Results 211 to 220 of about 11,011 (260)

Electrodeposition of Metal Nanoclusters

ECS Meeting Abstracts
Here we describe the electrodeposition of Au nanoclusters in the 1-2 nm diameter range directly on indium tin oxide coated glass electrodes (glass/ITO) by reduction of Au ionic complexes in the presence of phosphine stabilizers. Anodic stripping voltammetry and UV-vis spectroscopy determines the size and coverage of the Au nanoclusters. The coverage
Francis Zamborini, Binu Thapa
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A consideration of the electrodeposition of metals

Surface Technology, 1979
Abstract The chemical factors affecting the electrodeposition of metals are surveyed briefly. Molten salts are not considered, but depositions from aqueous and non-aqueous systems are compared. As examples, the depositions of aluminium, copper and nickel from trifluoroacetates in various organic solvents (aliphatic alcohols, formamide, N,N ...
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Controlling the electrodeposition of mesoporous metals for nanoplasmonics

Nanoscale, 2009
We have investigated the mechanism for formation of large-scale ordered structures of copper and silver by direct electrodeposition through colloidal crystal templates. It is demonstrated that the morphology is controlled by the diffusion of reactant species (metal cations and oxygen molecules) from the bulk solution to the electrode surface.
Rong, Zhu, Martyn, McLachlan, Steve, Reyntjens, Farid, Tariq, Mary P, Ryan, David W, McComb   +5 more
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Fabrication of Nanoelectrodes and Metal Clusters by Electrodeposition

ChemPhysChem, 2010
AbstractMost nanometer‐sized electrodes reported to date are made from either Pt or Au. For technical reasons, it is difficult to make nanoelectrodes from many other metals (e.g. Hg) by heat‐sealing microwires into glass capillaries or by other established techniques.
Jeyavel, Velmurugan, Michael V, Mirkin
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Electrorefining and Electrodeposition of Metals

1985
Copper is found in nature as the metal and in various types of ore such as oxide, hydroxide, carbonate, sulfide, and in mixtures and double salts of these compounds. Of these, the sulfide ore, chalcopyrite Cu2S • FeS • FeS2, is commonly used in Japan. Figure 10.1 illustrates an example of the flowsheet for copper concentrate processing.
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Studies in the Discontinuities in Electrodeposited Metallic Coatings

Transactions of the IMF, 1950
SummarySome possible causes of discontinuities in nickel and cobalt deposits have been investigated. The results suggest that neither hydrogen bubbles clinging to the surface of the cathode, nor impurities present on the surface of the basis metal (including those deposited from the electrolyte during electrolysis) can be main causes of pores.
S. C. Shome, U. R. Evans
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The electrodeposition of metal at metal/carbon nanotube junctions

Chemical Physics Letters, 2002
Abstract We deposited a semiconducting single-walled carbon nanotube on Pd electrodes, and the initial charge transport measurements showed the usual large contact resistance between the electrodes and the nanotube. We electroplated Au over the electrodes with no obvious deposition of Au along the sidewalls of the nanotube between the electrodes ...
Derek W. Austin, Alex A. Puretzky, David B. Geohegan, Phillip F. Britt, Michael A. Guillorn, Michael L. Simpson   +5 more
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Electrodeposition of Metals and Metal Oxides into Nanoporous Gold

ECS Meeting Abstracts, 2017
Nanoporous gold (NPG) is usually fabricated by the selective electrolytic dissolution (dealloying) of Ag from a binary Ag-Au alloy, or sometimes from a ternary alloy such as Ag-Au-Pt. The resulting ligament-pore structure is bicontinuous and has an extraordinarily high surface area-to-volume ratio, posing it as a promising candidate for catalyst ...
Ayman A. El-Zoka, Anatolie G Carcea, Mahmoud Ghaznavi, Roger C. Newman   +3 more
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Fundamentals of Electrodeposition of Metals

1995
The atomistic aspects of electrochemical metal deposition on foreign substrates are discussed considering the transition from single adatoms via two-dimensional (2-D) adlayers to nucleation and crystal growth of the three-dimensional (3-D) metal bulk phase.
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Electrodeposition of metal powders

Surface Technology, 1981
Aurelian Calusaru, Allan H. Reed
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