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, 2020
Fused silica is widely used as a substrate material in various optical precision devices, and its surface quality plays a significant role in determining the optical performance. However, it is difficult to achieve an ultra-smooth surface without obvious
Xiaolei Shi +8 more
semanticscholar +1 more source
Fused silica is widely used as a substrate material in various optical precision devices, and its surface quality plays a significant role in determining the optical performance. However, it is difficult to achieve an ultra-smooth surface without obvious
Xiaolei Shi +8 more
semanticscholar +1 more source
Materials Today: Proceedings, 2020
This paper outlines the impact of abrasive water jet control variables such as cutting speed and abrasive flow rate on material removal rate during abrasive water jet machining of GFRP composites.
D. Tripathi +4 more
semanticscholar +1 more source
This paper outlines the impact of abrasive water jet control variables such as cutting speed and abrasive flow rate on material removal rate during abrasive water jet machining of GFRP composites.
D. Tripathi +4 more
semanticscholar +1 more source
Assist control for finishing process considering material removal rate
2011 15th International Conference on Advanced Robotics (ICAR), 2011In high-variety low-volume manufacturing, parts are typically processed by handwork in order to minimize production cost and lead time. However, when a precise finishing process is required, handwork has problems of processing error and insufficient processing accuracy.
Ken'ichi Yano +2 more
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Material Removal Rate Prediction using the Classification-Regression Approach
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 2020Chemical Mechanical Polishing (CMP) is one of the most critical process step in the fabrication of advanced packages, such as Fanout Wafer Level Packaging (FOWLP). CMP process requires tight and dynamic control of process parameters to achieve palnarization, high quality and reliability of organic or in-organic redistribution layer (RDL) surface ...
Kart-Leong Lim, Rahul Dutta
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Wear, 2019
Chemical mechanical planarization (CMP) is a high-precision and complex manufacturing process that removes material with chemical and mechanical forces in order to achieve highly planar surfaces.
Tianyu Yu, Zhixiong Li, Dazhong Wu
semanticscholar +1 more source
Chemical mechanical planarization (CMP) is a high-precision and complex manufacturing process that removes material with chemical and mechanical forces in order to achieve highly planar surfaces.
Tianyu Yu, Zhixiong Li, Dazhong Wu
semanticscholar +1 more source
Materials Today: Proceedings, 2020
Taguchi technique was employed to find out the optimal cutting parameters in face milling operation of AISI 1005 steel using TiN coated tool. Three cutting parameters i.e.
Sunil Kumar +2 more
semanticscholar +1 more source
Taguchi technique was employed to find out the optimal cutting parameters in face milling operation of AISI 1005 steel using TiN coated tool. Three cutting parameters i.e.
Sunil Kumar +2 more
semanticscholar +1 more source
Journal of manufacturing science and engineering, 2019
Chemical mechanical planarization (CMP) has been widely used in the semiconductor industry to create planar surfaces with a combination of chemical and mechanical forces.
Zhixiong Li, Dazhong Wu, Tianyu Yu
semanticscholar +1 more source
Chemical mechanical planarization (CMP) has been widely used in the semiconductor industry to create planar surfaces with a combination of chemical and mechanical forces.
Zhixiong Li, Dazhong Wu, Tianyu Yu
semanticscholar +1 more source
Grey Systems Theory and Application, 2020
This research explores the finite element modeling of the crater and material removal rate (MRR) in micro-electrical discharge machining (micro-EDM) with and without vibration of the workpiece.
M. Choubey, K. Maity, Abhishek Sharma
semanticscholar +1 more source
This research explores the finite element modeling of the crater and material removal rate (MRR) in micro-electrical discharge machining (micro-EDM) with and without vibration of the workpiece.
M. Choubey, K. Maity, Abhishek Sharma
semanticscholar +1 more source
Modeling of Material Removal Rate in Micro-ECG Process
Journal of Manufacturing Science and Engineering, 2008Microelectrochemical grinding (micro-ECG) is a variant of electrochemical grinding (ECG) process, in which material is removed by a combination of electrolytic dissolution and abrasive action that take place in a small interelectrode gap. This paper discusses analytical modeling of the material removal phenomenon in micro-ECG process to predict ...
GAIKWAD, KS, JOSHI, SS
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The Material Removal Rate of Metal Polishing Process
2009The objective of this research is to better understand the mechanisms of material removal in the polishing process. This study is aimed to establish a material removal rate model for metal polishing to predict the result of metal polishing process.
Yeau-Ren Jeng, Pay-Yau Huang
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