Results 211 to 220 of about 541,541 (258)
Some of the next articles are maybe not open access.
Study of Material Removal Rate Process Parameter in WEDM
International Journal of Materials Manufacturing and Sustainable Technologies, 2022Wire cut Electrical Discharge Machining is known as nontraditional machining process. It has broad application in complex part or geometry machining. It is known as a non-contact process. The main objective of this research work is to investigate the influence of process parameters of Wire cut Electrical-Discharge Machining in material removal rate ...
Amit Kumar +4 more
openaire +1 more source
Material removal rate in polishing anisotropic monocrystalline materials for optoelectronics
Journal of Superhard Materials, 2016Based on investigations of the mechanism of precision surface formation in workpieces of anisotropic monocrystalline materials for optoelectronics, a generalized model of material removal in polishing with suspensions of polishing powders has been constructed.
O. Yu. Filatov +4 more
openaire +1 more source
Assist control for finishing process considering material removal rate
2011 15th International Conference on Advanced Robotics (ICAR), 2011In high-variety low-volume manufacturing, parts are typically processed by handwork in order to minimize production cost and lead time. However, when a precise finishing process is required, handwork has problems of processing error and insufficient processing accuracy.
Ken'ichi Yano +2 more
openaire +1 more source
Chemical Effect on the Material Removal Rate in the CMP of Silicon Wafers
Advanced Materials Research, 2010This paper investigates the effects of some chemical factors on the material removal rate (MRR) in chemo-mechanical polishing (CMP) of Si (100) wafers. The CMP was carried out in alkaline slurry using alumina and ceria particles with hydrogen peroxide.
Y.G. Wang, L.C. Zhang, A. Biddut
openaire +1 more source
The Material Removal Rate of Metal Polishing Process
2009The objective of this research is to better understand the mechanisms of material removal in the polishing process. This study is aimed to establish a material removal rate model for metal polishing to predict the result of metal polishing process.
Yeau-Ren Jeng, Pay-Yau Huang
openaire +1 more source
Increase of material removal rate in peripheral milling by varying feed rate
Journal of Materials Processing Technology, 2008A new cutting method is proposed for the milling of metals by means of a double stage feed drive mechanism. This design combines the long stroke motion provided by a ball screw feed drive and a fine motion provided by a piezo actuator. The piezo actuator exerts a fluctuating displacement on a flexure platform where the workpiece is clamped.
H. Pérez, J. Rios, E. Díez, A. Vizán
openaire +1 more source
Analysis of the Material Removal Rate of Micro-Hole Machining of Ceramic Materials
Advanced Materials Research, 2011This study discussed what rotary ultrasonic machining (RUM) and tool geometry parameters combination can obtain bigger material removal rate (MRR) in drilling. The experimental configuration of this study was planned using Taguchi orthogonal array, where the drill diameter, rotation speed, power and feed rate were taken as the experimental factors.
Shu Lung Wang, Ting Yu Chueh
openaire +1 more source
Materials Today: Proceedings, 2021
Abstract This investigation reveals the paradigm of EDM in this experiment to expel the metal from Al7075 with a performed Copper electrode. Aluminium7075 has the most elevated quality, higher firmness, and diminished thickness. Aluminium7075 is utilized prevalently in exceedingly focused on applications, for example, brackets, milk churns, mineral ...
L. Selvarajan +4 more
openaire +1 more source
Abstract This investigation reveals the paradigm of EDM in this experiment to expel the metal from Al7075 with a performed Copper electrode. Aluminium7075 has the most elevated quality, higher firmness, and diminished thickness. Aluminium7075 is utilized prevalently in exceedingly focused on applications, for example, brackets, milk churns, mineral ...
L. Selvarajan +4 more
openaire +1 more source
Precision Measurements Of Material-Removal Rates In Superpolishing Sapphire
SPIE Proceedings, 1989As we demonstrate, sapphire can be polished by means of colloidal SiO2 (7 nmφ) in water by direct contact to a tin lap to a residual roughness better than 0.3 nm Rz measured with a Talystep profilometer. We use the superpolishing mechanism itself for producing microscopically smooth grooves which can serve for a precision measurement of the very small ...
B. Hader, O. Weis
openaire +1 more source
Equivolumetric offsets for 2D machining with constant material removal rate
Computer Aided Geometric Design, 2008zbMATH Open Web Interface contents unavailable due to conflicting licenses.
openaire +2 more sources