Low cycle fatigue of thin-wall printed Onyx in energy absorption. [PDF]
Jimenez-Martinez M +2 more
europepmc +1 more source
Effect of Corroded Surface Morphology on Ultra-Low Cycle Fatigue of Steel Bridge Piers. [PDF]
Song F, Zhang T, Xie X.
europepmc +1 more source
Tunable Sensitivity in PAN/CNF/PEDOT:PSS Nanofiber‐Based Piezocapacitive Sensors
This study demonstrates highly tunable, flexible pressure sensors made from a nanofibrous composite of polyacrylonitrile (PAN) and carbon nanofibers (CNF) or poly(3,4‐ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS). By adjusting filler type, concentration, and mat thickness, the sensors achieve large sensitivity improvements, stable ...
Alireza Gholamhoseini +4 more
wiley +1 more source
Molecular Dynamics Simulation of Low-Cycle Fatigue Behavior of Single/Polycrystalline Iron. [PDF]
Zhang T, Zhou J, Shen J.
europepmc +1 more source
Experimental and Numerical Study of Combined High and Low Cycle Fatigue Performance of Low Alloy Steel and Engineering Application. [PDF]
Tang Z +5 more
europepmc +1 more source
Inverter and Low Cycle Fatigue
Masanari Fujita, Kenzo Miura
openaire +2 more sources
Spectroscopic ellipsometry in the Kretschmann‐Raether configuration (KRSE) is employed to characterize a DNA‐functionalized platform for viral sequence recognition. By merging SE with surface plasmon resonance, KRSE outperforms conventional SE, achieving nanomolar targeting through resonance wavelength shifts (δλ) measurements. Its enhanced interfacial
Silvia Maria Cristina Rotondi +4 more
wiley +1 more source
The Low-Cycle Fatigue Behavior of a High-Strength Low-Alloy Steel Subjected to Tempforming. [PDF]
Dolzhenko A +4 more
europepmc +1 more source
The Low-Cycle Fatigue Behavior, Failure Mechanism and Prediction of SLM Ti-6Al-4V Alloy with Different Heat Treatment Methods. [PDF]
Xi J +6 more
europepmc +1 more source
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source

