Results 301 to 310 of about 3,143,235 (349)
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Modeling Material Removal Rates for Copper CMP Using Copper Nanohardness and Etch Rates
Journal of The Electrochemical Society, 2008Measurements of copper nanohardness and etch rate were used with alumina agglomerate size distributions in a model to predict material removal rates (MRRs), which were then compared to experimental copper chemical mechanical planarization (CMP) data.
Robin Ihnfeldt, Jan B. Talbot
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Materials Today: Proceedings, 2019
This investigation was planned to get the optimized material removal rate and surface finish of Wire Cut Electric Discharge Machining (WEDM) on Inconel 750 by taking into consideration of four input factors such as Pulse On, Pulse Off, Voltage and ...
K. N. Babu, R. Karthikeyan, A. Punitha
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This investigation was planned to get the optimized material removal rate and surface finish of Wire Cut Electric Discharge Machining (WEDM) on Inconel 750 by taking into consideration of four input factors such as Pulse On, Pulse Off, Voltage and ...
K. N. Babu, R. Karthikeyan, A. Punitha
semanticscholar +1 more source
An Intelligent Approach for High Material Removal Rate Machining
2013Machining is one of the most important manufacturing processes. Material removal rate (MRR) is a crucial issue in machining, but it is limited by machining stability lobe which depends on cutting dynamics. This chapter investigates an intelligent approach for increasing MRR.
Jhy-Cherng Tsai, Shen-Jhy Wang
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International Journal of Ambient Energy, 2019
Micro-electrical discharge machining (Micro-EDM) is a micro-machining process in which miniaturised and precision parts/components are manufactured with good dimensional accuracy and fine surface finish.
P. Sivaprakasam +2 more
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Micro-electrical discharge machining (Micro-EDM) is a micro-machining process in which miniaturised and precision parts/components are manufactured with good dimensional accuracy and fine surface finish.
P. Sivaprakasam +2 more
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Modeling Material Removal Rate of Heavy Belt-Grinding in Manufacturing of U71Mn Material
Key Engineering Materials, 2016The heavy belt-grinding is a new machining method, which combined the characters of heavy-duty grinding and belt-grinding together, with high efficiency and low cost. In the present paper the removal rate model of heavy belt-grinding in manufacturing of U71Mn steel is established. It is assumed that the distribution of the abrasive particles protrusion
Rong Quan Wang +3 more
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International Journal of Refractory Metals and Hard Materials, 2019
Most of the reported studies on the optimization of grinding parameters do not consider the evolution of the surface topography of grinding wheels, and the established empirical models will no longer apply when the surface conditions of the grinding ...
Yuzhou Zhang, Xipeng Xu
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Most of the reported studies on the optimization of grinding parameters do not consider the evolution of the surface topography of grinding wheels, and the established empirical models will no longer apply when the surface conditions of the grinding ...
Yuzhou Zhang, Xipeng Xu
semanticscholar +1 more source
Analysis of the Material Removal Rate of Micro-Hole Machining of Ceramic Materials
Advanced Materials Research, 2011This study discussed what rotary ultrasonic machining (RUM) and tool geometry parameters combination can obtain bigger material removal rate (MRR) in drilling. The experimental configuration of this study was planned using Taguchi orthogonal array, where the drill diameter, rotation speed, power and feed rate were taken as the experimental factors.
Shu Lung Wang, Ting Yu Chueh
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Materials Science in Semiconductor Processing, 2019
Single crystal silicon is the basic material for the fabrication of micro-devices and micro-structures. It exhibits plastic behavior in micro/nano-machining.
Mengran Ge, H. Zhu, P. Ge, Cheng Zhang
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Single crystal silicon is the basic material for the fabrication of micro-devices and micro-structures. It exhibits plastic behavior in micro/nano-machining.
Mengran Ge, H. Zhu, P. Ge, Cheng Zhang
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Tribological approaches to material removal rate during chemical mechanical polishing
Metals and Materials International, 2013In this study, the effect of the friction and wear of a polishing pad on the material removal rate of a silicon oxide wafer was investigated during chemical mechanical polishing (CMP) with ceria slurry. Further, the effect of surface properties of the polishing pad, such as surface roughness and hardness, on the variation in the material removal rate ...
Hong Jin Kim +5 more
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