Results 221 to 230 of about 408,318 (360)

Low cycle fatigue of thin-wall printed Onyx in energy absorption. [PDF]

open access: yesHeliyon
Jimenez-Martinez M   +2 more
europepmc   +1 more source

Tunable Sensitivity in PAN/CNF/PEDOT:PSS Nanofiber‐Based Piezocapacitive Sensors

open access: yesAdvanced Materials Interfaces, EarlyView.
This study demonstrates highly tunable, flexible pressure sensors made from a nanofibrous composite of polyacrylonitrile (PAN) and carbon nanofibers (CNF) or poly(3,4‐ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS). By adjusting filler type, concentration, and mat thickness, the sensors achieve large sensitivity improvements, stable ...
Alireza Gholamhoseini   +4 more
wiley   +1 more source

Inverter and Low Cycle Fatigue

open access: yesJournal of The Japan Institute of Marine Engineering, 2009
Masanari Fujita, Kenzo Miura
openaire   +2 more sources

Label‐Free Sensing of Coronaviral Sequences via Kretschmann‐Configuration Reflectance Spectroscopic Ellipsometry: Sensitivity, Specificity, and Interfacial Effects

open access: yesAdvanced Materials Interfaces, EarlyView.
Spectroscopic ellipsometry in the Kretschmann‐Raether configuration (KRSE) is employed to characterize a DNA‐functionalized platform for viral sequence recognition. By merging SE with surface plasmon resonance, KRSE outperforms conventional SE, achieving nanomolar targeting through resonance wavelength shifts (δλ) measurements. Its enhanced interfacial
Silvia Maria Cristina Rotondi   +4 more
wiley   +1 more source

The Low-Cycle Fatigue Behavior of a High-Strength Low-Alloy Steel Subjected to Tempforming. [PDF]

open access: yesMaterials (Basel)
Dolzhenko A   +4 more
europepmc   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

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