Results 241 to 250 of about 199,635 (304)

Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation

open access: yesAdvanced Science, EarlyView.
Vertically aligned graphene microstrip pads (GMPs) break the traditional thermomechanical trade‐off in thermal interface materials. It simultaneously achieves an ultrahigh through‐plane thermal conductivity of 565.92 W m−1 K−1 and an ultralow compressive modulus below 115.16 kPa.
Xu Ran   +7 more
wiley   +1 more source

Organoid Brain‐Machine‐Interface Devices for Central Nervous System Repair

open access: yesAdvanced Science, EarlyView.
We envision organoid brain‐machine‐interface (Organoid‐BMI) devices as new biohybrid bidirectional communication pathways to connect the human CNS and the external world for personalized CNS repair and regeneration. ABSTRACT Central nervous system (CNS) repair and regeneration suffer from tremendous clinical challenges due to current limitations in ...
Yantao Xing   +10 more
wiley   +1 more source

Impedance‐Matched High‐Overtone Thickness‐Shear Bulk Acoustic Resonators With Scalable Mode Volume

open access: yesAdvanced Science, EarlyView.
A bottom‐electrode‐free high‐overtone bulk acoustic resonator is achieved by lateral excitation of antisymmetric thickness‐shear modes on a lithium‐niobate‐on‐silicon platform. Planar electrode geometry eliminates conventional loading along the resonance path and confines acoustic energy within the electrode gap.
Zi‐Dong Zhang   +7 more
wiley   +1 more source

Micromechanical Prediction of Elastic Properties of Unidirectional Glass and Carbon Fiber-Reinforced Epoxy Composites Using the Halpin-Tsai Model. [PDF]

open access: yesPolymers (Basel)
Zengah S   +7 more
europepmc   +1 more source

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