-state probabilistic logic with a binary energy landscape (GSPL-BEL) is presented.
Yihan He, Sheng Luo, Chao Fang, Gengchiau Liang   +3 more
doaj   +1 more source

Methods of Class Field Theory to Separate Logics over Finite Residue Classes and Circuit Complexity [PDF]

, 2015
Argimiro Arratia, C. Pico
openalex   +1 more source

Recent Advances of Slip Sensors for Smart Robotics

Advanced Materials Technologies, EarlyView.
This review summarizes recent progress in robotic slip sensors across mechanical, electrical, thermal, optical, magnetic, and acoustic mechanisms, offering a comprehensive reference for the selection of slip sensors in robotic applications. In addition, current challenges and emerging trends are identified to advance the development of robust, adaptive,
Xingyu Zhang, Liao Wu, Shuai He, Zhao Sha, Yuwan Huang, Shuying Wu, Dewei Chu, Chun H. Wang, Shuhua Peng   +8 more
wiley   +1 more source

Development of the device for definition of the integrated circuits logic gain

Физика волновых процессов и радиотехнические системы, 2017
The relevance of the logical elements and integrated circuits logic gain is substantiated. The device for definition of the integrated circuits logic gain is offered.
S.V. Tyulevin, G.P. Shopin, M.N. Piganov, R.O. Mishanov   +3 more
doaj  

Integrated Logic Circuits Based on Wafer-Scale 2D-MoS₂ FETs Using Buried-Gate Structures. [PDF]

Nanomaterials (Basel), 2023
Lee JA, Yoon J, Hwang S, Hwang H, Kwon JD, Lee SK, Kim Y.   +6 more
europepmc   +1 more source

Fabric‐Based Wearable Robotic Exoskeleton Gloves: Advancements and Challenges

Advanced Materials Technologies, EarlyView.
This review highlights interdisciplinary technological advances in fabric‐based robotic gloves, focusing on progress in design, fabrication, actuation, sensing, control, and power and energy requirements. It also addresses performance testing and validation, including biomechanical, strength, functional, user experience, and durability assessments, to ...
Ayse Feyza Yilmaz, Gökhan Ince, Ozgur Atalay   +2 more
wiley   +1 more source

Generic logic block based on bias-gated 2D MoS2 transistors

Nature Communications
Integrating two-dimensional (2D) semiconductors and CMOS technology is a promising pathway for next-generation integrated circuits. However, the implementation of this strategy is hindered by the limited polarity modulation of 2D semiconductors and the ...
Xiaofu Wei, Zhangyi Chen, Kuanglei Chen, Jinsen Shang, Li Gao, He Jiang, Huihui Yu, Mengyu Hong, Xiankun Zhang, Zheng Zhang, Yue Zhang   +10 more
doaj   +1 more source

A Timing Fault Model and an Efficient Timing Fault Simulation Method for Rapid Single-Flux-Quantum Logic Circuits [PDF]

, 2021
Shōgo Nakamura, Kazuyoshi Takagi, Nobutaka Kito, Naofumi Takagi   +3 more
openalex   +1 more source

Enhanced Self‐Phase Modulation in Silicon Nitride Waveguides Integrated With 2D MoS2 Films

Advanced Materials Technologies, EarlyView.
ABSTRACT On‐chip integration of 2D materials provides a promising route toward next‐generation integrated optical devices with performance beyond existing limits. Here, significantly enhanced spectral broadening induced by self‐phase modulation (SPM) is experimentally demonstrated in silicon nitride (Si3N4) waveguides integrated with 2D monolayer ...
Shahaz S. Hameed, Di Jin, Aihao Zhao, Jiayang Wu, Junkai Hu, Irfan H. Abidi, Sebastien Cueff, Christian Grillet, Yuning Zhang, Houssein El Dirani, Corrado Sciancalepore, Sebastien Kerdiles, Quentin Wilmart, Sumeet Walia, Christelle Monat, David J. Moss   +15 more
wiley   +1 more source

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators

Advanced Materials Technologies, EarlyView.
An in situ electroplating approach for MEX 3D printing is proposed, enabling copper deposition during the fabrication of conductive polymers. The method combines a printer‐integrated plating head, ML‐based g‐code control, and stop‐and‐go printing, achieving near‐bulk copper conductivity and enabling fully embedded, assembly‐free electronic components ...
Gianluca Percoco, Nicola Larovere, Antonio Zagaria, Antonio Pavone, Rosanna Rifino, Gianni Stano   +5 more
wiley   +1 more source